JPS6440176U - - Google Patents
Info
- Publication number
- JPS6440176U JPS6440176U JP13610087U JP13610087U JPS6440176U JP S6440176 U JPS6440176 U JP S6440176U JP 13610087 U JP13610087 U JP 13610087U JP 13610087 U JP13610087 U JP 13610087U JP S6440176 U JPS6440176 U JP S6440176U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- connector
- circuit board
- printed circuit
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Description
第1図は本考案の実施例、第2図は本考案の他
の実施例を示す図、第3図は従来技術の説明図で
ある。
第1図において、1はコネクタ本体、2はコネ
クタリード、3はプリント基板、4は補強板、5
はコネクタ固定用凹凸状パツド、6,8は接着剤
、7はコネクタリード先端部、9は回路構成用パ
ツド、12はコネクタ本体底部である。
FIG. 1 is an embodiment of the present invention, FIG. 2 is a diagram showing another embodiment of the present invention, and FIG. 3 is an explanatory diagram of the prior art. In Figure 1, 1 is the connector body, 2 is the connector lead, 3 is the printed circuit board, 4 is the reinforcing plate, and 5
Reference numerals denote uneven pads for fixing the connector, 6 and 8 are adhesives, 7 is the tip of the connector lead, 9 is a pad for circuit configuration, and 12 is the bottom of the connector body.
Claims (1)
4の位置に対応するプリント基板3上の位置に凹
凸状パツド5を、コネクタリード2の先端部7の
位置に対応するプリント基板3上の位置にパツド
9を、それぞれ設け、 上記補強板4と凹凸状パツド5を接着剤6で固
定すると共に上記コネクタリード先端部7と、パ
ツド9を接着剤8で固定したことを特徴とするコ
ネクタのプリント基板固定構造。[Claim for Utility Model Registration] An uneven pad 5 is placed at a position on the printed circuit board 3 corresponding to the position of the reinforcing plate 4 attached to the bottom part 12 of the connector body 1, and a concave-convex pad 5 is placed at a position corresponding to the position of the tip end 7 of the connector lead 2. A pad 9 is provided at each position on the printed circuit board 3, and the reinforcing plate 4 and the uneven pad 5 are fixed with an adhesive 6, and the connector lead tip 7 and the pad 9 are fixed with an adhesive 8. Features a printed circuit board fixing structure of the connector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13610087U JPS6440176U (en) | 1987-09-04 | 1987-09-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13610087U JPS6440176U (en) | 1987-09-04 | 1987-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6440176U true JPS6440176U (en) | 1989-03-09 |
Family
ID=31396294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13610087U Pending JPS6440176U (en) | 1987-09-04 | 1987-09-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6440176U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998042044A1 (en) * | 1997-03-18 | 1998-09-24 | Rohm Co., Ltd. | Connector |
JP2006140052A (en) * | 2004-11-12 | 2006-06-01 | Three M Innovative Properties Co | Connector with thermosetting adhesive film and method of connection using it |
-
1987
- 1987-09-04 JP JP13610087U patent/JPS6440176U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998042044A1 (en) * | 1997-03-18 | 1998-09-24 | Rohm Co., Ltd. | Connector |
JP2006140052A (en) * | 2004-11-12 | 2006-06-01 | Three M Innovative Properties Co | Connector with thermosetting adhesive film and method of connection using it |
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