JPH0274788U - - Google Patents
Info
- Publication number
- JPH0274788U JPH0274788U JP15361188U JP15361188U JPH0274788U JP H0274788 U JPH0274788 U JP H0274788U JP 15361188 U JP15361188 U JP 15361188U JP 15361188 U JP15361188 U JP 15361188U JP H0274788 U JPH0274788 U JP H0274788U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- contact element
- connection structure
- communicates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図および第２図は本考案に係る回路基板の
接続構造を示す断面図と斜視図、第３図ａ〜ｅは
同じく本考案における回路基板同士を接続する方
法を説明するための断面図、第４図は従来の回路
基板の接続構造を示す斜視図である。
１１，１２…高厚プリント基板、１３，１４…
スルーホール、１５，１６…通孔、１７…接触子
、１８…半田。
1 and 2 are cross-sectional views and perspective views showing a circuit board connection structure according to the present invention, and FIGS. 3 a to 3 e are cross-sectional views illustrating a method for connecting circuit boards according to the present invention. , FIG. 4 is a perspective view showing a conventional circuit board connection structure. 11, 12...High thickness printed circuit board, 13, 14...
Through hole, 15, 16...through hole, 17...contact, 18...solder.
Claims (1)
を接続する構造において、前記回路基板に側端面
に開口しかつ前記スルーホールに連通する通孔を
設け、これら通孔内にその各端部が前記スルーホ
ールと接続する接触子を装着し、この接触子は先
端部が前記スルーホール内に臨む接触子によつて
構成されていることを特徴とする回路基板の接続
構造。 In a structure for connecting circuit boards having through holes at their edges, a through hole is provided in the circuit board that opens on a side end face and communicates with the through hole, and each end of the circuit board is inserted into the through hole through the through hole. 1. A connection structure for a circuit board, characterized in that a contact element connected to the hole is attached, and the contact element has a tip end facing into the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15361188U JPH0274788U (en) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15361188U JPH0274788U (en) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0274788U true JPH0274788U (en) | 1990-06-07 |
Family
ID=31429611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15361188U Pending JPH0274788U (en) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0274788U (en) |
-
1988
- 1988-11-28 JP JP15361188U patent/JPH0274788U/ja active Pending