JPH01164035A - Semiconductor manufacturing apparatus - Google Patents
Semiconductor manufacturing apparatusInfo
- Publication number
- JPH01164035A JPH01164035A JP62323500A JP32350087A JPH01164035A JP H01164035 A JPH01164035 A JP H01164035A JP 62323500 A JP62323500 A JP 62323500A JP 32350087 A JP32350087 A JP 32350087A JP H01164035 A JPH01164035 A JP H01164035A
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- stage
- semiconductor substrate
- organic solvent
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 239000012530 fluid Substances 0.000 claims abstract description 5
- 238000007664 blowing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Sheets, Magazines, And Separation Thereof (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造装置に関し、特に有機溶剤塗布装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor manufacturing equipment, and particularly to organic solvent coating equipment.
従来、この種の塗布装置は第３図に示されるように支持
軸３ａ上に設けられたステージ３ｂに半導体基板を載せ
吸着させ、これを回転させながら有機溶剤を塗布する。Conventionally, in this type of coating apparatus, as shown in FIG. 3, a semiconductor substrate is placed on a stage 3b provided on a support shaft 3a, and the semiconductor substrate is adsorbed thereon, and an organic solvent is applied while rotating the semiconductor substrate.
このとき、有機溶剤の裏面廻り込みを防止するためにス
テージ３ｂの外周縁に向けて図示しない吹出ノズルより
ガスを吹き付けていた。At this time, gas was blown from a blow-off nozzle (not shown) toward the outer periphery of the stage 3b in order to prevent the organic solvent from going around the back surface.
上述した従来の塗布装置は裏面への廻り込み防止用のガ
ス源が必要となり、常時ガスを出していると塗布剤の再
まき上げを起こすという欠点があり、また、ガスを必要
時のみ吹き付けるようにするためには、ガス流量コント
ロール装置が必要となるという欠点がある。The conventional coating device described above requires a gas source to prevent the coating agent from going around to the back side, and has the disadvantage that if the gas is constantly emitted, the coating agent will be blown up again. There is a drawback that a gas flow rate control device is required to achieve this.
本発明の目的は前記問題点を解消した半導体製造装置を
提供することにある。An object of the present invention is to provide a semiconductor manufacturing apparatus that eliminates the above-mentioned problems.
上述した従来の塗布装置に対し、本発明は裏面廻り込み
防止用ガスを必要としないという相違点を有する。The present invention differs from the above-mentioned conventional coating device in that it does not require gas for preventing gas from going around to the back side.
本発明は半導体基板上に有機溶剤を塗布する装置におい
て、半導体基板を装着するチャックに、該チャックの回
転に伴いチャックの外周縁側に向かう流体の流れを生じ
させる空気吹出部を有することを特徴とする半導体製造
装置である。The present invention provides an apparatus for applying an organic solvent onto a semiconductor substrate, characterized in that the chuck on which the semiconductor substrate is mounted has an air blowing part that causes a flow of fluid toward the outer peripheral edge of the chuck as the chuck rotates. This is semiconductor manufacturing equipment.
以下１本発明の実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
（実施例１） 第１図は本発明の実施例１を示す図である。(Example 1) FIG. 1 is a diagram showing a first embodiment of the present invention.
図において、１は半導体基板を装着するチャックであり
、該チャック１はステージ１ａと、該ステージ１ａを支
持する支持軸１ｂとからなる。In the figure, reference numeral 1 denotes a chuck for mounting a semiconductor substrate, and the chuck 1 consists of a stage 1a and a support shaft 1b that supports the stage 1a.
本発明は支持軸１ｂの周面からステージ１ａの裏面にか
けて螺旋状の溝１ｃ、 ｌｃ・・・を刻設し、政情１ｃ
の終端をステージ１ａの周方向に向けて開口し、チャッ
ク１の回転に伴いステージ１ａの外周縁側に向かう流体
の流れを生じさせる空気吹出部を形成したものである。In the present invention, spiral grooves 1c, lc... are carved from the circumferential surface of the support shaft 1b to the back surface of the stage 1a, and political conditions 1c are formed.
The terminal end thereof is opened toward the circumferential direction of the stage 1a, and an air blowing portion is formed that causes a flow of fluid toward the outer peripheral edge of the stage 1a as the chuck 1 rotates.
実施例において、有機溶剤を塗布する際のチャック１の
回転により支持軸１ｂの溝１ｃに空気を巻き込み、溝１
ｃに通してステージ１ａの裏面に空気の流れを生じさせ
、チャック１上のｊ−導体基板の裏面に空気が流れ出る
ようにしている。この空気の流れにより、有機溶剤が半
導体基板の裏面にまわり込むのを防止している。In the embodiment, air is drawn into the groove 1c of the support shaft 1b by the rotation of the chuck 1 when applying the organic solvent, and the groove 1
A flow of air is generated on the back surface of the stage 1a through the chuck 1, so that the air flows out onto the back surface of the J-conductor substrate on the chuck 1. This air flow prevents the organic solvent from getting around to the back surface of the semiconductor substrate.
（実施例２） 第２図は本発明の実施例２の縦断面図である。(Example 2) FIG. 2 is a longitudinal sectional view of Example 2 of the present invention.
本実施例は、半導体基板をステージに載せてチャック１
を反時計廻りに回転させることにより支持軸１ｂに設け
られた空気取入口１ｄに空気を巻き込み、支持軸ｌｂ内
の気孔１ｅ及びステージｌ日中の気孔１ｆを経て、ステ
ージ１ａの周面に設けた空気流出口１ｇから放出して空
気の流れを生じさせ、半導体基板の裏面への有機溶剤の
廻り込みを防止するものである。In this example, the semiconductor substrate is placed on the stage and the chuck 1 is
By rotating counterclockwise, air is drawn into the air intake port 1d provided in the support shaft 1b, passes through the pore 1e in the support shaft 1b and the pore 1f in the stage I, and then the air is drawn into the air intake port 1d provided on the circumferential surface of the stage 1a. The organic solvent is discharged from the air outlet 1g to generate an air flow and prevent the organic solvent from going around to the back surface of the semiconductor substrate.
以上説明したように本発明は有機溶剤の塗布時に半導体
基板をチャックに載せて回転させた際に、半導体基板の
裏面に向けた気体の流れを生じさせるため、有機溶剤の
裏面への廻り込みを防止することができ、しかも裏面へ
の廻り込みを防止するためのガス及びそのコントロール
装置が不要となるという効果を有するものである。As explained above, the present invention generates a gas flow toward the back side of the semiconductor substrate when the semiconductor substrate is placed on a chuck and rotated during application of the organic solvent, thereby preventing the organic solvent from going around to the back side. This has the effect of eliminating the need for gas and its control device to prevent gas from going around to the back surface.
第１図は本発明の実施例１を示す斜視図、第２図は本発
明の実施例２を示す斜視図、第３図は従来例を示す斜視
図である。
１・・・チャック １ａ・・・ステージ■ｂ
・・・支持軸 １ｃ・・・溝１ｄ・・・空気
取入口 １ｅ、ｉｆ・・・気孔１ｇ・・・空気
流出口1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment of the present invention, and FIG. 3 is a perspective view showing a conventional example. 1...Chuck 1a...Stage ■b
...Support shaft 1c...Groove 1d...Air intake 1e, if...Stomata 1g...Air outlet
Claims (1)
、半導体基板を装着するチャックに、該チャックの回転
に伴いチャックの外周縁側に向かう流体の流れを生じさ
せる空気吹出部を有することを特徴とする半導体製造装
置。(1) An apparatus for applying an organic solvent onto a semiconductor substrate, characterized in that the chuck on which the semiconductor substrate is mounted has an air blowing part that causes a flow of fluid toward the outer peripheral edge of the chuck as the chuck rotates. semiconductor manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62323500A JPH01164035A (en) | 1987-12-21 | 1987-12-21 | Semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62323500A JPH01164035A (en) | 1987-12-21 | 1987-12-21 | Semiconductor manufacturing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01164035A true JPH01164035A (en) | 1989-06-28 |
Family
ID=18155382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62323500A Pending JPH01164035A (en) | 1987-12-21 | 1987-12-21 | Semiconductor manufacturing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01164035A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100757848B1 (en) * | 2006-06-16 | 2007-09-11 | 세메스 주식회사 | Apparatus of treating a substrate in a single wafer type |
-
1987
- 1987-12-21 JP JP62323500A patent/JPH01164035A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100757848B1 (en) * | 2006-06-16 | 2007-09-11 | 세메스 주식회사 | Apparatus of treating a substrate in a single wafer type |
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