JP2575959B2 - Rotary coating device - Google Patents

Rotary coating device

Info

Publication number
JP2575959B2
JP2575959B2 JP3535091A JP3535091A JP2575959B2 JP 2575959 B2 JP2575959 B2 JP 2575959B2 JP 3535091 A JP3535091 A JP 3535091A JP 3535091 A JP3535091 A JP 3535091A JP 2575959 B2 JP2575959 B2 JP 2575959B2
Authority
JP
Japan
Prior art keywords
substrate
rectifying
wafer
spin
rectifying member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3535091A
Other languages
Japanese (ja)
Other versions
JPH04247264A (en
Inventor
学 矢部
泰史 道元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP3535091A priority Critical patent/JP2575959B2/en
Publication of JPH04247264A publication Critical patent/JPH04247264A/en
Application granted granted Critical
Publication of JP2575959B2 publication Critical patent/JP2575959B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、遠心力を用いて塗布液
を基板表面に均一にコーティングするための回転塗布装
置(スピンコート機)に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin coating apparatus (spin coating machine) for uniformly coating a substrate surface with a coating solution using centrifugal force.

【0002】[0002]

【従来の技術】スピンコート機は、半導体基板、液晶用
ガラスなどのガラス基板、セラミックス基板等の表面に
たとえばフォトレジスト液、現像液、エッチング液、液
体ドーパント液などを塗布し、基板を回転させて塗布液
を基板表面に均一にコーティングする装置である。
2. Description of the Related Art A spin coater applies a photoresist solution, a developing solution, an etching solution, a liquid dopant solution or the like to a surface of a semiconductor substrate, a glass substrate such as a glass for liquid crystal, a ceramic substrate or the like, and rotates the substrate. This is a device that uniformly coats the substrate surface with a coating liquid.

【0003】従来、この種の装置としては、たとえば図
6に示す断面図(特開昭63−777569号公報)、
または図7に示す断面図のものなどが提案されている。
図6において、1は基板の一例として半導体基板である
シリコンなどのウエハ、2はスピンチャック3を介して
ウエハ1を回転させるためのスピンドル、3はウエハを
保持するためのスピンチャック、14はウエハ1の下方
に備えられウエハ1の下方における気流を整えるための
整流手段である環状の部材からなる整流部材、8は回転
機構および回転するウエハ1を囲うようにして設けられ
たスピンカップ、9はウエハ1に塗布液を供給するため
のノズル、10はカップ内を排気するための排気手段で
ある。
Conventionally, as this type of apparatus, for example, a sectional view shown in FIG. 6 (Japanese Patent Laid-Open No. 63-777569),
Alternatively, a sectional view shown in FIG. 7 has been proposed.
6, reference numeral 1 denotes a wafer such as silicon as a semiconductor substrate as an example of a substrate; 2, a spindle for rotating the wafer 1 via a spin chuck 3; 3, a spin chuck for holding the wafer; A rectifying member, which is provided below 1 and is an annular member which is a rectifying means for adjusting an air flow below the wafer 1, 8 is a spin mechanism provided so as to surround the rotating mechanism and the rotating wafer 1, 9 is A nozzle 10 for supplying the coating liquid to the wafer 1 is an exhaust unit for exhausting the inside of the cup.

【0004】以上のように構成された従来のスピンコー
ト機の作用を説明する。
[0004] The operation of the conventional spin coater configured as described above will be described.

【0005】まず、ウエハ1を低速で回転させておき、
ノズル9から塗布液を所定量ウエハ1上に供給する。次
いで回転数をたとえば数千r.p.m程度にまで上げ、
塗布液をウエハ1上に均一に広げ、必要であれば加熱し
て塗膜を乾燥および硬化させる。このスピンコーティン
グ処理のとき、塗布液の飛沫がウエハ1の表面や裏面に
付着することを防ぐため、排気手段10でスピンカップ
8内を強制排気することによって、上方から清浄な空気
や窒素ガスなどを流通させている。
First, the wafer 1 is rotated at a low speed,
A predetermined amount of the coating liquid is supplied onto the wafer 1 from the nozzle 9. Then, the rotational speed is increased to, for example, several thousand r. p. m,
The coating liquid is spread evenly on the wafer 1 and, if necessary, heated to dry and cure the coating. At the time of this spin coating process, the inside of the spin cup 8 is forcibly evacuated by the exhaust unit 10 in order to prevent the droplets of the application liquid from adhering to the front surface and the back surface of the wafer 1 so that clean air, nitrogen gas, etc. Is distributed.

【0006】また図7は、整流部材14の上方が円筒形
の従来例である。その他の構造は基本的に図6のものと
変わらないので、詳細な説明を省略する。
FIG. 7 shows a conventional example in which the upper part of the flow regulating member 14 is cylindrical. Other structures are basically the same as those in FIG. 6, and thus detailed description is omitted.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、前記従
来例によればウエハ1の最外周(エッジ部)の近傍であ
って、とくにウエハ1のエッジ部の直下部分に渦流(図
6〜7のX)が発生しやいという課題があった。上方か
らの気流がエッジ部の直下に負圧部分を形成し、気流が
巻き込まれるからであると思われる。そして、渦流Xが
発生すると、この渦流Xに随伴して塗布液の飛沫がウエ
ハ1の裏面に付着しやすいという課題があった。塗布液
の飛沫がウエハ1の裏面に付着すると、それを除去しな
ければならないという好ましくない作業工程の付加が生
ずるか、あるいは、そのウエハ1を半導体の製造工程か
ら廃棄する必要がある。
However, according to the prior art, the eddy current (X in FIGS. 6 and 7) is located in the vicinity of the outermost periphery (edge) of the wafer 1 and particularly immediately below the edge of the wafer 1. ) Tends to occur. It is considered that the airflow from above forms a negative pressure portion just below the edge portion, and the airflow is involved. Then, when the vortex X is generated, there is a problem that the spray of the coating liquid easily adheres to the back surface of the wafer 1 accompanying the vortex X. If the droplets of the coating solution adhere to the back surface of the wafer 1, an undesirable operation step must be removed, or the wafer 1 must be discarded from the semiconductor manufacturing process.

【0008】本発明は、前記従来技術の課題を解決する
ため、ウエハ等の基板のエッジ部の直下部分の渦流の発
生を防止し、塗布液の飛沫が基板の裏面に付着すること
を防止した回転塗布装置を提供することを目的とする。
In order to solve the above-mentioned problems of the prior art, the present invention has prevented the generation of a vortex just below the edge portion of a substrate such as a wafer, and has prevented the application liquid from adhering to the back surface of the substrate. It is an object to provide a spin coating device.

【0009】[0009]

【課題を解決するための手段】前記目的を達成するた
め、本発明の回転塗布装置は、基板を実質的に水平に保
持して回転するスピンチャックと、基板の下方で気流を
整える環状の整流手段と、回転する基板を囲うようにし
て設けられたスピンカップを備え、整流手段とスピンカ
ップの間を排気するようにした回転塗布装置であって、
前記整流手段が、上端の外径が基板の外径と同等以下の
環状の整流部材と、この整流部材の半径方向外側に、上
端の内径が基板の外径よりも大きくて、整流部材の環状
側面から間隔を有して、整流部材の環状側面に実質的に
沿った位置に設けた整流板とからなることを特徴とす
る。
In order to achieve the above object, a spin coating apparatus according to the present invention comprises a spin chuck that rotates while holding a substrate substantially horizontally, and an annular rectifier that regulates airflow below the substrate. Means, comprising a spin cup provided so as to surround the rotating substrate, a spin coating device to exhaust the space between the rectification means and the spin cup,
The rectifying means includes an annular rectifying member having an outer diameter at an upper end equal to or less than the outer diameter of the substrate, and an inner diameter at an upper end is larger than an outer diameter of the substrate at a radially outer side of the rectifying member. And a rectifying plate provided at a position substantially along the annular side surface of the rectifying member with an interval from the side surface.

【0010】前記構成においては、整流部材および整流
板の形状が、下広がりの截頭円錐形状であることが好ま
しい。ここで截頭円錐形状とは、円錐の先端部をカット
した状態をいう。
In the above structure, it is preferable that the straightening member and the straightening plate have a truncated conical shape spreading downward. Here, the truncated cone shape refers to a state where the tip of the cone is cut.

【0011】[0011]

【作用】前記本発明の構成によれば、基板の下方で気流
を整える環状の整流手段を、上端の外径が基板の外径と
同等以下の環状の整流部材と、この整流部材の半径方向
外側に、上端の内径が基板の外径よりも大きくて、この
整流部材の環状側面から間隔を有して、整流部材の環状
側面に実質的に沿った位置に設けた整流板とで構成した
ので、基板のエッジ部の直下部分の気流が層流状態とな
り、渦流の発生が防止でき、塗布液の飛沫が基板の裏面
に付着することを防止できる。
According to the structure of the present invention, the annular rectifying means for adjusting the airflow below the substrate is provided with an annular rectifying member having an outer diameter at the upper end equal to or less than the outer diameter of the substrate, and a radial direction of the rectifying member. On the outside, an inner diameter of the upper end is larger than the outer diameter of the substrate, and a rectifying plate is provided at a position substantially along the annular side surface of the rectifying member with a distance from the annular side surface of the rectifying member. Therefore, the airflow just below the edge of the substrate is in a laminar state, so that eddy can be prevented from occurring, and the droplets of the coating liquid can be prevented from adhering to the back surface of the substrate.

【0012】また、整流部材および整流板の形状が、下
広がりの截頭円錐形状であるという本発明の好ましい構
成によれば、基板のエッジ部の直下部分の気流がさらに
好ましい層流状態となり、渦流の発生が防止でき、塗布
液の飛沫(たとえばレジストミスト)が基板の裏面に付
着することをさらに効果的に防止できる。
According to the preferred configuration of the present invention in which the shape of the rectifying member and the rectifying plate is a frusto-conical shape spreading downward, the air flow immediately below the edge portion of the substrate becomes a more preferable laminar flow state. The generation of the vortex can be prevented, and the splash of the coating liquid (for example, resist mist) can be more effectively prevented from adhering to the back surface of the substrate.

【0013】[0013]

【実施例】以下実施例を用いてさらに具体的に説明す
る。なお本発明は下記の実施例によって限定されるもの
ではない。
The present invention will be described more specifically with reference to the following examples. The present invention is not limited by the following examples.

【0014】図1は本発明の第1の実施例のスピンコー
ト機の断面図である。図1において、4と5はともにウ
エハ1の下方での気流を整える整流手段をなし、4は上
端の外径が、回転するウエハ1の外径と同等以下の環状
の整流部材、5は上端の内径がウエハ1の外径より大き
くて、この整流部材4の半径方向外側に、前記整流部材
4の環状側面から間隔を有して、この整流部材の外側で
あってかつ整流部材4の外周面に実質的に沿った位置に
設けた整流板である。他の部品番号は、図6と同一であ
るので説明を省略する。
FIG. 1 is a sectional view of a spin coater according to a first embodiment of the present invention. In FIG. 1, reference numerals 4 and 5 denote rectification means for adjusting the airflow below the wafer 1, and reference numeral 4 denotes an annular rectification member whose outer diameter at the upper end is equal to or smaller than the outer diameter of the rotating wafer 1. Is larger than the outer diameter of the wafer 1 and is spaced radially outward of the rectifying member 4 from the annular side surface of the rectifying member 4 and is outside of the rectifying member and the outer periphery of the rectifying member 4. A current plate provided at a position substantially along the surface. The other part numbers are the same as those in FIG.

【0015】前記本発明に用いる整流板5は、多層であ
っても良い。かかる整流手段が付設されていると、ウエ
ハ1を低速で回転させておき、ノズル9から塗布液を所
定量ウエハ1上に供給し、次いで回転数をたとえば数千
r.p.m程度にまで上げて、塗布液をウエハ1上に均
一に広げた場合でも、上方からの気流は矢印Yのように
なり、渦流の発生が防止できる。
The current plate 5 used in the present invention may be a multilayer. If such a rectifying means is provided, the wafer 1 is rotated at a low speed, a predetermined amount of the coating liquid is supplied from the nozzle 9 onto the wafer 1, and the number of rotations is, for example, several thousand rpm. p. m, and even when the coating liquid is spread evenly on the wafer 1, the airflow from above becomes as shown by the arrow Y, and the generation of the vortex can be prevented.

【0016】整流部材4と整流板5との間隔は好ましく
は2〜10mm程度、さらに好ましくは3〜7mm程度
である。整流部材4と整流板5との固定手段は、たとえ
ば整流部材4の外周面の3〜4か所程度で行なうことが
でき、接着、嵌め込み、一体成形などいかなる手段を用
いても良い。整流板5の材料は、樹脂、金属などいかな
るものであっても良く、好ましくはたとえばポリプロピ
レンなどのプラスチック成形体である。
The distance between the rectifying member 4 and the rectifying plate 5 is preferably about 2 to 10 mm, more preferably about 3 to 7 mm. The rectifying member 4 and the rectifying plate 5 can be fixed to each other at, for example, about three to four places on the outer peripheral surface of the rectifying member 4, and any means such as adhesion, fitting, and integral molding may be used. The material of the current plate 5 may be any material such as resin and metal, and is preferably a plastic molded body such as polypropylene.

【0017】以上のように構成された第1の実施例によ
れば、上方からの気流は図1に示す矢印Yのようにな
り、ウエハ1のエッジ部の直下部分の気流が層流状態と
なり、渦流の発生が防止でき、塗布液の飛沫(たとえば
レジストミスト)がウエハの裏面に付着することを防止
できる。
According to the first embodiment constructed as described above, the air flow from above is as shown by the arrow Y in FIG. 1, and the air flow immediately below the edge of the wafer 1 is in a laminar state. In addition, it is possible to prevent the generation of a vortex, and to prevent the spray of the coating liquid (for example, resist mist) from adhering to the back surface of the wafer.

【0018】次に図2は本発明の第2の実施例のスピン
コート機の断面図である。図2において、6は整流板5
の外側に設けた第2整流板である。すなわち、整流板が
2段になっている例である。このようにすることによ
り、渦流の発生をさらに効果的に防止できる。
FIG. 2 is a sectional view of a spin coater according to a second embodiment of the present invention. In FIG. 2, reference numeral 6 denotes a current plate 5
A second rectifying plate provided outside the rectifier. That is, this is an example in which the rectifying plate has two stages. By doing so, the generation of eddy current can be more effectively prevented.

【0019】次に図3は本発明の第3の実施例のスピン
コート機の断面図、図4は同斜視図である。図3〜4に
おいて、7は第2整流板6のさらに外側に設けた第3整
流板である。すなわち、整流板が3段になっている例で
ある。このようにすることにより、渦流の発生をさらに
効果的に防止できる。
FIG. 3 is a sectional view of a spin coater according to a third embodiment of the present invention, and FIG. 4 is a perspective view of the same. 3 and 4, reference numeral 7 denotes a third rectifying plate provided further outside the second rectifying plate 6. That is, this is an example in which the rectifying plate has three stages. By doing so, the generation of eddy current can be more effectively prevented.

【0020】次に図5は本発明の第4の実施例のスピン
コート機の断面図である。図5において、整流部材4の
外側に整流部材の外周面に沿って整流板5を設けた例で
ある。図7と比較すると、図7ではウエハ1のエッジ部
の直下部分の気流が渦流Xとなりやすいのに対して、図
5においては同じ部分が層流Yになるという好ましい作
用が生ずる。
FIG. 5 is a sectional view of a spin coater according to a fourth embodiment of the present invention. FIG. 5 shows an example in which a rectifying plate 5 is provided outside the rectifying member 4 along the outer peripheral surface of the rectifying member. Compared to FIG. 7, a favorable effect is produced in that the air flow immediately below the edge of the wafer 1 in FIG. 7 tends to be a vortex X, whereas in FIG.

【0021】以上説明した通り、本実施例によれば、ウ
エハ1のエッジ部の直下部分の気流が層流状態となり、
渦流の発生が防止でき、塗布液の飛沫(たとえばレジス
トミスト)がウエハの裏面に付着することを効果的に防
止できる。また前記実施例はウエハの例を示したが、本
発明は、半導体基板、液晶用ガラスなどのガラス基板、
セラミックス基板、プラスチック基板、光ディスク基板
等の表面にたとえばフォトレジスト液、現像液、エッチ
ング液、液体ドーパント液などを塗布し、基板を回転さ
せて塗布液を基板表面に均一にコーティングする装置で
あればいかなる装置にも応用することができる。
As described above, according to the present embodiment, the airflow just below the edge of the wafer 1 is in a laminar state,
Generation of a vortex can be prevented, and droplets of the coating liquid (for example, resist mist) can be effectively prevented from adhering to the back surface of the wafer. Although the above embodiment shows an example of a wafer, the present invention relates to a semiconductor substrate, a glass substrate such as glass for liquid crystal,
For example, a device that applies a photoresist solution, a developing solution, an etching solution, a liquid dopant solution, or the like to the surface of a ceramic substrate, a plastic substrate, an optical disk substrate, or the like, and rotates the substrate to uniformly coat the application surface with the coating solution. It can be applied to any device.

【0022】[0022]

【発明の効果】前記のとおり本発明によれば、基板の下
方で気流を整える環状の整流手段を、上端の外径が基板
の外径と同等以下の環状の整流部材と、この整流部材の
半径方向外側に、上端の内径が基板の外径よりも大きく
て、この整流部材の環状側面から間隔を有して、整流部
材の環状側面に実質的に沿った位置に設けた整流板とで
構成したので、基板のエッジ部の直下部分の気流が層流
状態となり、渦流の発生が防止でき、塗布液の飛沫が基
板の裏面に付着することを防止できるという顕著な効果
を達成できる。
As described above, according to the present invention, an annular rectifying means for adjusting the air flow below the substrate, an annular rectifying member whose upper end has an outer diameter equal to or less than the outer diameter of the substrate, Radially outward, an inner diameter of the upper end is larger than an outer diameter of the substrate, and a rectifying plate provided at a position substantially along the annular side surface of the rectifying member with an interval from the annular side surface of the rectifying member. With this configuration, the airflow immediately below the edge of the substrate is in a laminar state, so that a vortex can be prevented from occurring, and a remarkable effect of preventing the spray of the coating liquid from adhering to the back surface of the substrate can be achieved.

【0023】また、整流部材および整流板の形状が、下
広がりの截頭円錐形状であるという本発明の好ましい構
成によれば、基板のエッジ部の直下部分の気流がさらに
好ましい層流状態となり、渦流の発生が防止でき、塗布
液の飛沫(たとえばレジストミスト)が基板の裏面に付
着することをさらに効果的に防止できる。
According to the preferred configuration of the present invention in which the shape of the rectifying member and the rectifying plate is a frusto-conical shape expanding downward, the air flow immediately below the edge portion of the substrate becomes a more preferable laminar flow state. The generation of the vortex can be prevented, and the splash of the coating liquid (for example, resist mist) can be more effectively prevented from adhering to the back surface of the substrate.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の第1の実施例のスピンコート機の断
面図。
FIG. 1 is a sectional view of a spin coater according to a first embodiment of the present invention.

【図2】 本発明の第2の実施例のスピンコート機の断
面図。
FIG. 2 is a sectional view of a spin coater according to a second embodiment of the present invention.

【図3】 本発明の第3の実施例のスピンコート機の断
面図。
FIG. 3 is a sectional view of a spin coater according to a third embodiment of the present invention.

【図4】 同斜視図。FIG. 4 is a perspective view of the same.

【図5】 本発明の第4の実施例のスピンコート機の断
面図。
FIG. 5 is a sectional view of a spin coater according to a fourth embodiment of the present invention.

【図6】 従来例のスピンコート機の断面図。FIG. 6 is a sectional view of a conventional spin coater.

【図7】 別の従来例のスピンコート機の断面図。FIG. 7 is a cross-sectional view of another conventional spin coater.

【符号の説明】[Explanation of symbols]

1…ウエハ、 2…スピンドル、 3…スピンチャッ
ク、 4…整流部材、5…第1の整流板、 6…第2の
整流板、 7…第3の整流板、 8…スピンカップ、
9…ノズル、 10…排気手段。
DESCRIPTION OF SYMBOLS 1 ... Wafer, 2 ... Spindle, 3 ... Spin chuck, 4 ... Rectifier member, 5 ... First rectifier plate, 6 ... Second rectifier plate, 7 ... Third rectifier plate, 8 ... Spin cup,
9: nozzle, 10: exhaust means.

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 基板を実質的に水平に保持して回転する
スピンチャックと、基板の下方で気流を整える環状の整
流手段と、回転する基板を囲うようにして設けられたス
ピンカップを備え、整流手段とスピンカップの間を排気
するようにした回転塗布装置であって、前記整流手段
が、上端の外径が基板の外径と同等以下の環状の整流部
材と、この整流部材の半径方向外側に、上端の内径が基
板の外径よりも大きくて、整流部材の環状側面から間隔
を有して、整流部材の環状側面に実質的に沿った位置に
設けた整流板とからなることを特徴とする回転塗布装
置。
A spin chuck that rotates while holding the substrate substantially horizontally; an annular rectifying unit that regulates airflow below the substrate; and a spin cup provided so as to surround the rotating substrate. A rotary coating device configured to exhaust air between a rectifying unit and a spin cup, wherein the rectifying unit includes an annular rectifying member having an outer diameter at an upper end equal to or less than an outer diameter of a substrate, and a radial direction of the rectifying member. On the outside, an inner diameter of the upper end is larger than an outer diameter of the substrate, and a rectifying plate is provided at a position substantially along the annular side surface of the rectifying member with a distance from the annular side surface of the rectifying member. Characteristic spin coating device.
【請求項2】 整流部材および整流板の形状が、下広が
りの截頭円錐形状である請求項1記載の回転塗布装置。
2. The spin coating device according to claim 1, wherein the straightening member and the straightening plate have a truncated conical shape spreading downward.
JP3535091A 1991-02-04 1991-02-04 Rotary coating device Expired - Fee Related JP2575959B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3535091A JP2575959B2 (en) 1991-02-04 1991-02-04 Rotary coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3535091A JP2575959B2 (en) 1991-02-04 1991-02-04 Rotary coating device

Publications (2)

Publication Number Publication Date
JPH04247264A JPH04247264A (en) 1992-09-03
JP2575959B2 true JP2575959B2 (en) 1997-01-29

Family

ID=12439417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3535091A Expired - Fee Related JP2575959B2 (en) 1991-02-04 1991-02-04 Rotary coating device

Country Status (1)

Country Link
JP (1) JP2575959B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608174B2 (en) * 1979-08-31 1985-03-01 尾崎省力機械株式会社 Stop position detection device for moving table in machine tools
JPS5962303U (en) * 1982-10-18 1984-04-24 豊興工業株式会社 Laminated liquid control device

Also Published As

Publication number Publication date
JPH04247264A (en) 1992-09-03

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