JPS6369563A - Method and device for coating - Google Patents
Method and device for coatingInfo
- Publication number
- JPS6369563A JPS6369563A JP21384286A JP21384286A JPS6369563A JP S6369563 A JPS6369563 A JP S6369563A JP 21384286 A JP21384286 A JP 21384286A JP 21384286 A JP21384286 A JP 21384286A JP S6369563 A JPS6369563 A JP S6369563A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- solvent
- coated
- rotating
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 66
- 239000011248 coating agent Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title description 12
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000002904 solvent Substances 0.000 claims abstract description 34
- 239000003595 mist Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 description 19
- 239000004642 Polyimide Substances 0.000 description 14
- 230000001681 protective effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000001459 lithography Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- -1 viscosity Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、塗布技術、特に、被塗布物を回転させること
により塗布材を塗布する技術に関し、例えば、半導体装
置の製造工程において、ウェハ上に感光性ポリイミドを
塗布するのに利用して有効な技術に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a coating technique, particularly a technique of coating a coating material by rotating an object to be coated. This invention relates to an effective technique that can be used to coat photosensitive polyimide.
半導体装置の製造工程において、ウェハ上に感光性ポリ
イミドを塗布する場合、処理容器の内部に設けた回転可
能なスピンヘッド上にウェハを載せて保持せしめ、ウェ
ハを回転させながら感光性ポリイミド溶液をウェハの表
面上に供給して塗布処理を行うことが、考えられる。In the process of manufacturing semiconductor devices, when applying photosensitive polyimide onto a wafer, the wafer is placed and held on a rotatable spin head installed inside a processing container, and the photosensitive polyimide solution is applied onto the wafer while rotating the wafer. It is conceivable to supply the material onto the surface of the material and perform the coating treatment.
なお、スピンナ塗布技術を述べである例としては、株式
会社工業調査会発行「電子材料１９８３年１１月号別冊
」昭和５８年１１月１５日発行Ｐ９’２〜Ｐ９６、およ
び特公昭５３−３７１８９号公報がある。Examples that describe the spinner coating technology include "Electronic Materials November 1983 Special Issue" published by Kogyo Research Association Co., Ltd., November 15, 1983, pages 9'2 to 96, and Special Publication No. 53-37189. There is a public notice.
しかし、このような塗布技術においては、感光性ポリイ
ミドが高粘度であるため、塗布膜の厚さがウニへの周辺
部で厚くなり、２０〜４０ボイズ（Ｐｏｉｓｅ）のもの
では膜厚の比が、周辺部は中央部の１．５〜２．０倍に
もなるという問題点があることが、本発明者によって明
らかにされた。However, in this coating technique, the photosensitive polyimide has a high viscosity, so the coating film becomes thicker at the periphery of the sea urchin, and for coatings with 20 to 40 poise, the film thickness ratio is low. The inventor of the present invention has revealed that there is a problem in that the peripheral area is 1.5 to 2.0 times larger than the central area.
本発明の目的は、塗布膜の厚さを均一化することができ
る塗布技術を提供することにある。An object of the present invention is to provide a coating technique that can make the thickness of a coating film uniform.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を説明すれば、次の通りである。An overview of typical inventions disclosed in this application is as follows.
すなわち、回転する被塗布物上に塗布材が滴下されて塗
布された後、被塗布物を回転させながらその周辺部に溶
剤を供給するようにしたものである。That is, after a coating material is dropped onto a rotating object to be coated and applied, a solvent is supplied to the surrounding area of the object while rotating the object.
前記した手段によれば、塗布膜が被塗布物の周辺部にお
いて厚くなった場合、その周辺部に溶剤が供給されるこ
とにより、その盛り上がった部分の塗布材が熔解される
とともに、回転による遠心力によって拡散されるため、
塗布膜は全体的に均一化されることになる。According to the above-mentioned means, when the coating film becomes thick at the periphery of the object to be coated, the solvent is supplied to the periphery, thereby melting the coating material in the raised area, and centrifuging by rotation. Because it is spread by force,
The coating film will be uniform throughout.
第１図は本発明の一実施例である塗布装置を示す縦断面
図、第２図〜第６図は本発明の一実施例である塗布方法
を示す各拡大断面図である。FIG. 1 is a longitudinal cross-sectional view showing a coating apparatus according to an embodiment of the present invention, and FIGS. 2 to 6 are enlarged cross-sectional views showing a coating method according to an embodiment of the present invention.
本実施例において、この塗布装置は感光性ポリイミドを
ウェハ上に塗布するものとして構成されており、処理容
器１を備えている。この容器１の内部にはスピンへラド
２が適当な駆動手段（図示せず）により回転されるよう
に設けられており、スピンナ塗布２は被塗布物としての
ウェハ９を真空吸着等により保持し得るように構成され
ている。In this embodiment, this coating device is configured to coat photosensitive polyimide onto a wafer, and is equipped with a processing container 1 . Inside this container 1, a spinnerad 2 is provided to be rotated by an appropriate driving means (not shown), and the spinner coating 2 holds a wafer 9 as an object to be coated by vacuum suction or the like. It is configured to obtain.
処理容″ａ１の上面における略中央部には給気口３が開
設されており、処理容器ｌの下面におけるスピンへラド
２の外方位置には排気口４が開設されている。処理容器
１内におけるスピンへラド２の中心の真上には、塗布材
５を滴下するための滴下管６が挿入されており、滴下管
６と処理容！５１とは適当な手段（図示せず）によって
相対的に昇降されるようになっている。滴下管６の脇に
は溶剤供給管としてのノズル７が滴下管６に対して接近
離反する径方向に平行移動し得るように配されて処理容
器１に挿入されており、このノズル７は溶剤８を霧状に
してスピンヘッド２上のウェハ９に向けて撒布し得るよ
うに構成されている。An air supply port 3 is provided at approximately the center of the upper surface of the processing container "a1," and an exhaust port 4 is provided at a position outside the spin rad 2 on the lower surface of the processing container 1.Processing container 1 A dripping tube 6 for dripping the coating material 5 is inserted directly above the center of the spin spatula 2 inside, and the dripping tube 6 and the processing chamber !51 are connected by appropriate means (not shown). A nozzle 7 serving as a solvent supply pipe is disposed beside the dripping tube 6 so as to be able to move in parallel in the radial direction toward and away from the dripping tube 6. The nozzle 7 is inserted into the spin head 1 , and the nozzle 7 is configured to atomize the solvent 8 and spray it toward the wafer 9 on the spin head 2 .
次に、前記構成にかかる塗布装置の使用方法並びに作用
をウェハ上に感光性ポリイミド溶液を塗布する場合につ
き説明することにより、本発明にかかる塗布方法の一実
施例を説明する。Next, an embodiment of the coating method according to the present invention will be described by explaining the usage and operation of the coating apparatus having the above-mentioned structure in the case of coating a photosensitive polyimide solution on a wafer.
ここで、塗布材５として使用される感光性ポリイミド溶
液は、ポリイミド・イソ・インドロ・キナ・ゾリンジオ
ン（ＰＩＱ）等のポリイミド樹脂に架摺剤を加え、ノー
マル・メチル２・ピロリジオン（ＮＭＰ）等のようなポ
リイミド樹脂用の溶媒を使用して得られた溶液であり、
２０〜４０ボイズのようにスピンナ塗布するのには比較
的高粘度を有する塗布材になっている。この感光性ボ１
リイミドは半導体装置の製造工程において、ウェハ上に
保護膜を形成するとともに、その保護膜に電極パッドを
露出させるためのホール（以下、ホールという、）を穿
孔するのに使用すると、リソグラフィー処理を簡略化さ
せることができる。Here, the photosensitive polyimide solution used as the coating material 5 is made by adding a crosslinking agent to a polyimide resin such as polyimide-iso-indolo-quina-zolinedione (PIQ), and then adding a cross-linking agent to the photosensitive polyimide solution such as normal methyl 2-pyrrolidione (NMP). It is a solution obtained using a solvent for polyimide resin such as
The coating material has a relatively high viscosity for spinner coating with 20 to 40 voids. This photosensitive board 1
In the manufacturing process of semiconductor devices, Liimide is used to form a protective film on a wafer and to drill holes (hereinafter referred to as holes) in the protective film to expose electrode pads, simplifying the lithography process. can be made into
また、本実施例において、ノズル７から撒布される溶剤
８としては前記塗布材５としての感光性ポリイミド溶液
における溶媒が使用される。Further, in this embodiment, as the solvent 8 sprayed from the nozzle 7, the solvent in the photosensitive polyimide solution as the coating material 5 is used.
まず、被塗布物としてのウェハ９をスピンヘッド２上に
載せて真空吸着等の手段により保持せしめ、ウェハ９を
回転させる。この回転が安定したところで、滴下管６か
ら塗布材５をウェハ９の中心上に滴下すると、塗布材５
は遠心力によって放射方向に拡散し、ウェハ９の表面に
塗布されることになる。このとき、第１図に実線矢印で
示されているように、給気口３から排気口４の方向に気
流が形成されることにより、塗布材５の飛沫がウェハ９
の表面に付着することを防止される。First, a wafer 9 as an object to be coated is placed on the spin head 2 and held by means such as vacuum suction, and the wafer 9 is rotated. When this rotation is stabilized, the coating material 5 is dropped from the dropping tube 6 onto the center of the wafer 9.
is diffused in the radial direction by centrifugal force and is applied to the surface of the wafer 9. At this time, as shown by the solid line arrow in FIG.
is prevented from adhering to surfaces.
ところで、ウェハ上にホール付きの保護膜を形成すべく
感光性ポリイミド溶液を塗布材として使用した場合、第
２図に示されているように、ウェハ９上に塗布される膜
１０はその周辺部において厚くなるという問題点がある
ことが、本発明者によって明らかにされた。By the way, when a photosensitive polyimide solution is used as a coating material to form a protective film with holes on a wafer, as shown in FIG. The inventor of the present invention has found that there is a problem in that the thickness of the material increases.
これは、所期の感光性能および保護膜としての膜厚を得
る必要上、塗布材としての感光性ポリイミド溶液の粘度
をスピンナ塗布するのには比較的高く設定する必要があ
るためである。This is because it is necessary to set the viscosity of the photosensitive polyimide solution as a coating material to be relatively high for spinner coating in order to obtain the desired photosensitive performance and film thickness as a protective film.
例えば、２０〜４０ボイズの感光性ポリイミド溶液を用
いて、平均膜厚２ｕｍの保護膜をウェハ上にスピンナ塗
布した場合、周辺部の膜ｒｇ、Ｂと中央部ノ［９ｒ￥八
との比Ｂ／Ａは、１．５〜２．０、になった。For example, when a protective film with an average thickness of 2 um is coated on a wafer using a photosensitive polyimide solution with 20 to 40 voids, the ratio B of the film rg,B in the peripheral part and [9r\8 in the central part /A was 1.5 to 2.0.
このように周辺部の膜厚が大きいまま、ウェハ上の感光
性ポリイミド膜にリソグラフィー処理が施されると、第
３図に示されているように、ウェハの周辺部における膜
について現像残りが発生ずるため、当該箇所におけるペ
レット部につき所望のホールが得られないことになる。If the photosensitive polyimide film on the wafer is subjected to lithography processing while the film thickness at the periphery is still large, as shown in Figure 3, undeveloped portions of the film at the periphery of the wafer will be left behind. As a result, the desired hole cannot be obtained in the pellet portion at that location.
そこで、本実施例においては、ウェハ９上に塗布膜ｌＯ
が塗布された後、ウェハ９を３０００〜４０００ｒｐｍ
で回転させながら、第４図に示されているように、ウェ
ハ９の周辺部における塗布１１１０の盛り上がり部分ｔ
ａｂにノズル７のウェハ９との対向位置を調整して、塗
布材５に使用された溶媒を溶剤８として霧状に撒布させ
る。撒布された溶剤８が塗布膜ｌＯの盛り上がった部分
１０ｂに接触すると、溶剤８に接触した部分の塗布材５
は溶解されるとともに、回転による遠心力よって外方へ
飛ばされるため、塗布膜１０は第５図に示されているよ
うに全体にわたって均一化されることになる。Therefore, in this embodiment, the coating film lO
is applied, the wafer 9 is rotated at 3000 to 4000 rpm.
While rotating the wafer 9, as shown in FIG.
ab adjusts the position of the nozzle 7 facing the wafer 9, and sprays the solvent used in the coating material 5 in the form of a mist as the solvent 8. When the sprayed solvent 8 comes into contact with the raised part 10b of the coating film 10, the part of the coating material 5 that came into contact with the solvent 8
is dissolved and blown outward by the centrifugal force caused by rotation, so that the coating film 10 becomes uniform over the entire surface as shown in FIG.
このようにして、感光性ポリイミドの塗布膜１０が均一
に塗布されると、第６図に示されているように、現像残
りが発生しないため、全てのベレット部について所望の
ホールが均一に得られる。When the coating film 10 of photosensitive polyimide is uniformly applied in this way, as shown in FIG. 6, no undeveloped areas are generated, so that the desired holes are uniformly formed on all pellet parts. It will be done.
このとき、溶剤８として塗布材５の溶媒を使用すれば、
塗布膜１０の変質を回避することができる。また、溶剤
８が霧状に撒布されると、溶剤を所望の箇所に均等に接
触させることができる。At this time, if the solvent of the coating material 5 is used as the solvent 8,
Deterioration of the coating film 10 can be avoided. Moreover, when the solvent 8 is sprayed in a mist form, the solvent can be brought into uniform contact with desired locations.
前記実施例によれば次の効果が得られる。According to the embodiment described above, the following effects can be obtained.
＋１１ 回転する被塗布物上に塗布材が滴下されて塗
布された後、被塗布物を回転させながらその周辺部に溶
剤を供給することにより、塗布の盛り上がった部分を溶
解させて除去させることができるため、塗布膜を全体的
に均一化することができる。+11 After the coating material is dropped and applied onto the rotating object, the raised parts of the coating can be dissolved and removed by supplying a solvent to the surrounding area while rotating the object. Therefore, the coating film can be made uniform throughout.
（２）塗布膜を全体的に均一化することにより、リソグ
ラフィー処理において現像度を均一化させることができ
る。(2) By making the coating film uniform as a whole, the degree of development can be made uniform in the lithography process.
（３） 現像を均一化させることにより、感光性ポリ
イミド膜によって保護膜を形成させた場合において、電
極パッドを露出させるためのホールをウェハ全体にわた
って適正に穿設させることができる。(3) By making the development uniform, holes for exposing the electrode pads can be appropriately formed over the entire wafer when a protective film is formed using a photosensitive polyimide film.
（４１感光性ポリイミド膜によってホール付きの保護膜
を形成するのを実現化させることにより、保護膜の形成
工程においてリソグラフィー処理を簡略化させることが
できる。(By realizing the formation of a protective film with holes using a 41 photosensitive polyimide film, the lithography process in the process of forming the protective film can be simplified.
以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.
例えば、周辺部に供給する溶剤は塗布材の溶媒に限らず
、アセトンやキシレン等のような他の溶剤を使用しても
よい。For example, the solvent supplied to the peripheral area is not limited to the solvent of the coating material, but other solvents such as acetone, xylene, etc. may be used.
また、ノズルの形状、構造や、溶剤の供給量、供給時間
、撒布形状、流量、流速、流圧および温度等は、塗布材
の種類、粘度、塗布すべき膜厚、被塗布物の径、処理容
器の形状、構造、排気９等々の種々の条件に対応して最
適化することが望ましい。In addition, the shape and structure of the nozzle, the amount of solvent supplied, the supply time, the spraying shape, the flow rate, the flow velocity, the flow pressure, and the temperature, etc., are determined by the type of coating material, viscosity, film thickness to be coated, diameter of the object to be coated, etc. It is desirable to optimize the process according to various conditions such as the shape and structure of the processing container, the exhaust gas 9, etc.
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野であるウェハ上に感光性ポ
リイミドを塗布する技術に適用した場合について説明し
たが、それに限定されるものではなく、マスクにレジス
トを塗布する場合等にも通用することができる。特に、
本発明によれば、高粘度の塗布材を塗布する場合に通用
して優れた効果が得られる。In the above explanation, the invention made by the present inventor was mainly applied to the technology for coating photosensitive polyimide on a wafer, which is the background application field, but it is not limited to this. It can also be used when applying resist to surfaces. especially,
According to the present invention, excellent effects can be obtained that are applicable to the application of high-viscosity coating materials.
本願において開示される発明のうち代表的なものによっ
て得られる効果を簡単に説明すれば、次の通りである。A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.
回転する被塗布物上に塗布材が滴下されて塗布された後
、被塗布物を回転させながらその周辺部に溶剤を供給す
ることにより、塗布の盛り上がった部分を熔解させて除
去させることができるため、塗布膜を全体的に均一化す
ることができる。After the coating material is dropped and applied onto the rotating object, by supplying a solvent to the surrounding area while rotating the object, the raised areas of the coating can be melted and removed. Therefore, the coating film can be made uniform throughout.
第１図は本発明の一実施例である塗布装置を示す縦断面
図、
第２図、第３図、第４図、第５図および第６図は本発明
の一実施例である塗布方法を示す各拡大断面図である。
１・・・処理容器、２・・・スピンヘッド、３・・・給
気口、４・・・排気口、５・・・塗布材６・・・滴下管
、７・・・ノズル（溶剤供給管）、８・・・溶剤、９・
・・ウェハ（被塗布物）１０・・・塗布膜。
代理人 弁理士 小川勝男 （′イ
ビFIG. 1 is a vertical cross-sectional view showing a coating device which is an embodiment of the present invention, and FIGS. 2, 3, 4, 5 and 6 are coating methods which are embodiments of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Processing container, 2... Spin head, 3... Air supply port, 4... Exhaust port, 5... Coating material 6... Dripping pipe, 7... Nozzle (solvent supply) tube), 8...solvent, 9.
...Wafer (object to be coated) 10...Coating film. Agent: Patent attorney Katsuo Ogawa ('Ibi
Claims (1)
た後、被塗布物を回転させながらその周辺部に溶剤を供
給することを特徴とする塗布方法。 ２、溶剤が、塗布材に使用されている溶媒であることを
特徴とする特許請求の範囲第１項記載の塗布方法。 ３、溶剤が、霧状に撒布されることを特徴とする特許請
求の範囲第１項記載の塗布方法。 ４、処理容器と、処理容器内において被塗布物を保持し
て回転させるスピンヘッドと、回転する被塗布物に塗布
材を滴下する滴下管と、回転する被塗布物の周辺部に溶
剤を供給する溶剤供給管とを備えていることを特徴とす
る塗布装置。 ５、溶剤供給管が、溶剤を撒布し得るように構成されて
いることを特徴とする特許請求の範囲第４項記載の塗布
装置。 ６、溶剤供給管が、被塗布物の径方向に移動し得るよう
に構成されていることを特徴とする特許請求の範囲第４
項記載の塗布装置。[Scope of Claims] 1. A coating method characterized in that after a coating material is dropped onto a rotating object to be coated, a solvent is supplied to the surrounding area of the object while rotating the object. 2. The coating method according to claim 1, wherein the solvent is a solvent used in the coating material. 3. The coating method according to claim 1, wherein the solvent is sprayed in the form of a mist. 4. A processing container, a spin head that holds and rotates the object to be coated within the processing container, a dripping pipe that drops the coating material onto the rotating object, and a supply of solvent to the periphery of the rotating object. A coating device characterized in that it is equipped with a solvent supply pipe. 5. The coating device according to claim 4, wherein the solvent supply pipe is configured to be able to spray a solvent. 6. Claim 4, characterized in that the solvent supply pipe is configured to be movable in the radial direction of the object to be coated.
Coating device described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21384286A JPS6369563A (en) | 1986-09-12 | 1986-09-12 | Method and device for coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21384286A JPS6369563A (en) | 1986-09-12 | 1986-09-12 | Method and device for coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6369563A true JPS6369563A (en) | 1988-03-29 |
Family
ID=16645925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21384286A Pending JPS6369563A (en) | 1986-09-12 | 1986-09-12 | Method and device for coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6369563A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5849467A (en) * | 1996-01-29 | 1998-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Method for the pre-treatment of a photoresist layer on a substrate surface |
| US6015467A (en) * | 1996-03-08 | 2000-01-18 | Tokyo Ohka Kogyo Co., Ltd. | Method of removing coating from edge of substrate |
| US6183942B1 (en) | 1999-04-15 | 2001-02-06 | Dongjin Semichem Co., Ltd. | Thinner composition for removing spin-on-glass and photoresist |
| WO2004107057A1 (en) * | 2003-06-03 | 2004-12-09 | Dongjin Semichem Co., Ltd. | Thinner composition for removing photosensitive resin |
| JP2005523459A (en) * | 2002-04-17 | 2005-08-04 | 株式会社荏原製作所 | Sample surface inspection apparatus and method |
| JP2008307488A (en) * | 2007-06-15 | 2008-12-25 | Tokyo Electron Ltd | Coating treatment method, coating treatment apparatus, program and computer memory medium |
| CN103019050A (en) * | 2011-09-22 | 2013-04-03 | 三星电子株式会社 | Diluent composition for RRC process and EBR process, and apparatus for supplying the same |
| JP2014011420A (en) * | 2012-07-03 | 2014-01-20 | Tokyo Electron Ltd | Coating film forming method, coating film forming apparatus, substrate processing device and storage medium |
| KR20180082967A (en) | 2017-01-11 | 2018-07-19 | 주식회사 다이셀 | Composition for removing resist |
| WO2021059753A1 (en) | 2019-09-24 | 2021-04-01 | ダイキン工業株式会社 | Welded body |
-
1986
- 1986-09-12 JP JP21384286A patent/JPS6369563A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5849467A (en) * | 1996-01-29 | 1998-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Method for the pre-treatment of a photoresist layer on a substrate surface |
| US6015467A (en) * | 1996-03-08 | 2000-01-18 | Tokyo Ohka Kogyo Co., Ltd. | Method of removing coating from edge of substrate |
| US6183942B1 (en) | 1999-04-15 | 2001-02-06 | Dongjin Semichem Co., Ltd. | Thinner composition for removing spin-on-glass and photoresist |
| US8674317B2 (en) | 2002-04-17 | 2014-03-18 | Ebara Corporation | Sample surface inspection apparatus and method |
| JP2005523459A (en) * | 2002-04-17 | 2005-08-04 | 株式会社荏原製作所 | Sample surface inspection apparatus and method |
| US8076654B2 (en) | 2002-04-17 | 2011-12-13 | Ebara Corporation | Sample surface inspection apparatus and method |
| WO2004107057A1 (en) * | 2003-06-03 | 2004-12-09 | Dongjin Semichem Co., Ltd. | Thinner composition for removing photosensitive resin |
| JP2008307488A (en) * | 2007-06-15 | 2008-12-25 | Tokyo Electron Ltd | Coating treatment method, coating treatment apparatus, program and computer memory medium |
| CN103019050A (en) * | 2011-09-22 | 2013-04-03 | 三星电子株式会社 | Diluent composition for RRC process and EBR process, and apparatus for supplying the same |
| JP2014011420A (en) * | 2012-07-03 | 2014-01-20 | Tokyo Electron Ltd | Coating film forming method, coating film forming apparatus, substrate processing device and storage medium |
| KR20180082967A (en) | 2017-01-11 | 2018-07-19 | 주식회사 다이셀 | Composition for removing resist |
| US10844334B2 (en) | 2017-01-11 | 2020-11-24 | Daicel Corporation | Composition for removing resist |
| WO2021059753A1 (en) | 2019-09-24 | 2021-04-01 | ダイキン工業株式会社 | Welded body |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5912049A (en) | Process liquid dispense method and apparatus | |
| JPS6369563A (en) | Method and device for coating | |
| US6261635B1 (en) | Method for controlling air over a spinning microelectronic substrate | |
| JP2007511897A (en) | Photoresist coating process for microlithography | |
| JPS63229169A (en) | Coating apparatus | |
| JP3605852B2 (en) | Substrate spin coater | |
| US7559155B2 (en) | Method and system for drying semiconductor wafers in a spin coating process | |
| JPH09122560A (en) | Spin coater | |
| JP3104832B2 (en) | Resist coating apparatus and coating method | |
| JPS62185322A (en) | Applicator for photo-resist | |
| JPS62221464A (en) | Vacuum suction stand for rotary coating | |
| KR0172269B1 (en) | Spray nozzle assembly of processing liquid | |
| JP2575959B2 (en) | Rotary coating device | |
| US6395086B1 (en) | Shield for wafer station | |
| JPH0453224A (en) | Spin coater | |
| JPH10335199A (en) | Semiconductor wafer developing device and method for using it | |
| JPS6369564A (en) | Spin coater for substrate | |
| JPS60189937A (en) | Applicator of resist | |
| JPH02133916A (en) | Resist coating apparatus | |
| JPH03263314A (en) | Eliminating method of spin-coated film | |
| KR100322685B1 (en) | Spin coater | |
| JPS581144A (en) | Method for coating photoresist | |
| JPH02134813A (en) | Application of resist | |
| JPH0441975Y2 (en) | ||
| JPH02134820A (en) | Cleaning and drying device |