JPH07142317A - Method and apparatus for removing resist around periphery of rectangular substrate - Google Patents

Abstract

PURPOSE:To provide a method and a device for removing a resist around the periphery of a rectangular substrate in a picture frame shape, and to provide a method and an apparatus, which eliminate the generation of particles and achieve the chemical treatment of a high-quality photo mask, a substrate for a liquid panel and the like. CONSTITUTION:A substrate is horizontally mounted on a stage 1 and rotated. An arm 5, to which a nozzle is attached, is moved in synchronization with the rotation of the stage 1. A resist removing solvent is discharged through the nozzle. A gas blowing nozzle 7 is attached to the arm 5, and the solvent discharged from the nozzle is made to flow out of the rectangular substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photomask for semiconductors and a method and apparatus for removing resist from the outer peripheral portion of a thin-plate equiangular substrate for liquid crystal panels.

[0002]

2. Description of the Related Art A semiconductor photomask will be described as an example. The semiconductor photomask has a side of 152 mm and a thickness of 6.
A chromium film of about 1000 angstrom is sputtered on a 3 mm square glass substrate, a resist is applied on the chromium film, and then exposure, development and etching are performed to form a pattern.

In the photolithography process, there is a problem in that the resist on the outer peripheral portion is peeled off and particles are generated due to mechanical chucking of the outer peripheral portion of the photomask, friction on the outer peripheral portion of the substrate caused by taking in and out of the storage box, and the like.

In order to reduce the generation of particles, it is effective to remove the resist on the outer periphery of the substrate in advance. The removal of resist from the outer periphery of a circular substrate such as a semiconductor wafer is described in JP-A-58-96637, JP-A-62-54920 and JP-A-4-96319. These conventional methods of removing the resist on the outer peripheral portion of the wafer have the drawback that the resist can be removed only in a round donut shape because the resist removing solvent is discharged while rotating the wafer.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and apparatus for removing the resist on the outer peripheral portion of a rectangular substrate in a frame shape, and eliminating the generation of particles, for a high quality photomask or liquid crystal panel. It is an object of the present invention to provide a method and apparatus for achieving a chemical treatment of a substrate or the like.

[0006]

According to the present invention, a substrate is horizontally placed on a stage and rotated, an arm having a nozzle attached thereto is moved in synchronization with the rotation of the stage, and a resist removing solvent is removed from the nozzle. It is characterized in that the ink is discharged. Also, a gas discharge nozzle is added to the arm so that the solvent discharged from the nozzle flows out to the outside of the rectangular substrate.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings. FIG. 1 is a block diagram of the resist removing apparatus of the present invention, and FIG. 2 is a plan view of a photomask placed on a stage.

The photomask 2 placed horizontally on the stage 1 holds the corners of the photomask 2 with holding pins 3 and is rotated at a low speed of 30 to 100 rpm by a motor 4. Arm 5
A solvent discharge nozzle 6 and a gas discharge nozzle 7 are attached to the tip of the arm 5, and the arm 5 is moved left and right by a conversion mechanism 13 that converts the rotation of the motor 8 into a linear motion.

The gas discharge nozzle is 5 from the solvent discharge nozzle 6.
It is placed on the rotation center side for about 10 mm and the purpose is to blow the resist removal solvent to the outside of the substrate. The resist removing solvent is controlled by the valve 9 and the gas is controlled by the valve 10.

For example, butyl acetate is used as the resist removing solvent, and nitrogen is used as the gas. A needle-shaped nozzle having a diameter of 0.5 mm is used as the solvent discharge nozzle, and a cone-shaped nozzle having a spread angle of 10 degrees is used as the gas discharge nozzle.

The rotation controller 11 drives the motor 4 and at the same time inputs the position signal of the stage 1 to the arm controller 12 to control the motor 8 so that the arm 5 operates in synchronization with the rotation of the stage 1. As a result, as shown in FIG. 2, the resist on the outer periphery of the photomask 2 of about 2 mm is removed. 2a
Is the outer peripheral portion where the resist is removed.

FIG. 3 is a view showing the position of the tip of the controlled arm 5. In the figure, A is the length of the side of the photomask.

The position of the nozzle from the center of the stage is 1 /
By controlling the curve 15 represented by cos θ, the resist can be removed in a frame shape as indicated by 2a in FIG.

FIG. 4 is a view showing the position of the tip of the controlled arm 5 when the substrate has a rectangular shape. In the case of a rectangle, since the sides have different lengths, the resist is removed in a frame shape by controlling the arm 5 according to the curve 16. In the figure, A is the length of the long side, and B is the length of the short side.

The gas discharge nozzle 7 is effective for more surely flowing the solvent to the outside of the substrate. However, if the number of rotations of the stage 1 is increased, the solvent flows out to the outside of the substrate by centrifugal force, so that the gas discharging nozzle 7 is used. The present invention can be realized without it.

[0016]

As described above, the present invention has the following effects. The resist on the outer periphery of the rectangular substrate can be removed in the shape of a frame to eliminate the generation of particles and realize high-quality substrate processing.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a resist removing apparatus of the present invention.

FIG. 2 is a plan view of a photomask placed on a stage.

FIG. 3 is a diagram showing a position of a tip of a controlled arm 5.

FIG. 4 is a diagram showing the position of the tip of the controlled arm 5 when the substrate has a rectangular shape.

[Explanation of symbols]

1 ... Stage, 2 ... Photomask, 3 ... Holding pin, 4 ... Motor, 5 ... Arm, 6 ... Solvent discharge nozzle, 7 ... Gas discharge nozzle, 8 ... Motor, 9 ... Valve, 10 ... Valve, 11
... Rotation control unit, 12 ... Arm control unit, 13 ... Conversion mechanism,
15 ... Curve, 16 ... Curve.

Claims (4)

[Claims] 1. A method of removing the resist on the periphery of a rectangular substrate coated with a resist, wherein the substrate is placed horizontally on a stage and rotated, and an arm having a nozzle is moved in synchronization with the rotation of the stage, A method of removing resist from the outer periphery of a rectangular substrate, characterized in that a resist removing solvent is discharged from the nozzle. 2. The method for removing resist from the outer periphery of a rectangular substrate according to claim 1, wherein a gas discharging nozzle is added to the arm so that the solvent discharged from the nozzle flows out to the outside of the rectangular substrate. . 3. An apparatus for removing resist on the periphery of a rectangular substrate coated with a resist, a stage for horizontally mounting the substrate, an arm equipped with a solvent discharge nozzle, and a solvent supply for supplying a resist removal solvent to the solvent discharge nozzle. Means and
A resist removing device on the outer periphery of a rectangular substrate, comprising: rotating means for the stage; and driving means for operating the arm in synchronization with the rotating stage. 4. The resist removing apparatus for the outer periphery of a rectangular substrate according to claim 3, wherein a gas discharge nozzle is arranged on the rotation center side of the solvent discharge nozzle and attached to the arm.