KR100757848B1 - Apparatus of treating a substrate in a single wafer type - Google Patents

Abstract

An apparatus for processing a substrate in a single wafer type is provided to prevent the substrate from being polluted due to a process liquid and fumes generated from the process liquid by forming a descending air current in a space. A substrate processing is performed in a housing(110), and a substrate is supported by a support(200) in the housing. A process fluid is supplied onto the substrate by a nozzle(140), and the process fluid is recovered by a recovery member. The support has a rotatable body and an air-stream generating member installed around the body for generating a descending air current in the body. The recovery member is formed in a circular shape along an outer wall of the support, and has a recovering line connected to a recovery container.

Description

Single wafer type processing apparatus {APPARATUS OF TREATING A SUBSTRATE IN A SINGLE WAFER TYPE}

1 is a configuration diagram of a substrate processing apparatus according to the present invention.

2 is a perspective view of the support shown in FIG.

3 is a cross-sectional view taken along line AA ′ of FIG. 2.

4 is a cross-sectional view of a support according to another embodiment of the present invention.

5 is a cross-sectional view of a support according to another embodiment of the present invention.

6 is a cross-sectional view of a support according to another embodiment of the present invention.

7 is a flowchart illustrating a process of a substrate processing apparatus according to the present invention.

8 is a view showing that air flow is generated by the air flow generating member according to the present invention.

Explanation of symbols on the main parts of the drawings

100: sheet type substrate processing apparatus

110: housing

120: chemical recovery member

130: substrate support member

140: nozzle unit

150: nozzle unit driver

160: treatment fluid supply member

200: support

The present invention relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a semiconductor substrate by supplying a processing fluid on the substrate.

The semiconductor manufacturing process is a process for producing a semiconductor integrated circuit chip by performing a series of unit processes continuously and repeatedly. Among these unit processes, an etching process and a cleaning process are processes for removing foreign substances remaining on the wafer.

Generally, the etching process and the cleaning process are divided into a dry processing device and a wet processing device. Among these, the wet processing apparatus has a housing, a substrate supporting member, and a nozzle unit. The housing provides a space therein in which etching and cleaning processes are performed. The substrate support member is rotatably installed inside the housing and fixes the wafer during the process. Then, the nozzle unit sequentially sprays the processing fluids onto the processing surface of the rotating wafer to remove foreign substances remaining on the surface of the wafer.

However, the wet substrate processing apparatus as described above is contaminated inside the housing by the processing fluids used during the process. That is, the etchant, cleaning liquid, and rinse liquid used during the process remain on the inner wall of the housing to contaminate the inside of the housing. The processing liquids remaining on the inner wall of the housing fall back to the processing surface of the substrate and contaminate the substrate.

In the chemical liquid treatment, the inside of the housing is contaminated by fumes generated from the treatment liquid used. The fume generated from the treatment liquid remains in the housing and inside the facility and is re-introduced onto the substrate during the process to contaminate the substrate.

An object of the present invention is to provide a substrate processing apparatus that increases the efficiency of a process of removing foreign matter remaining on a processing surface of a substrate with a predetermined processing liquid.

Moreover, an object of this invention is to provide the substrate processing apparatus which prevents the process surface of a board | substrate from being contaminated by the process liquid and the fume generated from the process liquid.

Moreover, an object of this invention is to provide the substrate processing apparatus which prevents a facility from being polluted by the process liquid and the fume generated from the process liquid.

A substrate processing apparatus according to the present invention for achieving the above object is a housing that provides a space for performing a substrate processing process therein, a support for supporting a substrate in the housing during the process, and processing on a substrate placed on the support And a nozzle portion for supplying fluid, wherein the support includes a rotatable body and an air flow generating member provided around the body to form an air flow in the space from an upper region to a lower region of the space.

According to an embodiment of the present invention, the substrate processing apparatus further includes an exhaust member provided under the housing and exhausting air moved to the lower region to the outside.

According to an embodiment of the present invention, the substrate processing apparatus further includes a recovery member for recovering the processing liquids used in the process, the recovery member is provided in an annular shape along the outside of the outer wall of the support, the inlet is stacked on each other It includes a plurality of recovery bins provided and a recovery line connected to each of the recovery bins.

According to an embodiment of the present invention, the blades are formed at an equal angle with respect to the center of the body, each of which is a spiral shape upwards toward the rotation direction of the body.

According to another embodiment of the invention, the blades are convexly rounded in the direction of rotation of the body.

According to another embodiment of the invention, the blades are concave round in the direction of rotation of the body.

According to another embodiment of the present invention, the blades include a first protrusion protruding from the body and a second protrusion extending in the direction of rotation of the body from the end of the first protrusion.

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Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Portions denoted by like reference numerals denote like elements throughout the specification.

In addition, in the embodiment of the present invention will be described taking the sheet type substrate processing apparatus for performing the cleaning and drying process as an example. However, the present invention can be applied to any semiconductor manufacturing apparatus provided with a substrate supporting member for supporting a substrate.

(Example)

1 is a configuration diagram of a substrate processing apparatus according to the present invention, Figure 2 is a perspective view of the support shown in FIG. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2.

1 to 3, the sheet type substrate processing apparatus 100 according to the present invention may include a housing 110, a treatment liquid recovery member 120, a substrate support member 130, a nozzle unit 140, and a nozzle unit. The driver 150, and the processing fluid supply member 160.

The housing 110 provides a space for performing a cleaning process therein. The housing 110 has a cylindrical shape with an open top. The open upper portion of the housing 110 is used as an entrance and exit of the substrate W during the process.

The processing liquid recovery member 120 recovers the processing liquids injected into the processing surface of the substrate W during the process. The treatment liquid recovery member 120 has first to third recovery cylinders 122, 124, and 126 stacked on top of each other. Each of the first to third recovery containers 122, 124, and 126 is provided annularly along the inner wall of the housing 110.

The first recovery container 122 has a space s1 for recovering the first cleaning liquid therein. In the same manner, the second recovery container 124 has a space s2 for recovering the second cleaning liquid therein, and the third recovery container 126 has a space s3 for recovering the rinse liquid therein. In addition, each of the recovery containers 122, 124, and 126 is partially opened to allow the first and second cleaning liquids and the rinse liquid to be supplied to the processing surface of the substrate W. Each of the first to third recovery containers 122, 124, and 126 receives the treatment liquid into each of the spaces s1, s2, and s3 after introducing the first and second cleaning liquids and the rinse liquid through the opened part. do.

The first recovery line 122a is connected to the space s1 to recover the first cleaning liquid in the space s1. In the same manner, the second recovery line 124a is connected to the space s2 to recover the second cleaning liquid in the space s2, and the third recovery line 126a is connected to the space s3 to connect the space ( s3) Recover the rinse liquid in. Here, the first and second treatment liquids may be different kinds of cleaning liquids, and the third treatment liquid may be a rinse liquid. For example, the first cleaning liquid is a hydrofluoric acid (HF) solution, the second cleaning liquid is a SC-1 (Standard Clean-1) solution, and the rinse liquid is ultrapure water.

The substrate support member 130 supports the substrate W during the process. The substrate support member 130 has a support 200, a rotation shaft 134, and a driver 136. The support 200 supports the substrate thereon. The rotating shaft 134 is installed to be rotatable in the center of the housing 110. One end of the rotating shaft 134 is coupled to the center lower portion of the support 200, and the other end thereof is coupled to the driving unit 136. The driving unit 136 rotates the rotation shaft 134 to rotate the support 200. In addition, the driving unit 136 raises and lowers the rotation shaft 134 to adjust the height of the support 200. In particular, the driving unit 136 adjusts the height of the support 200 so that the treatment liquids used in the cleaning and drying processes are effectively recovered to the first to third recovery containers 122, 124, and 126. Here, a detailed description of the support 200 will be described later.

The nozzle unit 140 injects the processing fluid to the processing surface of the substrate (W). The nozzle unit 140 has at least one nozzle. The nozzle unit driver 150 drives the nozzle unit 140. The nozzle unit driver 150 moves the nozzle unit 140 between the process position (a) and the standby position (b). The process position (a) is a position where the nozzle unit 140 injects the processing fluid to the processing surface of the substrate (W), and the standby position (b) is outside the housing 110 before moving to the process position (a). Waiting position.

The nozzle unit driver 150 has a first arm 152, a second arm 154, and a drive motor 156. The first arm 152 is installed horizontally at the top of the vessel 110. One end of the first arm 152 is coupled to the nozzle unit 140, and the other end of the first arm 152 is coupled to the second arm 154. The second arm 154 is installed perpendicular to the first arm 152. The drive motor 156 rotates and lifts the second arm 154. Therefore, the nozzle unit driver 150 raises and lowers the nozzle unit 140.

The treatment fluid supply member 160 supplies the treatment fluid to the nozzle unit 140. The treatment fluid supply member 160 includes a cleaning liquid supply member 162, a rinse liquid supply member 164, and a dry gas supply member 166. The cleaning liquid supply member 162 has a cleaning liquid supply source 162a and a cleaning liquid supply line 162b. The cleaning liquid supply source 162a stores the first and second cleaning liquids, and the cleaning liquid supply line 162b supplies the first and second cleaning liquids from the cleaning liquid supply source 162a to the nozzle unit 140. The rinse liquid supply member 164 has a rinse liquid supply source 164a and a rinse liquid supply line 164b. The rinse liquid supply source 164a stores the rinse liquid, and the rinse liquid supply line 164b supplies the rinse liquid from the rinse liquid supply source 164a to the nozzle unit 140. The dry gas supply member 166 has a dry gas supply source 166a and a dry gas supply line 164b. The dry gas supply source 166a supplies dry gas, and the dry gas supply line 164b supplies dry gas from the dry gas supply source 166a to the nozzle unit 140. Here, nitrogen gas may be used as the dry gas.

The exhaust member 170 discharges the air in the housing 110 to the outside. The exhaust member 170 has a discharge line 172 and the suction member 174. The discharge line 172 communicates with the space in the housing 110 at the lower side of the housing 110. The discharge line 172 discharges the air in the lower region of the housing 110 to the outside. The suction member 174 is installed on the discharge line 172. The suction member 174 provides flow pressure to the discharge line 172 to force suction of air in the housing 110. As the suction member 174, a vacuum pump may be used. In the present exemplary embodiment, the exhaust member 170 includes the suction member 174, and a method of forcibly discharging the air in the housing 110 by vacuum is described as an example. However, the exhaust member 170 includes the discharge line 172. ) May be provided such that the air moved to the lower region of the housing 110 is naturally discharged by the force of the downdraft.

Hereinafter, the configuration of the support 200 according to an embodiment of the present invention will be described in detail.

2 and 3, the support 200 includes a body 210 and an airflow generating member 220. Body 210 is made of a cylindrical shape. The chucking pins 212 are installed on the upper portion of the body 210. The chucking pins 212 support the substrate (W). The chucking pins 212 are installed at an equal angle with respect to the center of the body 210. Each of the chucking pins 212 chucks or unchucks a portion of the edge of the substrate W during the process.

The airflow generation member 220 includes a plurality of blades 222. The blades 222 are provided on the outer side 214 of the body 210. In one embodiment, the blades 222 protrude from the outer surface 214 of the body 210. The blades 222 are disposed at an equal angle with respect to the center of the body 210. Each of the blades 222 has a spiral shape upward toward the rotational direction X of the body 210. In addition, the blades 222 have a surface 222 that collides with the air in the housing 110 when the body 210 is rotated. When the body 210 rotates, the surface 222 induces a flow of air collided with air in the housing 110 in a downward direction.

Alternatively, referring to FIG. 4, the airflow generation member 320 according to another embodiment of the present invention has blades 320 in which a surface 322 that collides with air during processing is rounded. The blade 320 of the structure as described above, when the body 310 is rotated during the process, induces a large amount of air in the downward direction, generates a strong air flow down stream.

Alternatively, referring to FIG. 5, in the airflow generating member 420 according to another embodiment of the present invention, the surface 422 colliding with air during the process is opposite to the surface 322 of the blade 320 described above. It is formed in the direction. Compared with the blade 320 according to another embodiment of the present invention, the blades 420 having the above-described structure are less likely to generate a strong downdraft during the process, but the air of the blade 420 when the body 410 rotates. Since the resistance is small, the vortex may be prevented from occurring in the space between the body 410 and the housing 110.

Alternatively, referring to FIG. 6, the airflow generating member 520 according to another embodiment of the present invention includes a blade 520 having a first protrusion 522 and a second protrusion 524. The first protrusion 522 has a shape having a surface 222 of the blade 220 according to an embodiment of the present invention. The second protrusion 524 extends to be inclined in the rotation direction X from the first protrusion 522. The airflow generating member 520 having the structure as described above, when the body 510 is rotated during the process, guides a larger amount of air downward, thereby generating a lower airflow of a stronger flow.

In this embodiment, although the airflow generation member according to the four embodiments is provided, the airflow generation member is for forming the downdraft in the space in the housing 110 in which the substrate treatment process is performed, and the structure and shape thereof are variously varied. Modifications and variations are possible.

Hereinafter, the process of the substrate processing apparatus 100 having the above-described structure will be described in detail. Here, detailed descriptions of the same components as those described above will be omitted, and the same reference numerals will be given.

7 is a flowchart illustrating a process of a substrate processing apparatus according to the present invention. 8 is a view showing that air flow is generated by the air flow generating member according to the present invention.

Referring to FIG. 7, when the process of the substrate processing apparatus 100 is started, the substrate W is loaded on the support member 1320 (S110). When the substrate W is loaded, the chucking pins 212 of the support 200 chuck a portion of the edge of the substrate W. When the substrate W is fixed to the support 200, the driving unit 136 rotates the support 200 at a process speed.

Due to the rotation of the support 200, the inside of the housing 110 is provided with an airflow moving from the upper region to the lower region in the housing 110 (S120). Air flow is formed as follows. 8 and 9, when the support 200 is rotated, the surface 222 provided on each blade 222 collides with air in the housing 110. The flow of air impinging the blade 222 is directed downward along the helical face 222. Therefore, the downdraft is formed in the space in the housing 110. The lowered air is discharged to the outside of the housing 110 by the exhaust member 170 in the lower region of the housing 110.

When the downdraft is formed in the space in the housing 110, the cleaning process and the drying of the substrate W are performed (S130). The cleaning process is as follows. The nozzle unit driver 150 moves the nozzle unit 140 from the standby position b to the process position a. The valve 162b 'is opened, the supply line 162b supplies the first cleaning liquid from the cleaning liquid supply source 162a to the nozzle unit 140, and the nozzle unit 140 supplies the first cleaning liquid supplied with the substrate W. Spray to the treatment surface of The injected first cleaning liquid is moved to the first recovery container 122 after removing foreign matter remaining on the substrate W processing surface. The first cleaning liquid contained in the first recovery container 122 is recovered through the first recovery line 122a. When the first cleaning of the substrate W is completed, the cleaning liquid supply source 164a supplies the second cleaning liquid to the nozzle unit 140, and the nozzle unit 140 supplies the supplied second cleaning liquid to the processing surface of the substrate W. Spray on. The injected second cleaning liquid is secondarily cleaned of the first cleaning liquid remaining on the processing surface of the substrate W, and then moved to the second recovery container 124. The second cleaning liquid contained in the second recovery container 124 is recovered through the second recovery line 124a.

When the cleaning of the substrate W is completed, the valve 164b 'is opened, and the supply line 164b supplies the rinse liquid from the rinse liquid supply source 164a to the nozzle unit 140. The rinse liquid injected through the nozzle unit 140 is received in the third recovery container 126 after removing the cleaning liquid remaining on the processing surface of the substrate W. The rinse liquid contained in the third recovery container 126 is recovered through the third recovery line 126.

When the rinse of the substrate W is completed, the valve 166b ′ is opened, and the supply line 166b supplies the dry gas from the dry gas supply source 166a to the nozzle unit 140. The dry gas injected through the nozzle unit 140 dries the substrate W (S140).

When drying of the substrate W is completed, the driving unit 136 stops the rotation of the support 200, and the chucking pins 212 unchuck the substrate W. In addition, the driving unit 136 raises the support 200, thereby raising the substrate W to the outside of the housing 110 through the open upper portion of the housing 110. In addition, the substrate W is unloaded from the substrate processing apparatus 100 by a robot arm (not shown) provided at one side of the facility.

The substrate processing apparatus described above forms a downdraft in a space in the housing 110 during the substrate processing process. Air in the housing 110 is moved from the upper region to the lower region of the housing 110 and then efficiently discharged to the outside of the housing 110. Thus, floating contaminants such as particles in the housing 110 can be effectively evacuated.

In addition, the fumes generated from the treatment liquids used in the process can be efficiently exhausted from the space where the process is performed. Therefore, the contamination of the equipment is prevented and the processing surface of the substrate W is prevented from being contaminated by the fume during the process. In addition, by preventing the leakage of toxic gas to the outside to increase the safety of the working environment.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the substrate processing apparatus according to the present invention forms and discharges a downdraft in the space where the substrate processing process is performed. Therefore, the present invention prevents the substrate from being contaminated by the treatment liquid and the fume generated from the treatment liquid used in the substrate treatment process.

In addition, the substrate processing apparatus according to the present invention effectively discharges suspended contaminants such as particles in the space where the substrate processing process is performed.

In addition, the substrate processing apparatus according to the present invention prevents leakage of toxic gases from the space where the substrate processing process is performed, thereby increasing the safety of the working environment.

Claims (8)

delete delete In the substrate processing apparatus, A housing providing a space therein for performing a substrate processing process; A support for supporting a substrate in the housing during the process; A nozzle unit for supplying a processing fluid onto a substrate placed on the support, and It includes a recovery member for recovering the treatment liquids used in the process, The support, Rotatable body, An airflow generating member provided around the body to form an airflow in the space from an upper region to a lower region of the space, The recovery member, And a plurality of recovery bins provided in an annular shape along an outer side of the outer wall of the support, the inlets being stacked so as to be stacked on each other, and a recovery line connected to each of the recovery bins. delete delete In the substrate processing apparatus, A housing providing a space therein for performing a substrate processing process; A support for supporting a substrate in the housing during the process; A nozzle unit for supplying a processing fluid on the substrate placed on the support, The support, Rotatable body, An airflow generating member provided around the body to form an airflow in the space from an upper region to a lower region of the space, The air flow generating member, And a plurality of blades protruding from an outer surface of the body and having a shape convexly rounded in the rotational direction of the body. In the substrate processing apparatus, A housing providing a space therein for performing a substrate processing process; A support for supporting a substrate in the housing during the process; A nozzle unit for supplying a processing fluid on the substrate placed on the support, The support, Rotatable body, An airflow generating member provided around the body to form an airflow in the space from an upper region to a lower region of the space, The air flow generating member, And a plurality of blades protruding from an outer surface of the body and having a shape concave round in a rotational direction of the body. delete

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