JPH01157540A - ボンデイング装置における試料持ち上げ装置 - Google Patents

ボンデイング装置における試料持ち上げ装置

Info

Publication number
JPH01157540A
JPH01157540A JP62315167A JP31516787A JPH01157540A JP H01157540 A JPH01157540 A JP H01157540A JP 62315167 A JP62315167 A JP 62315167A JP 31516787 A JP31516787 A JP 31516787A JP H01157540 A JPH01157540 A JP H01157540A
Authority
JP
Japan
Prior art keywords
holder
carrier
pin
sample stage
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62315167A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546979B2 (OSRAM
Inventor
Shigeru Fukuya
福家　滋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP62315167A priority Critical patent/JPH01157540A/ja
Publication of JPH01157540A publication Critical patent/JPH01157540A/ja
Publication of JPH0546979B2 publication Critical patent/JPH0546979B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP62315167A 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置 Granted JPH01157540A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62315167A JPH01157540A (ja) 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62315167A JPH01157540A (ja) 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置

Publications (2)

Publication Number Publication Date
JPH01157540A true JPH01157540A (ja) 1989-06-20
JPH0546979B2 JPH0546979B2 (OSRAM) 1993-07-15

Family

ID=18062229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62315167A Granted JPH01157540A (ja) 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置

Country Status (1)

Country Link
JP (1) JPH01157540A (OSRAM)

Also Published As

Publication number Publication date
JPH0546979B2 (OSRAM) 1993-07-15

Similar Documents

Publication Publication Date Title
US4923054A (en) Wafer transfer apparatus having an improved wafer transfer portion
KR100244688B1 (ko) 웨이퍼 반송장치
US5181646A (en) Lead frame holding apparatus for use in wire bonders
US5009590A (en) Method and apparatus for preheating semiconductor chips
US5755373A (en) Die push-up device
JPH0546979B2 (OSRAM)
JPS60258020A (ja) ガラス板のマ−キング装置
US5823418A (en) Die transporting device
JPS6359807B2 (OSRAM)
JP2817080B2 (ja) ボンディング装置
JPS63169242A (ja) 基板矯正保持方法及びその装置
JPH09147786A (ja) 基板保持方法および該方法に用いる基板保持機構
CN222004605U (zh) 一种手提扣的压合机构
CN223889346U (zh) 一种工件组装用拾取装置
JPH0442549A (ja) ボンダ用クランパ装置
CN219904845U (zh) 电子元器件全自动套管成型编带一体机的套管装套机构
KR950000559Y1 (ko) 분리기능을 갖는 칩 이송장치
JP2853889B2 (ja) 基板移載装置
KR19980023281A (ko) 칩 픽업장치
JP3701562B2 (ja) 遊技機製造用釘打装置
CN115354451A (zh) 一种撬缝缝纫机的抬牙送料装置
SU1433757A1 (ru) Устройство дл подачи деталей
JPH0344642Y2 (OSRAM)
KR910008945Y1 (ko) 리이드프레임 세퍼레이터
JP2918274B2 (ja) ペレット突き上げ装置