JPH01155699A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To prevent a support pin from changing in position so as to eliminate a setup operation by a method wherein a pin is made to move near to a packaging position by a second drive section and supported by a first drive section and supported by a first drive section from the rear of a printed substrate. CONSTITUTION:A printed substrate 1 is positioned at a prescribed position on a printed substrate conveyor 2. A device head 3 sucks an electronic component 5 from a component feeder 4 and mounts it on a specified position on the substrate 1, where the specified position is preset basing on a program. In a mounting process, a support pin 6 supports the component 5 from the rear of the substrate 1. The pin 6 is driven by a first drive section 7 which can perform positioning optionally in a vertical direction and a second drive section which can perform positioning optionally throughout the whole rear of the substrate 1. By these processes, the pin 6 is prevented from changing in position, and thus a setup operation can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting device for mounting electronic components, and more particularly to a support device for a printed circuit board.

BACKGROUND OF THE INVENTION In recent years, electrical products have become smaller and lighter, and printed circuit boards themselves have also become smaller and thinner. In such a situation,
Pudding! when mounting electronic components at high speed and with high precision!
-, d The printed circuit board support device plays an important role in order to prevent the mounting position of electronic components from shifting due to vibration or deflection of the board.

FIG. 4 is an overall view of a conventional electronic component mounting apparatus. The printed circuit board 101 is positioned at a predetermined position on the printed circuit board transport section 102. The mounting head 103 picks up the electronic component 105i from the component supply section 104, and mounts the electronic component 106 at a predetermined position on the print 14' board 101 determined in advance by a program. During installation, support pins 106 support the printed circuit board 1α from the surface in order to prevent the p'' girder component 105 from shifting due to vibrations caused by warping or deflection of the printed circuit board or the impact of installation. The support pin 106 is inserted into a flat plate 107 having holes provided at regular intervals in a grid pattern.The insertion position of the support pin 106 is the position closest to the device position of the inner basket part 105 and on the back surface of the printed circuit board 101. In order to avoid interference between the support pins 106 and electronic components on the back side while the printed circuit board 101 is being transported, the flat plate 107 is spaced at regular intervals by the cylinder 108. Move up and down.Flat plate 1
Since the upper limit position of 07 is constant, when mounting on printed circuit boards of different thicknesses, in order to keep the height of the mounting surface constant,
Correspond by using support pins of different heights.

Problems to be Solved by the Invention As described above, in the conventional technology, it is necessary to change the position of the support pin every time the type of printed circuit board is changed.

In recent years, in production sites where low-volume, high-mix production has become the mainstream, there is a drawback that the demand for reducing the time required in addition to the original installation time as much as possible cannot be satisfied.

Furthermore, it is necessary to replace all the support pins every time the thickness of the printed circuit board changes, which increases the number of pin types, making management complicated.If used incorrectly, there is a risk that electronic components may not be properly installed. This also poses a quality problem.

Means for Solving the Problems In order to solve the above-mentioned problems, the electronic component mounting apparatus of the present invention has a pin that supports the printed circuit board from the back side of the position where the electronic component is mounted on the printed circuit board, and a pin that supports the printed circuit board in the vertical direction. Consisting of a first drive unit that drives the pin to position it arbitrarily, and a second drive unit that drives the pin to position it at an arbitrary position on the bottom surface of the printed circuit board, the device supports the vicinity of the mounting position from the bottom surface of the printed circuit board when electronic components are mounted. It is structured like this.

Function: With the above configuration, the present invention supports the lower surface of a printed circuit board at any position and at any height according to a pre-registered program. Therefore, there is no need to change the setup depending on the type and thickness of the printed circuit board, so that sufficient operating time for the machine can be ensured.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 is an overall view of one embodiment of the present invention.

The printed circuit board 1 is positioned at a predetermined position in the printed circuit board transport section 2. The device head 3 picks up the microcomponents 5 from the component supply section 4 and mounts the electronic components 6 at predetermined positions on the printed circuit board 1 determined in advance by a program. During installation, support pins e support the printed circuit board 1 from the back surface in order to prevent the electronic components 6 from shifting due to warping or deflection of the printed circuit board or vibrations caused by the impact of the installation. The support pin 6 is driven by a first drive section 7 that can be positioned arbitrarily in the vertical direction, and a second drive section 8 that can be positioned arbitrarily over the entire lower surface of the printed circuit board 1.

FIG. 2 is a sectional view of the first drive section 7. As shown in FIG. The support pin 6 is guided to the guide shirt 10 via a guide block 9, and is slidable in the vertical direction.
A moving part 11 of a linear motor is fixed to the shaft, and arbitrary positioning in the vertical direction is possible by the linear motor 12. Therefore, even if the thickness of the printed circuit board changes, it is possible to lift the top surface to a fixed position, and the mounting of electronic components can be stabilized.

FIG. 3 is a plan view of the second drive section. Support pin e
The first drive section 7 having a Y direction is guided in the Y direction in the figure by a Y direction rail (v13). A nut 14 is fixed to the first drive section 7, and the ball screw 16 rotates by a motor 16, thereby positioning the nut 14 at an arbitrary position in the Y direction in the figure. Reference numeral 17 denotes an X-axis, which has the same structure as the Y-direction positioning mechanism, and arbitrarily positions the support pin 6 in the X-direction in the figure.

With the above configuration, the support pin 6 can be positioned arbitrarily within the range 18 in the figure.

Therefore, the support pins 6 can support electronic components at the most appropriate position regardless of the thickness or size of the printed circuit board, so even if the type of printed circuit board changes, the pin position or length does not need to be changed. Can be installed.

Effects of the Invention As described above, in the electronic component mounting apparatus of the present invention, there is no need to change the position of the support pin even if the type of printed circuit board changes, so the setup work when changing the model can be significantly reduced. Furthermore, even if the thickness of the printed circuit board differs, there is no need to replace the pins with pins of different lengths, which greatly reduces setup work.

Furthermore, since there is no longer a need for support pins at inappropriate positions or lengths, there is the advantage that stability when electronic components are mounted is improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electronic component mounting device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the first drive section, and FIG.
A plan view of the drive section and FIG. 4 are perspective views of a conventional electronic component mounting apparatus. DESCRIPTION OF SYMBOLS 1...Printed circuit board, 5...Electronic component, 6...Support pin, 7...First drive section, 8... Second driving section. Name of agent: Patent attorney Toshio Nakao and one other person E-
-- 17 Ho 6 Tojiso 71 Years Old 1n, 1 Garrison Officer 8-"k2q() Figure 2 Q Figure 3 Figure 4

Claims (1)

[Claims] An electronic component mounting apparatus for mounting electronic components on a printed circuit board, comprising: a pin that supports the reprinted circuit board from the back side of the position where the electronic component is mounted on the printed circuit board; and a first drive section that drives the pin to arbitrarily position the pin in the vertical direction; The pin is positioned at an arbitrary position on the lower surface of the printed circuit board and the pin is moved to the vicinity of the mounting position when an electronic component is mounted. An electronic component mounting device configured such that the pin supports a printed circuit board from a lower surface.