JPH01154472A - 接合線材の接続装置 - Google Patents
接合線材の接続装置Info
- Publication number
- JPH01154472A JPH01154472A JP31136887A JP31136887A JPH01154472A JP H01154472 A JPH01154472 A JP H01154472A JP 31136887 A JP31136887 A JP 31136887A JP 31136887 A JP31136887 A JP 31136887A JP H01154472 A JPH01154472 A JP H01154472A
- Authority
- JP
- Japan
- Prior art keywords
- support
- bonded
- wire
- sealant
- coating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 239000012943 hotmelt Substances 0.000 claims description 73
- 239000003795 chemical substances by application Substances 0.000 claims description 67
- 239000000565 sealant Substances 0.000 claims description 53
- 238000000576 coating method Methods 0.000 claims description 47
- 239000011248 coating agent Substances 0.000 claims description 44
- 239000011342 resin composition Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 12
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000010137 moulding (plastic) Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 abstract description 46
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000005304 joining Methods 0.000 description 30
- -1 polypropylene Polymers 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000006260 foam Substances 0.000 description 8
- 239000003349 gelling agent Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 125000004442 acylamino group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 235000015110 jellies Nutrition 0.000 description 3
- 239000008274 jelly Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000007666 vacuum forming Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 108010039491 Ricin Proteins 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000003981 vehicle Substances 0.000 description 2
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 description 1
- QIVRABJQTNPYAI-QFIPXVFZSA-N (2s)-n,n'-dibutyl-2-(dodecanoylamino)pentanediamide Chemical compound CCCCCCCCCCCC(=O)N[C@H](C(=O)NCCCC)CCC(=O)NCCCC QIVRABJQTNPYAI-QFIPXVFZSA-N 0.000 description 1
- KZRXPHCVIMWWDS-AWEZNQCLSA-N (4S)-4-amino-5-dodecanoyloxy-5-oxopentanoic acid Chemical compound CCCCCCCCCCCC(=O)OC(=O)[C@@H](N)CCC(O)=O KZRXPHCVIMWWDS-AWEZNQCLSA-N 0.000 description 1
- XPLYRDXRJBZVRL-UQKRIMTDSA-N (4S)-4-amino-5-dodecanoyloxy-5-oxopentanoic acid N-butylbutan-1-amine Chemical compound CCCCNCCCC.CCCCCCCCCCCC(=O)OC(=O)[C@@H](N)CCC(O)=O XPLYRDXRJBZVRL-UQKRIMTDSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000001467 acupuncture Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DNSISZSEWVHGLH-UHFFFAOYSA-N butanamide Chemical compound CCCC(N)=O DNSISZSEWVHGLH-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000003869 coulometry Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical class CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229940071085 lauroyl glutamate Drugs 0.000 description 1
- 125000000400 lauroyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- RQTRYXKWNDRECO-HKBQPEDESA-N n-[(2s)-1-(dodecylamino)-1-oxo-3-phenylpropan-2-yl]dodecanamide Chemical compound CCCCCCCCCCCCNC(=O)[C@@H](NC(=O)CCCCCCCCCCC)CC1=CC=CC=C1 RQTRYXKWNDRECO-HKBQPEDESA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31136887A JPH01154472A (ja) | 1987-12-09 | 1987-12-09 | 接合線材の接続装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31136887A JPH01154472A (ja) | 1987-12-09 | 1987-12-09 | 接合線材の接続装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01154472A true JPH01154472A (ja) | 1989-06-16 |
| JPH0447432B2 JPH0447432B2 (enrdf_load_stackoverflow) | 1992-08-03 |
Family
ID=18016330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31136887A Granted JPH01154472A (ja) | 1987-12-09 | 1987-12-09 | 接合線材の接続装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154472A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0353466A (ja) * | 1989-07-19 | 1991-03-07 | Three Bond Co Ltd | 連結部材の被覆材 |
| DE9318575U1 (de) * | 1993-12-04 | 1995-03-30 | Beiersdorf Ag, 20253 Hamburg | Selbstklebendes Isolationsetikett |
| JP2013211125A (ja) * | 2012-03-30 | 2013-10-10 | Yazaki Corp | 端末止水、防水及び防食構造及び端末止水、防水及び防食方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632925U (enrdf_load_stackoverflow) * | 1979-08-21 | 1981-03-31 | ||
| JPS59119576U (ja) * | 1983-02-01 | 1984-08-11 | 日動電工株式会社 | 電線接続部保護カバ− |
| JPS6080676U (ja) * | 1983-11-09 | 1985-06-04 | 古河電気工業株式会社 | 通信ケ−ブルの接続部保護箱 |
| JPS60146474A (ja) * | 1984-01-11 | 1985-08-02 | 沖電気工業株式会社 | 防水型ケ−ブルの接続方法 |
| JPS61271760A (ja) * | 1985-05-22 | 1986-12-02 | レイケム・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 電気要素のための封入物品および方法 |
| JPS6215775U (enrdf_load_stackoverflow) * | 1985-07-12 | 1987-01-30 |
-
1987
- 1987-12-09 JP JP31136887A patent/JPH01154472A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632925U (enrdf_load_stackoverflow) * | 1979-08-21 | 1981-03-31 | ||
| JPS59119576U (ja) * | 1983-02-01 | 1984-08-11 | 日動電工株式会社 | 電線接続部保護カバ− |
| JPS6080676U (ja) * | 1983-11-09 | 1985-06-04 | 古河電気工業株式会社 | 通信ケ−ブルの接続部保護箱 |
| JPS60146474A (ja) * | 1984-01-11 | 1985-08-02 | 沖電気工業株式会社 | 防水型ケ−ブルの接続方法 |
| JPS61271760A (ja) * | 1985-05-22 | 1986-12-02 | レイケム・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 電気要素のための封入物品および方法 |
| JPS6215775U (enrdf_load_stackoverflow) * | 1985-07-12 | 1987-01-30 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0353466A (ja) * | 1989-07-19 | 1991-03-07 | Three Bond Co Ltd | 連結部材の被覆材 |
| DE9318575U1 (de) * | 1993-12-04 | 1995-03-30 | Beiersdorf Ag, 20253 Hamburg | Selbstklebendes Isolationsetikett |
| JP2013211125A (ja) * | 2012-03-30 | 2013-10-10 | Yazaki Corp | 端末止水、防水及び防食構造及び端末止水、防水及び防食方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0447432B2 (enrdf_load_stackoverflow) | 1992-08-03 |
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