JPH01152448A - Image forming material - Google Patents

Abstract

PURPOSE:To obtain an image forming material capable of forming a desired picture image on a base material by stripping, by incorporating a solvent-soluble linear satd. polyester resin, a photopolymerizable unsatd. compd., a photopolymn. initiator, and a polyisocyanate compd. into a photosensitive layer as essential components. CONSTITUTION:A photosensitive layer contg. a solvent-soluble linear satd. polyester resin, a photopolymerizable unsatd. compd., a photopolymn. initiator, and a polyisocyanate compd. as essential components is formed on a thin film of metal or of a metal compd. formed on a base material, and a base film is laminated thereon without interposing an adhesive layer. Thus, an image forming material having high bonding strength of the photosensitive layer to the base film is obtd. With this material, a picture image of a desired pattern comprising a metal or a metal compd. is formed on a base material by stripping off the photosensitive layer and the base film integrally after executing a pattern exposure from the base film side.

Description

Detailed Description of the Invention [Industrial Field of Application] This invention relates to patterned exposure, in which a thin film of a metal or metal compound, a photosensitive layer, and a support consisting of a polyethylene terephthalate film are laminated in this order on a base material. The present invention relates to an image forming material capable of forming a desired image by a peeling operation without requiring wet development or etching operations.

[Conventional technology]

Techniques for forming desired images using photosensitive film have been known for a long time. In this method, a photosensitive film is laminated on a laminated substrate consisting of a conductive layer such as copper foil on an insulating substrate, and after pattern exposure, wet development and etching are performed to form a conductive layer in a desired pattern on the insulating substrate. It forms images. In addition, when using a peelable development type photosensitive film in which a photosensitive layer made of a photopolymerizable composition layer is provided on a transparent support, the transparent support can be peeled off after patterned exposure.
A cured patterned photosensitive layer can be formed on the conductive layer, in which case wet development is no longer necessary and images similar to those described above can be formed by subsequent etching operations.

However, with these image forming techniques, it is necessary to carry out an etching operation after patterned exposure, and, except for the peel development type, it is also necessary to carry out a wet development process, which has the disadvantage of complicating the image forming process. In addition, the use of etching solutions and developing solutions has various disadvantages, such as being unfavorable from a public health standpoint and increasing costs.

Therefore, as an image forming material that avoids these disadvantages,
In some cases, a thin film of metal or metal compound is provided on a base material to form an image, and a photosensitive layer is directly formed on this (Japanese Patent Application Laid-open No. 79027/1989), or a thin film of a metal or metal compound is provided on the base material to form an image. A structure in which support films are laminated via a suitable adhesive layer has been proposed (Japanese Unexamined Patent Publication No. 53-3215). These image-forming materials increase the adhesive force between the photosensitive layer and the above-mentioned thin film in the exposed area by patternwise exposure from the photosensitive layer side, and after exposure, the adhesive force between the photosensitive layer or this and the support film via an adhesive layer is formed. By performing a peeling operation, the thin film in the exposed area where the adhesive strength has increased is peeled off and removed together, and the thin film in the non-exposed area remains on the substrate as a patterned image.

That is, in the image forming materials according to these proposals,
By performing a patterned exposure and a peeling operation, a desired image can be formed on a substrate without requiring an etching operation as in the conventional method, and without requiring a wet development process before the etching operation. Therefore, the process for forming an image is simplified, and problems such as public health problems and high costs associated with the use of etching solutions and developing solutions are solved.

[Problems to be Solved by the Invention] However, although the image forming material according to the above proposal has the above-mentioned advantages, it has the following problems that need to be overcome. First, with materials in which only a photosensitive layer is formed on a thin film of metal or metal compound provided on a base material, there is a problem that the strength of the photosensitive layer cannot be maintained sufficiently during peeling operations, making it difficult to perform precise peeling operations. there were. In addition, with materials in which a support film is formed with the photosensitive layer via an adhesive layer, the strength during peeling can be maintained, but it is necessary to apply the adhesive on the photosensitive layer or support film. , unavoidable disadvantages in the manufacturing process of image forming materials,
There is also the problem of high costs associated with the use of adhesives, and in addition, the presence of the adhesive layer tends to adversely affect the integral peeling operation between the photosensitive layer and the support film via the adhesive layer, making it difficult to precisely There was still a problem with the peeling operation.

Therefore, this invention makes it possible to form an image of a desired pattern on a substrate by patterned exposure and peeling operation similar to those related to the above-mentioned proposal. It is an object of the present invention to provide an image-forming material that is essentially free from the above-mentioned problems and has higher industrial utility value.

[Means for solving problems]

As a result of intensive studies to achieve the above object, the inventors have discovered that a photosensitive layer formed on a thin film of metal or metal compound provided on a base material is composed of a specific composition, and When a specific support film is laminated on the photosensitive layer and the support film without intervening an adhesive layer, an image forming material with high adhesive strength between the photosensitive layer and the support film can be obtained, and according to this material, the support film side By peeling off the photosensitive layer and the support film together after patterned exposure, the metal or metal compound can be removed from the base material without the need for wet development or etching as in the above proposal. It is possible to form an image with a desired pattern, and in this case, the above-mentioned support film can maintain sufficient strength during the peeling operation. This invention was completed based on the knowledge that problems in peeling operations can be completely avoided.

That is, in the present invention, a thin film of a metal or metal compound, a photosensitive layer, and a support consisting of a polyethylene terephthalate film are laminated in this order on a base material, and the photosensitive layer and the photosensitive layer in the exposed area are formed by patterned exposure from the side of the support. The adhesive force with the thin film increases, and when the support and the photosensitive layer are peeled off after this exposure, the thin film in the exposed area where the adhesive force has increased is peeled off and removed, leaving the unexposed surface on the base material. An image forming material capable of forming an image by a peeling operation, in which the above-mentioned thin film remains as an image, and the above-mentioned photosensitive layer comprises a solvent-soluble linear saturated polyester resin, a photopolymerizable unsaturated compound, a photopolymerization initiator and The present invention relates to an image forming material characterized by containing a polyisocyanate compound as an essential component.

[Structure and operation of the invention] The base material in this invention is not particularly limited as long as it has a smooth surface and a thin film of metal or metal compound can be formed thereon, and various materials such as glass and plastic can be used. A material made of is used. Although the shape is not particularly limited, sheet-like or film-like materials are generally preferably used. Examples of the above-mentioned plastics include polyester, polyamide, polyimide, polyolefin, polycarbonate, polystyrene, vinyl polymerization type polymer, cellulose derivative, and the like.

The metal or metal compound thin film provided on this base material to form an image includes aluminum, copper, gold,
Made of silver, tin, nickel, chromium, zinc, tin oxide, indium oxide, zinc oxide, silicon oxide, silver bromide, silver sulfide, zinc sulfide, magnesium fluoride, etc., with a thickness of 20 to 1
,000 nm thin film.

The photosensitive layer in this invention contains a solvent-soluble linear saturated polyester resin, a photopolymerizable unsaturated compound, a photopolymerization initiator, and a polyisocyanate compound as essential components, and optionally a thermal polymerization inhibitor, a plasticizer, It is composed of a composition containing a coloring agent, a photopolymerization initiation accelerator, a filler, an adhesion promoter, etc., and the thickness thereof is usually preferably in the range of 1 to 30 μm.

Solvent-soluble linear saturated polyester resin is a polymer whose crystallinity is reduced by co-condensing terephthalic acid and ethylene glycol with other appropriate polybasic acids or polyols, and its average molecular weight It is a polymer that is a low condensate, usually having a molecular weight of about 30,000 or less, and has a carboxyl group or a hydroxyl group at both ends of the molecule and is soluble in many solvents. Commercially available products include Byron-200 and 300 manufactured by Toyobo Co., Ltd., Nisperu 1310 and 1510° manufactured by Hitachi Chemical, and Polyester-3P-170 and LP manufactured by Nippon Gosei Chemical Industry Co., Ltd.
-011 etc. are mentioned.

Such a solvent-soluble linear saturated polyester resin has a film-forming ability and functions as a binder for other components of the photosensitive layer, such as a photopolymerizable unsaturated compound, a photoinitiator, and a polyisocyanate compound. In addition, it greatly contributes to improving the adhesive strength between the photosensitive layer and a support made of polyethylene terephthalate film that is laminated on the photosensitive layer containing these components without intervening an adhesive layer. In addition to the above-mentioned polyester resins, various polymers such as chlorinated polyethylene and polymethyl methacrylate may be used in combination as the PAYIDA polymer, but in this case, the above-mentioned polyester resin is the entire polymer. It is preferable that the amount is 1% by weight or more, preferably 10% by weight or more, even without the use of a middle support. If the amount of the polyester resin is too small, problems tend to occur in terms of adhesive strength with the support film.

Photopolymerizable unsaturated compounds include monoethylenically unsaturated compounds that have one ethylenically unsaturated bond in their molecule, and polyethylenically unsaturated compounds that have two or more of the above bonds in their molecule. However, it is particularly preferred to use the latter polyethylenically unsaturated compounds. This photopolymerizable unsaturated compound is not limited to one type, but may be used in combination of two or more types.

Examples of monoethylenically unsaturated compounds include acrylic acid or its esters, methacrylic acid or its esters, acrylamides, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, N-vinyl compounds, styrenes, These include crotonic acid esters.

Specific examples of acrylic esters include propyl acrylate, butyl acrylate, amyl acrylate,
2-ethylhexyl acrylate, octyl acrylate, etc.; methacrylate esters include methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, etc.; acrylamides include acrylamide, N-alkyl group is methyl group, ethyl group, etc. basis,
Butyl group, isopropyl group, tert-butyl group, 2-
N-alkyl acrylamide, which consists of an ethylhexyl group, etc., is methacrylamide, and N-alkyl methacrylate, whose N-alkyl group is a methyl group, ethyl group, isopropyl group, tert-butyl group, 2-ethylhexyl group, etc. There are amides, etc.

In addition, allyl compounds include allyl esters such as allyl acetate, allyl caproate, allyl caprylate, allyl laurate, and allyl palmitate, and the vinyl ethers include hexyl vinyl ether, octyl vinyl ether,
Alkyl vinyl ethers such as decyl vinyl ether and 2-ethylhexyl vinyl ether, vinyl esters such as vinyl butyrate, vinyl isobutyrate, vinyl trimethyl acetate, vinyl diethyl acetate,
Vinyl valerate, vinyl caproate, etc., N-vinyl compounds such as N-vinylpyrrolidone, styrenes such as styrene, methylstyrene, chloromethylstyrene, alkoxystyrene, halogenated styrene, styrene benzoate, etc., and crotonic acid. Esters include methyl crotonate, ethyl crotonate, butyl crotonate, hexyl crotonate, and isopropyl crotonate.

Next, examples of polyethylenically unsaturated compounds include polyacrylates and polymethacrylates of polyhydric alcohols. The polyhydric alcohol mentioned above is
Polyethylene glycol, polypropylene oxide, polybutylene oxide, (β-hydroxyethoxy)benzene, glycerin, diglycerin, neopentyl glycol, trimethylolpropane, trimethylolpropane, pentaerythritol, dipentaerythritol,
Sorbitan, sorbitol, 1,4-butanediol,
1,2,4-butanetriol, 2-butenoto-4-diol, 2-butyl-2-ethyl-propanediol,
Examples include 2-butenoto-4-diol, 1,3-propanediol, triethanolamine, decalindiol, and 3-chloroto-2-propanediol.

In addition, other examples of polyethylenically unsaturated compounds include:
There are acrylate oligomers and methacrylate oligomers having two or more acryloyl groups or methacryloyl groups in the molecule, which are commercially available under the names of oligoester acrylate, oligoester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, urethane methacrylate, etc.

Such a photopolymerizable unsaturated compound is usually 5 to 200 parts by weight, particularly preferably 5 to 200 parts by weight, per 100 parts by weight of the solvent-soluble linear saturated polyester resin (total amount including other binder polymers when used together). is preferably in the range of 10 to 100 parts by weight. If it is too small or too large, it will be difficult to form precise images due to the peeling operation after patterned exposure, which is not preferable.

Examples of the photopolymerization initiator include those known as polymerization initiators for the photopolymerizable unsaturated compounds, such as carbonyl compounds, organic sulfur compounds, peroxides, redox compounds, azo and diazo compounds, and photoreducible dyes. Both can be used.

The above carbonyl compounds include benzoin, benzophenone, anthraquinone, 2-methylanthraquinone, 2-tert-butylanthraquinone, 9.1
Examples of organic sulfur compounds include dibutyl disulfide, dioctyl disulfide, dibenzyl disulfide, diphenyl disulfide, dibenzoyl disulfide, diacetyl disulfide, etc. .

In addition, as peroxides, hydrogen peroxide, g-tert-
Butyl peroxide, benzoyl peroxide, methyl ethyl ketone peroxide, etc. are used as redox compounds. Examples of azo and diazo compounds include diiron ion and peroxide, α・α-azobisisobutyronitrile, 2-azobis-2-methylbutyronitrile, 1-
Examples of photoreducible dyes include azobis-cyclohexanecarbonitrile and diazonium salt of p-aminodiphenylamine, and examples of photoreducible dyes include rose bengal, erythrosin, eosin, acriflavin, riboflavin, and thionin.

These photopolymerization initiators may be used alone or in combination of two or more. The amount used may be generally in the range of 01 to 20 parts by weight per 100 parts by weight of the above-mentioned solvent-soluble linear saturated polyester resin (total amount including other binder polymers when used together).

Polyisocyanate compounds include various aromatic, aliphatic, and alicyclic monomers such as tolylene diisocyanate, hexamethylene diisocyanate, and cyclohexane diisocyanate, as well as multimers such as dimers and trimers of these monomers, and Any known incyanate components for polyurethane, such as addition reaction products of these and polyhydric alcohols, can be used.

Such a polyisocyanate compound reacts with carboxyl groups and hydroxyl groups contained in the solvent-soluble linear saturated polyester resin during formation of the photosensitive layer to create a crosslinked structure in the photosensitive layer, thereby increasing the cohesive force of the photosensitive layer. In addition to playing a role in increasing the layer strength, it also participates in a reaction with the same polar groups as above that are present on the surface of the support made of polyethylene terephthalate film, and greatly contributes to improving the adhesive strength between the photosensitive layer and the support. It is something.

These polyisocyanate compounds may be used alone or in combination of two or more. The amount used is usually 01 to 20 parts by weight, particularly preferably 1 to 10 parts by weight, per 100 parts by weight of the solvent-soluble linear saturated polyester resin (total amount including other binder polymers when used together). It is preferable to set it in the range of parts by weight.

The support in this invention is a polyethylene terephthalate film, that is, a high condensation product of terephthalic acid and ethylene glycol, which is a film made of a polymer that is highly crystalline and insoluble in ordinary solvents, and its thickness is usually 3 to 3. 50/''. Such a polyethylene terephthalate film has excellent mechanical strength, which is convenient for exerting a reinforcing effect on the photosensitive layer, and also enables patterned exposure from the film side. It has good transparency, is stable against heat applied when forming a photosensitive layer on this film, and has excellent heat resistance and hygroscopicity that is not easily affected by moisture absorption.

Prior to completing this invention, the inventors focused on the above-mentioned properties of polyethylene terephthalate film,
We believe that the above-mentioned film is the most suitable support for reinforcing the photosensitive layer, and based on this idea, we developed a film that satisfies the adhesive strength with the above-mentioned film, that is, a large adhesive strength is achieved even without the interposition of an adhesive layer. As a result of various studies on the composition of the resulting photosensitive layer, we found a composition containing as essential components a solvent-soluble linear saturated polyester resin, a photopolymerizable unsaturated compound, a photopolymerization initiator, and a polyisocyanate compound as described above. When the photosensitive layer is constructed using a photosensitive layer, the adhesion strength between the photosensitive layer and the support film can be sufficiently satisfied, and as a result, the peeling operation of the support and the photosensitive layer after patterned exposure can be made extremely easy. It has been found that this method can be used satisfactorily.

The image forming material of the present invention is formed by laminating in this order the base material described above, a thin film of metal or metal compound, a photosensitive layer, and a support consisting of a polyethylene terephthalate film, but the means of lamination may be arbitrary. It is.

However, in general, first, a sputtering method is applied onto the base material.
A method in which a thin film of metal or metal compound is formed by a known thin film forming technique such as a vacuum evaporation method or an electroless plating method to create a laminated substrate, and then a photosensitive layer and the support are laminated on the thin film of this substrate. is preferably adopted.

Here, the lamination of the photosensitive layer and the support on the laminated substrate is carried out by forming a photosensitive layer on a thin film of metal or metal compound of the laminated substrate, and then heating and laminating the support thereon (hereinafter referred to as this method). Alternatively, a photosensitive film formed by forming a photosensitive layer on a support may be prepared in advance, and this and a laminated substrate may be laminated with a photosensitive layer and a thin film of a metal or metal compound. It may be carried out by a method of heating and laminating so that the two layers are in contact with each other (hereinafter, this is referred to as a -stage lamination method).

The photosensitive layer is formed by applying a composition containing the above-mentioned solvent-soluble linear saturated polyester resin, a photopolymerizable unsaturated compound, a photopolymerization initiator, and a polyisocyanate compound as essential components, that is, usually the above-mentioned composition. This is carried out by preparing a coating solution by uniformly dissolving and mixing these in an appropriate solvent, applying the solution, and drying it. Examples of the above solvents include ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, aromatic hydrocarbons such as toluene, benzene, and xylene, esters such as ethyl acetate, butyl acetate, and amyl acetate, carbon tetrachloride, chloroform, Used are tonohalogenated hydrocarbons such as trichloroethylene and methylene chloride, ethers such as diethyl ether, tetrahydrofuran, dioxane, and ethylene glycol monomethyl ether, dimethylformamide, and dimethyl sulfoxide.

In the one-stage lamination method, after the above coating and drying, that is, after the coating solution is coated on a support made of polyethylene terephthalate film and dried, post-heating is applied to a temperature sufficient to cause the polyisocyanate compound in the composition to react. It is preferable to perform treatment.

The higher the temperature, the shorter the time required for the subsequent heat treatment, but if the temperature is too high there is a risk of causing a thermal reaction of the photopolymerizable unsaturated compound, so it is usually heated at 30 to 80°C for 1 to 10 minutes.
It is preferable to set the condition to 48 hours.

When the polyisocyanate compound is reacted by the above-mentioned post-heat treatment, the cohesive force of the photosensitive layer increases and the layer strength can be increased, and it also participates in reactions with polar groups such as carboxyl groups and hydroxyl groups on the surface of the support. , good results can be obtained in improving the adhesive strength between the support and the photosensitive layer.

On the other hand, in the two-stage lamination method, the coating solution is applied onto the thin film of metal or metal compound of the laminated substrate and dried to form a photosensitive layer, and then a support made of polyethylene terephthalate film is heated on top of this. If a post-heat treatment similar to that described above is performed before lamination, although it may help improve the cohesive force of the photosensitive layer, it will not contribute to improving the adhesive strength with the support. In this case, it is desirable to heat-laminate the support immediately without performing the post-heat treatment. During this heat-lamination, it is expected that the polar groups on the surface of the support will react with the polyisocyanate compound, thereby improving the adhesion. Strength can be improved to some extent.

However, compared to the improvement in adhesive strength achieved by the above-mentioned post-heat treatment in the -stage lamination method, it cannot be avoided that this improvement is considerably inferior.

Therefore, from this point of view, the two-stage lamination method can be recommended as the most preferable method.

In order to form an image with a desired pattern using the thus obtained image forming material of the present invention, first, a positive original having a pattern is brought into close contact with a support made of a polyethylene terephthalate film, and light is exposed from above.

Light sources used for this exposure include light sources containing light having a wavelength in the range of 300 to 500 nm, such as high-pressure mercury lamps, ultra-high pressure mercury lamps, xenon lamps, carbon arc lamps, and metal halide lamps. By such exposure, the photosensitive layer in the exposed areas undergoes a polymerization reaction, and its adhesive strength with the underlying thin film of metal or metal compound increases significantly compared to that of the photosensitive layer in the non-exposed areas.

After the adhesive strength between the photosensitive layer and the metal or metal compound thin film is changed between the exposed and non-exposed areas in this way, a peeling operation is performed to peel off the support and the photosensitive layer as one piece. Then, the thin film in the exposed area where the adhesive strength has increased is peeled off together with the support and the photosensitive layer, and the thin film in the non-exposed area remains on the substrate. In other words, this remaining thin film forms a positive image having a pattern similar to the positive original.

"Effects of the Invention" As detailed above, according to the image forming material of the present invention, an image with a desired pattern can be formed by patterned exposure and a peeling operation, so that conventional wet development processing and etching operations are unnecessary. In addition to having the advantage of becoming
The specific support film laminated on the photosensitive layer allows the peeling operation to be performed well, and the support film and the photosensitive layer are laminated with good adhesive strength without intervening an adhesive layer. The effect is obtained that problems in the manufacturing process, cost, and peeling operation of image forming materials caused by the use of adhesives can be essentially eliminated.

Therefore, the image forming material of the present invention is very useful for a wide range of applications such as second original drawings, plate-making films, printed wiring boards, transparent electrode patterns for liquid crystals, etc., and lithographic printing plates.

〔Example〕

EXAMPLES Below, examples of the present invention will be described in more detail. In addition, in the following, parts shall mean parts by weight.

Example 1 Solvent-soluble linear saturated polyester resin 100 parts (Toyobo Co., Ltd., trade name Vylon-200) Trimethylolpropane triacrylate 50 parts Dimethylthioxanthone 3 parts Isoamyl dimethylaminobenzoate 2 parts Hydroquinone
01 parts Ethyl acetate 250 parts The above compositions were mixed to prepare a coating solution. This coating solution was coated onto a support made of a 25p thick polyethylene terephthalate film so that the thickness after drying would be 10F, and dried at 80°C for 10 minutes. Thereafter, it was left to stand at 50° C. for 48 hours to produce a photosensitive film.

On the other hand, a thin aluminum film of about 500 nm thick is formed by vacuum evaporation on a base material made of a polyethylene terephthalate film of 100 pn thickness to form a laminated substrate, and the photosensitive layer and the aluminum thin film are brought into contact with this substrate and the photosensitive film. The image forming material of the present invention was prepared by heat lamination using a roll laminator set at 100°C.

A positive original having a predetermined pattern was placed on the support side of this image forming material, and a 100 mJ
After exposure at an exposure amount of /cm, the support and the photosensitive layer were peeled off, and a positive image having a pattern similar to a positive original consisting of a thin aluminum film on the base material was obtained.

Example 2 As a laminated substrate, 50% was deposited on a base material made of a 100p thick polyethylene terephthalate film by vacuum evaporation method.
An image forming material was produced in the same manner as in Example 1, except that a material formed by forming a nm-thick tin oxide thin film was used.

When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original consisting of a tin oxide thin film on a substrate was obtained.

Example 3 An image forming material was produced in the same manner as in Example 1, except that the laminated substrate was a 25p thick polyimide film base material on which a 800nrn thick copper thin film was formed by vacuum evaporation. did.

When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original consisting of a copper thin film on a base material was obtained.

Example 4 Dipentaerythritol hexaacrylate 8
0 parts benzophenone 5 parts 4.4
A photosensitive film was prepared in the same manner as in Example 1 using a coating solution prepared by mixing the above compositions.

An image forming material was produced in the same manner as in Example 1 using this photosensitive film and the laminated substrate of Example 1.

When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original made of a thin aluminum film on a base material was obtained.

Example 5 An image forming material was produced in the same manner as in Example 1 using the photosensitive film of Example 4 and the laminated substrate of Example 2. When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original consisting of a tin oxide thin film on a substrate was obtained.

Example 6 An image forming material was produced in the same manner as in Example 1 using the photosensitive film of Example 4 and the laminated substrate of Example 3. When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original consisting of a copper thin film on a base material was obtained.

Example 7 (Dia Nacol BR-75 from Niai-Yonsha)
Benzophenone 5 parts 4,4'-bisdiethylaminobenzophenone 0.5 part Paramethoxyphenol 0.1 part Ethyl acetate
A photosensitive film was prepared in the same manner as in Example 1 using a coating solution prepared by mixing 250 parts of the above composition.

An image forming material was produced in the same manner as in Example 1 using this photosensitive film and the laminated substrate of Example 1.

When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original made of a thin aluminum film on a base material was obtained.

Example 8 An image forming material was produced in the same manner as in Example 1 using the photosensitive film of Example 7 and the laminated substrate of Example 2. When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original consisting of a tin oxide thin film on a substrate was obtained.

Example 9 An image forming material was produced in the same manner as in Example 1 using the photosensitive film of Example 7 and the laminated substrate of Example 3. When an attempt was made to form an image using this material in the same manner as in Example 1, a positive image having a pattern similar to a positive original consisting of a copper thin film on a base material was obtained.

Patent applicant: Nitto Electric Industry Co., Ltd.

Claims (2)

[Claims] (1) A thin film of a metal or metal compound, a photosensitive layer, and a support consisting of a polyethylene terephthalate film are laminated in this order on a base material, and the photosensitive layer in the exposed area and the above are exposed in a patterned manner from the support side. The adhesive force with the thin film increases, and when the support and photosensitive layer are peeled off after this exposure, the thin film in the exposed area where the adhesive force has increased is peeled off together with the thin film, leaving an unexposed area on the base material. The above-mentioned thin film remains as an image, the image-forming material is capable of forming an image by a peeling operation, and the above-mentioned photosensitive layer contains a solvent-soluble linear saturated polyester resin, a photopolymerizable unsaturated compound, a photopolymerization initiator, and a polyester resin. An image forming material characterized by containing an isocyanate compound as an essential component. (2) A laminated substrate formed by forming a thin film of a metal or metal compound on a base material, and a solvent-soluble linear saturated polyester resin, a photopolymerizable unsaturated compound, and a photopolymerization initiator on a support made of a polyethylene terephthalate film. and a photosensitive film formed by applying a composition containing a polyisocyanate compound as an essential component to form a photosensitive layer, which are heat-laminated so that the thin film and the photosensitive layer are in contact with each other, and Claim No. 1, in which the polyisocyanate compound participates in the reaction with the polar group on the surface of the support
The image forming material described in section 1).