JPH01250946A - Image forming method by peeling - Google Patents

Abstract

PURPOSE:To enable the image formation by peeling, and to improve sticking property between the image and a base plate by using a photosensitive composition layer usable for image formation for an adhesives between a conductive thin film and the base plate. CONSTITUTION:The photosensitive composition layer 2, the conductive thin film 3 and a peeling film 4 are laminated on a transparent base plate 1 in this order. The interrelation-ship of the formula A>C>B is held for symbols A, B and C in a nonexposure condition wherein the symbol A is sticking force between the transparent base plate 1 and the photosensitive composition 2, the symbol B is the sticking force between the layer 2 and the conductive thin film 3 and the symbol C is the sticking force between the film 3 and the peeling film 4. And, an image forming material which has the interrelation-ship of the formula A>C>B after exposure is subjected to a pattern-like exposure (a) from a transparent base plate 1 side, and then is peeled only the unexposed part of the conductive thin film 3a together with the peeling film 4 to remove said part whereby the exposed part 3b of the conductive thin film is remained on the transparent base plate 1 as the image through the photosensitive composition layer 2. Thus, the sticking property between the image and the substrate plate is remarkably improved by the photosensitive composition layer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an image forming method by peeling used for producing transparent electrode patterns for printed wiring boards, liquid crystals, etc.

[Conventional technology]

Techniques for forming desired images using photosensitive film have been known for a long time. In this method, a photosensitive film is overlaid on a laminated substrate consisting of a conductive thin film such as copper foil on an insulating substrate, and after pattern exposure, wet development and etching are performed to form a conductive thin film in a desired pattern on the insulating substrate. It forms an image consisting of In addition, when using a peel development type photosensitive film in which a photosensitive composition layer is provided on a transparent support, the pattern can be formed on the conductive thin film by peeling off the transparent support after patterned exposure. A photosensitive composition layer can be formed, and in this case, wet development becomes unnecessary, and an image similar to the above can be formed by performing an etching operation thereafter.

However, with these image forming techniques, it is necessary to carry out an etching operation after patterned exposure, and, except for the peel development type, it is also necessary to carry out a wet development process, which has the disadvantage of complicating the image forming process. In addition, the use of etching solutions and developing solutions has various disadvantages, such as being unfavorable from a public health standpoint and increasing costs.

Therefore, as an image forming material that avoids these disadvantages,
A conductive thin film is provided on a base material to form an image, and a photosensitive composition layer is directly formed on this film (
Japanese Patent Publication No. 56-20533) and a structure in which a support film for reinforcement is further laminated on the photosensitive composition layer via a suitable adhesive layer (Japanese Patent Publication No. 60-20735) have been proposed. ing.

These image-forming materials increase the adhesion between the photosensitive composition layer and the above-mentioned thin film in the exposed area by patternwise exposure from the photosensitive composition layer side, and after exposure, the photosensitive composition layer or this By performing a peeling operation on the support film via the adhesive layer, the thin film in the exposed area where the adhesion has increased is peeled off and removed together, and the thin film in the non-exposed area is placed on the base material to form a patterned image. It shall remain as such.

Furthermore, although the structure in which a conductive thin film and a photosensitive composition layer are sequentially provided on a substrate is the same, the adhesion between the photosensitive composition layer and the conductive thin film in the exposed area is lower than that in the non-exposed area. In order to make the structure even smaller, by peeling off the photosensitive composition layer after patterned exposure, the thin film in the non-exposed area, which has strong adhesion, is peeled off and removed together with the thin film in the exposed area on the substrate. Image forming materials have also been proposed in which a thin film remains as a patterned image, that is, an image inverted from the above image is formed (Japanese Patent Publication No. 52-126220, etc.).

These proposed image-forming materials all perform pattern-like exposure and peeling operations, thereby eliminating the need for the conventional etching operation described above, and eliminating the need for wet development treatment before the etching operation. Since it has the characteristic that a desired image can be formed on a substrate by dry processing, the process for forming an image is simplified, and it also eliminates public health problems and high costs associated with the use of etching solutions and developing solutions. This problem will be resolved.

[Problem to be solved by the invention]

By the way, in these already proposed image forming materials, the conductive thin film provided on the base material is formed by a vacuum evaporation method, a sputtering method, an electroless plating method, an ion blating method, a coating method, etc. The adhesion force between the two is almost constant regardless of exposed and non-exposed areas,
And it's not that big.

This makes the adhesion between the thin film and the photosensitive composition layer provided thereon larger than the adhesion between the thin film and the base material in the exposed or non-exposed areas, By peeling off only this part of the thin film together with the photosensitive composition layer, the thin film in other parts remains as an image on the base material. This is because if the adhesion force is too large, it becomes difficult to form an image by peeling as described above.

For this reason, transparent electrode patterns for printed wiring boards, liquid crystals, etc. that are image-formed by peeling using previously proposed image-forming materials lack the adhesion between the image made of a conductive thin film and the base material, and are exposed to external forces. There have been problems in that images are likely to peel off due to heat, chemicals, etc., the incidence of defective products is high, and it is difficult to achieve stable performance.

Therefore, the present invention enables image formation by peeling like the above-mentioned existing proposals, has excellent adhesion between the formed image and the base material, and is easily removed by external force, heat, chemicals, etc. The purpose of the present invention is to provide an image forming method that has higher practical value and is free from the risk of image peeling.

[Means to solve the problem]

As a result of intensive studies to achieve the above object, the inventors discovered that the photosensitive composition layer used for image formation has an adhesive bond to improve the adhesion between the conductive thin film and the base material. The present invention was completed based on the knowledge that by using the compound as an agent, it is possible to form an image by peeling, and the adhesion between the image and the substrate can be greatly improved.

That is, this invention provides a photosensitive composition layer on a transparent substrate,
A conductive thin film and a release film are laminated in this order, and the adhesion between the transparent substrate and the photosensitive composition layer (A
), adhesion between the photosensitive composition layer and the conductive thin film (B)
and the adhesion between the conductive thin film and the release film (C1
However, in the non-exposed state, the relationship is (A)>(C)>([3), and after exposure, (A)>(B)>(C)
After performing pattern exposure from the transparent substrate side using an image forming material that has the following relationship, by peeling off the release film, only the conductive thin film in the unexposed area is removed together with the release film. The present invention relates to an image forming method by peeling, which is characterized in that the conductive thin film in the exposed area is left as an image on a transparent substrate via a photosensitive composition layer after peeling off.

As described above, in the present invention, the substrate on which the image is to be formed is transparent, a photosensitive composition layer is provided on this substrate, and then a conductive thin film and a release film are sequentially laminated, and using an image forming material in which the adhesion between the members laminated in this way satisfies the specific relationship,
This material is exposed to light in a pattern from the transparent substrate side, and then the release film is peeled off. According to this method, the conductivity of the non-exposed areas where the adhesion between the material and the photosensitive composition layer is small is small. The conductive thin film is peeled off together with the release film, and the conductive thin film in the exposed areas with high adhesion remains as an image on the substrate.

The image formed by such a peeling operation has a photosensitive composition layer between it and the transparent substrate, and the photosensitive composition layer in this image area has already undergone a curing reaction etc. by exposure. However, since the adhesion force with the conductive thin film that is the image constituent material is increased, and the adhesion force between this layer and the base material is also large, the adhesion of the image to the base material through the above layer is improved. becomes significantly high. That is, the photosensitive composition layer after the peeling operation serves as an adhesive to significantly improve the adhesion between the image and the substrate.

Therefore, unlike the image formed by the previously proposed peeling operation, the above image exhibits great resistance to external force, heat, and chemicals, and there is no problem of image peeling caused by these factors, and there is no problem. The yield of non-defective products is low, and the product exhibits extremely stable performance even in applications that require precise image formation, such as transparent electrode patterns for printed wiring boards and liquid crystal displays.

[Structure and operation of the invention]

The image forming method of the present invention will be explained below with reference to FIGS. 1 to 3.

FIG. 1 shows an image forming material used in the method of the present invention, in which 1 indicates a transparent substrate on which an image is to be formed;
2 is a photosensitive composition layer provided on this base material 1, 3 is a conductive thin film that is to constitute an image and is laminated on the composition layer 2, and 4 is a release film provided on this thin film. be.

The transparent substrate 1 may be any material as long as it can pass the actinic rays used for patterned exposure and provide an anchoring force with the photosensitive composition layer 2, and may be in the form of a sheet made of various materials such as glass or plastic. , film-like ones are used.

Specific examples of plastics include polyethylene terephthalate, polypropylene, polyethylene, cellulose triacetate, cellulose diacetate, polyvinyl chloride, polyvinyl alcohol, polycarbonate, polystyrene, cellophane, polyvinylidene chloride copolymer, polyamide (for example, 6-nylon , 6,6-nylon, 6,10-nylon, etc.), polyimide, vinyl chloride-vinyl acetate copolymer, polytetrafluoroethylene, polytrifluoroethylene, etc.; for example, flexible printing. When plastic film is used as a material for applications such as wiring boards, the thickness is generally about 10 to 150 μm, preferably 20 to 80 μm.
A material having a pn level is preferably used.

In addition, when providing the photosensitive composition layer 2 on this transparent base material 1, in order to increase the anchoring power of this layer 2, an appropriate undercoat layer may be formed in advance, matte treatment, corona discharge treatment, high frequency irradiation, etc. It is preferable to perform a surface roughening treatment such as treatment, ultraviolet irradiation treatment, glow discharge irradiation treatment, or active plasma irradiation treatment.

The photosensitive composition layer 2 may be made of any material that can increase its adhesion to the conductive thin film 3 upon exposure to light and function as an adhesive between the transparent substrate 1 and the conductive thin film 3, but generally ethylene is used. A photopolymerizable composition containing a sexually unsaturated polymerizable compound, a film-forming polymeric substance, and a photopolymerization initiator is preferred.

The above-mentioned ethylenically unsaturated polymerizable compounds include both monofunctional unsaturated compounds having one ethylenically unsaturated bond in the molecule and polyfunctional unsaturated compounds having two or more of the above bonds. Can be used. Preferably, one or more polyfunctional unsaturated compounds are used alone, or they are used in combination with one or more monofunctional unsaturated compounds.

Polyfunctional unsaturated compounds include polyethylene glycol, polypropylene glycol, polybutylene oxide, (β-hydroxyethoxy)benzene, glycerin,
Diglycerin, neopentyl glycol, trimethylolpropane, trimethylolpropane, pentaerythritol, dipentaerythritol, sorbitan, sorbitol, 1,4-butanediol, 1,2,4-butanetriol, 2-butene 4-diol, 2 -butyl-2-ethyl-propanediol, 2-butenoto 4-
Diols, polyhydric esters of polyhydric alcohols such as 3-propanediol, triethanolamine, decalindiol, 3-chloro-2-propanediol, and acrylic acid or methacrylic acid, acrylic acid or methacrylic acid, polyhydric alcohols Polyester acrylates or polyester methacrylates synthesized from polybasic acids and polybasic acids are preferably used.

Examples of monofunctional unsaturated compounds include acrylic acid or acrylic esters, methacrylic acid or methacrylic esters, acrylamides, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, N-vinyl compounds, and styrenes. , crotonic acid esters, etc. can all be used.

Specific examples of acrylic esters include propyl acrylate, butyl acrylate, amyl acrylate,
2-ethylhexyl acrylate, octyl acrylate, etc.; methacrylic esters include methyl methacrylate, ethinope methacrylate, propyl methacrylate, isopropyl methacrylate, etc.; acrylamides include acrylamide, N-alkyl group is methyl group, ethyl basis,
Butyl group, isopropyl group, tert-butyl group, 2-
N-alkyl acrylamide, which consists of an ethylhexyl group, etc., is methacrylamide, and N-alkyl methacrylate, whose N-alkyl group is a methyl group, ethyl group, isopropyl group, tert-butyl group, 2-ethylhexyl group, etc. Allyl compounds include allyl esters such as allyl acetate, allyl caproate, allyl caprylate, allyl laurate, and allyl palmitate, and the vinyl ethers include hexyl vinyl ether, octyl vinyl ether,
Decyl vinyl ether, 2-ethylhexyl vinyl ether natonoalkyl vinyl ether, vinyl esters include vinyl butyrate, vinyl isobutyrate, vinyl trimethyl acetate, vinyl diethyl acetate,
Vinyl valerate, vinyl caproate, etc., N-vinyl compounds such as N-vinylpyrrolidone, styrenes such as untyrene, methylstyrene, chloromethylstyrene, alkoxystyrene, halogenated styrene, styrene benzoate, etc. Acid esters include methyl crotonate, ethyl crotonate, butyl crotonate, hexyl crotonate, and isopropyl crotonate.

The film-forming polymer substances mentioned above include chlorinated polyolefins such as chlorinated polyethylene and chlorinated polypropylene, polymethyl methacrylate, polymethyl acrylate, polyvinyl chloride, polyvinylidene chloride, polyvinyl butyral, polyvinyl acetate, and vinyl chloride-acetic acid. Examples include vinyl copolymers, polyisoprene, chlorinated rubber, polychloroprene, polychlorosulfonated ethylene, vinylidene chloride-acrylonitrile copolymers, polychlorosulfonated propylene, and saturated polyesters. Among these, preferred film-forming polymeric substances are chlorinated polyethylene, chlorinated polypropylene and polymethyl methacrylate. In addition, these film-forming polymeric substances may be used alone or in combination of two or more. In addition, as the above-mentioned photopolymerization initiators, carbonyl compounds, organic sulfur compounds, peroxides, etc. , redox compounds, azo and azo compounds, halogen compounds, photoreducible dyes, etc. One or more of them can be selected and used.

Examples of carbonyl compounds include benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, benzophenone, anthraquinone, 2-methylanthraquinone, 2-butylanthraquinone, 9.10-
Examples include phenanthrenequinone, diacetyl, and benzyl. Examples of organic sulfur compounds include dibutyl disulfide, dioctyl disulfide, dibenzyl disulfide, diphenyl disulfide, dibenzoyl disulfide, and diacetyl disulfide.

Examples of peroxides include hydrogen peroxide, di-t-butyl peroxide, benzoyl peroxide, and methyl ethyl ketone peroxide. Furthermore, redox compounds consist of a combination of a peroxide and a reducing agent, and include ferrous ions and hydrogen peroxide, ferrous ions and persulfate ions, and ferric ions and peroxides. .

Examples of azo and diazo compounds include .alpha..alpha.'-azobisinbutyronitrile, 2-azobis-2-methylbutyronitrile, 1-azobis-cyclohexanecarbonitrile, and diazonium salts of p-aminodiphenylamine. Halogen compounds include chloromethylnaphthyl chloride, phenacyl chloride, chloroacetone, β
-Naphthalenesulfonyl chloride, xylenesulfonyl chloride, etc. can be mentioned. In addition, photoreducible pigments include rose bengal, erythrosin, eosin,
These include acriflavin, riboflavin, and thionin.

The proportion of the ethylenically unsaturated polymerizable compound, film-forming polymeric substance and photopolymerization initiator used is usually 10 to 10 parts by weight per 100 parts by weight of the film-forming polymeric substance. 300 parts by weight, preferably 5
The ratio of the photopolymerization initiator to 100 parts by weight of the ethylenically unsaturated polymerizable compound is usually 0 to 200 parts by weight.
．． The proportion is preferably 1 to 20 parts by weight.

In addition to the above three components as essential components, the photopolymerizable composition may optionally contain additives such as a thermal polymerization inhibitor, a coloring agent, a plasticizer, and a filler.

Thermal polymerization inhibitors include paramethoxyphenol, hydroquinone, alkyl- or aryl-substituted hydroquinone, t-butylcatechol, pyrogallol, cuprous chloride, phenothiazine, floranil, naphthylamine, β
-naphthol, 2,6-sheet t-7'thyl-p-cresol, pyridine, nitrobenzene, dinitrobenzene,
Examples include organic acid copper such as p-toluidine, methylene blue, and copper acetate. These thermal polymerization inhibitors are usually used in an amount of 0.001 to 100 parts by weight of the ethylenically unsaturated polymerizable compound.
It is used in a range of 5 parts by weight.

As plasticizers, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate,
Phthalate esters such as dioctyl phthalate, glycol esters such as dimethyl glycol phthalate, ethyl phthalyl ethyl glycolate, methyl phthalyl ethyl glycolate, butylphthalyl butyl glycolate, triethylene glycol cycaprylate, tricresyl These include phosphoric acid esters such as phosphate and triphenyl phosphate, triethyl citrate, and butyl glycerintriacetyl esternovelaurate. The amount of these plasticizers added is usually 10 parts by weight or less per 100 parts by weight of the total amount of the film-forming polymeric substance and the ethylenically unsaturated polymerizable compound.

Further, examples of the filler include calcium carbonate, clay, powdered silica, and talc, but fillers with higher whiteness are particularly preferred. The amount added is approximately 50% of the total amount of the composition.
It is preferable that the amount is less than % by weight, and too much amount is not preferable because film properties and other properties will be affected.

The thickness of the photosensitive composition layer 2 of which such a photopolymerizable composition is a typical example is generally set within the range of 1 to 100 p, particularly preferably within the range of 3 to 30 p.

The conductive thin film 3 may be any film having appropriate cohesive force and adhesion so that it can be partially peeled off from the photosensitive composition layer 2 by a peeling operation, and may be made of various conductive metals or inorganic compounds. Can be used.

Examples of metals include iron, aluminum, tin, lead, gold, silver, nickel, cadmium, chromium, zinc, magnesium, alloys thereof, and alloys of these metals and other metals. Inorganic compounds include metal oxides such as tin oxide, chromium oxide, iron oxide, aluminum oxide, zinc oxide, and copper oxide, salts such as silver bromide, tin sulfide, silver sulfide, and zinc sulfide, arsenic, sulfur, Examples include chalcogen glass, which is a sintered product containing chalcogen group elements such as germanium and tellurium, and sintered products of metal oxides (for example, ferrite).

The thickness of the conductive thin film 3 made of these metals or inorganic compounds is generally in the range of 001 to lQQ)on, particularly preferably in the range of 002 to 0.50/''.

If this thickness becomes too thin, it will be difficult to maintain the strength of the image, and if it becomes too thick, it will be difficult to perform partial peeling and removal smoothly during the peeling operation.

The release film 4 may be any film as long as it has flexibility that allows for peeling operations and can ensure adhesion to the conductive thin film 3, and may include various plastic films similar to those exemplified as the transparent base material 1. is used. Its thickness is generally in the range of 10 to 15Q7 m, particularly preferably in the range of 10 to 50 pn.

The method for producing the image forming material composed of the members 1 to 4 described above is not particularly limited, and various methods can be employed. For example, a method is employed in which a conductive thin film 3 is formed on a release film 4, a photosensitive composition layer 2 is provided thereon, and a transparent base material 1 is further pasted on this layer 2, or a method in which the photosensitive composition layer 2 is applied in advance. Examples include a method of bonding the provided transparent base material 1 and the release film 4 on which the conductive thin film 3 is formed so that the layer 2 and the thin film 3 are in contact with each other.

In these methods, when forming the conductive thin film 3,
Depending on the material, vacuum evaporation method, sputtering method,
Electroless plating method, ion blating method, coating method, etc. are employed as appropriate. In addition, when providing the photosensitive composition layer 2, for example, the photopolymerizable composition described above is usually dissolved or dispersed in a solvent, and then this is cast onto an object to be coated such as the transparent substrate 1, and then dried. method etc. are preferably adopted.

Examples of the solvent used in forming the photosensitive composition layer 2 include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and diisobutyl ketone, ethyl acetate, butyl acetate, amyl acetate, methyl formate, ethyl propionate, Esters such as dimethyl phthalate and ethyl benzoate, aromatic hydrocarbons such as toluene, xylene, benzene, and ethylbenzene, carbon tetrachloride, trichloroethylene, chloroform, 1,1,1-trichloroethane, monochlorobenzene, and chlornaphthalene. These include halogenated hydrocarbons such as tetrahydrofuran, diethyl ether, ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether acetate, dimethylformamide, and dimethyl sulfoxide.

The image forming material produced in this way can be produced by appropriately selecting the types, thicknesses, lamination means, etc. of each of the above-mentioned members 1 to 4 to ensure close contact between the transparent substrate 1 and the photosensitive composition layer 2. force (A), adhesion force between the photosensitive composition layer 2 and the conductive thin film 3 (B), and adhesion force between the conductive thin film 3 and the release film 4 (C) in the non-exposed state ( A) > IC)
> There is a relationship of (B), and after exposure (A) >
(B) > FC).

That is, since this image forming material has the highest adhesion (A) regardless of the exposed state or non-exposed state, the peeling between the transparent base material 1 and the photosensitive composition layer 2 during the peeling operation is - The entire layer 2 remains on the transparent substrate 1 even after the peeling operation. On the other hand, since the adhesion force (B) is minimized in the non-exposed state,
If the peeling operation is performed in this state, the entire conductive thin film 3 will be peeled off along with the peeling film 4, but since the adhesion force 03) will be greater than the adhesion force (C) after exposure, the peeling will be performed after the entire surface is exposed. When operated, only the release film 4 is peeled off and the entire conductive thin film 3 remains on the transparent substrate l together with the photosensitive composition layer 2.

The image forming method of the present invention utilizes the change in the adhesion force (B) before and after exposure, and as shown in FIG. Perform a state exposure. After this exposure, as shown in FIG. 3, when the release film 4 is peeled off, only the conductive thin film 3a in the non-exposed area where the adhesion force (B) is the smallest is peeled off together with the release film 4, and the adhesion force The conductive thin film 3b in the exposed area where (C) is the smallest remains on the transparent substrate 1 together with the photosensitive composition layer 2, and an image is formed by this thin film 3b. This image has excellent adhesion to the transparent substrate 1 because the layer 2, which has undergone a curing reaction and the like upon exposure, has a function as an adhesive.

The active light used for the patterned exposure is as follows:
Ultraviolet to visible light having a wavelength of 200 to 700 nm, preferably 250 to 500 nm is included, and suitable light sources include low pressure, high pressure, and extra high pressure mercury lamps, xenon lamps, carbon arc lamps, halogen lamps, germicidal lamps, and the like.

In addition, electron beams, X-rays, laser beams, etc. are also effective.

Further, after exposure to actinic rays, a heating step may be added if necessary. Depending on the type of each member 1 to 4, especially the type of photosensitive composition layer 2, good results may be obtained in terms of image characteristics by adding the above-mentioned heating step. Furthermore, although the peeling operation can normally be carried out at room temperature, it may be carried out in a heated state up to about 40° C. if necessary.

〔Effect of the invention〕

As described above, according to the present invention, excellent adhesion to the base material is achieved by the peeling operation, and no external force is applied.

Since it is possible to form images that do not have the problem of being easily peeled off by heat, chemicals, etc., it is possible to provide an image forming method suitable for producing transparent electrode patterns for printed wiring boards, liquid crystals, etc.

〔Example〕

EXAMPLES Below, examples of the present invention will be described in more detail. In addition, in the following, parts shall mean parts by weight.

Example 1 Aerosil 13 parts p-methoxyphenol 0.1 part Benzoin isopropyl ether 7 parts The photopolymerizable composition having the above composition was dissolved in toluene to form a solution with a solid content of 40% by weight. Matte-treated polyethylene terephthalate film with 507”I (
After coating with an applicator on a transparent substrate,
It was dried by heating at ℃ for 10 minutes to form a photosensitive composition layer having a thickness of about 15 μm.

Next, a thin aluminum film with a thickness of 0.1 μm was formed on a polyethylene terephthalate film (release film) with a thickness of 13 mm by vacuum evaporation method, and then a transparent base material was formed on which the above photosensitive composition layer was formed. An image forming material was prepared by bonding the aluminum thin film and the photosensitive composition layer together at 40° C. so that they were in contact with each other.

A pattern original was brought into close contact with the transparent substrate of this image forming material, and exposure was carried out for 40 seconds through the original using ultra-high pressure mercury of 5 KW from a position approximately 50σ away from the light source. Thereafter, by peeling off the release film at a temperature of 32° C., an image consisting of a patterned aluminum thin film was formed on the transparent substrate via the photosensitive composition layer. At this time, the adhesion between the aluminum thin film and the photosensitive composition layer in the non-exposed area was 20fi in a 180 degree peel test! /am.

This image has good resolution that is faithful to the original image, and its adhesion to the transparent substrate is 1.1 in a 180 degree peel test. IKy/
c1n, which was very large, and did not peel off during subsequent handling (soldering, etc.). In addition, the adhesion between the aluminum thin film and the release film removed by the above peeling operation was 37y in a 180 degree peel test.
/Q1n, and as can be inferred from this, according to the image formation according to the known proposed method, there is no close contact between the image (corresponding to the aluminum thin film described above) and the base material (corresponding to the release film described above). It is clear that the force is significantly smaller.

Example 2 Pentaerythritol triacrylate 100
1 part Aerosil 13 parts p-methoxyphenol 0.1 part Benzyl dimethyl ketal 7 parts Using a photopolymerizable composition having the above composition, a thickness of 5 parts was prepared in the same manner as in Example 1.
0/ffi matte treated polyethylene terephthalate film (transparent substrate) with a thickness of 10. A photosensitive composition layer of l'l was formed.

Next, a nickel thin film with a thickness of o and osp was formed on a polyethylene terephthalate film (release film) with a thickness of 131 inches by a vacuum evaporation method, and then a transparent substrate with the above photosensitive composition layer formed thereon was coated with nickel. An image forming material was produced by bonding the thin film and the photosensitive composition layer together at 40° C. so that they were in contact with each other.

When an image was formed using this image forming material in the same manner as in Example 1, it had good resolution faithful to the original image, and the adhesion to the transparent substrate was 0.6K in a 180 degree peel test.
A very large image of g/σ was obtained, and this image did not peel off during subsequent handling. In addition,
The adhesion between the nickel thin film and the photosensitive composition layer in the non-exposed area was 1.5 y/am in a 180 degree peel test.

The adhesion force between the peeled off nickel thin film and the release film was 10y/cm in a 180 degree peel test, and as can be estimated from this, the image formation according to the known proposed method is According to the above, it is clear that the adhesion between the image (corresponding to the above-mentioned nickel thin film) and the base material (corresponding to the above-mentioned release film) is extremely small.

Example 3 Chlorinated polyethylene [Yamaba Kokusaku Pulp ■ 80 parts Super Chron CPE-907HA] Aerosil
13 parts p-methoxyphenol 0.1 part Benzoin isopropyl ether 7 parts Polyethylene terephthalate film (transparent base material) which was matt-treated to a thickness of 25 μm in the same manner as in Example 1 using the photopolymerizable composition having the above composition. A photosensitive composition layer having a thickness of 15 mm was formed thereon.

Next, a copper thin film with a thickness of 0.4/a was formed on a polyethylene terephthalate film (release film) with a thickness of 25 μm by electroless plating, and then the above photosensitive composition layer was formed on it. An image forming material was produced by bonding the transparent substrate together at 40° C. so that the copper thin film and the photosensitive composition layer were in contact with each other.

When an image was formed using this image forming material in the same manner as in Example 1, it had good resolution faithful to the original image, and the adhesion to the transparent substrate was 1.2K in a 180 degree peel test.
An image as large as g/cm was obtained. Note that the adhesion between the copper thin film and the photosensitive composition layer in the non-exposed area is 180
The degree of peeling test was 72y/c1n. When an additional electrolytic copper plating of about 35 pitches was subsequently applied to the above image, there was no risk of the image peeling off during handling.

The adhesion between the peeled off copper thin film and the release film was 2009/am in a 180 degree peel test. The image peeled off. As can be inferred from this, according to the image formation according to the known proposed method, the image (corresponding to the copper thin film described above) and the base material (
It is also clear that the adhesion force with the above-mentioned release film (corresponding to the above-mentioned release film) is extremely small.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an example of an image forming material used in the method of the present invention, and FIGS. 2 and 3 show a method of performing pattern exposure and peeling operations using the above image forming material according to the method of the present invention. FIG. ■... Transparent base material, 2... Photosensitive composition layer, 3... Conductive thin film, 4... Peeling film, 3a... Conductive thin film in non-exposed area, 3b... Exposed area Conductive thin film, i...
Patterned exposure patent applicant: Nitto Electric Industry Co., Ltd.

Claims (1)

[Claims] (1) A photosensitive composition layer, a conductive thin film, and a release film are laminated in this order on a transparent base material, and the adhesion strength (A) between the transparent base material and the photosensitive composition layer, the photosensitivity The adhesion force between the composition layer and the conductive thin film (B) and the adhesion force between the conductive thin film and the release film (C) are (A)>(C)>(B) in the non-exposed state. Using an image forming material that has the relationship (A)>(B)>(C) after exposure, pattern exposure is performed from the transparent substrate side, and then the release film is peeled off. By this, only the conductive thin film in the non-exposed area is peeled off together with this release film, and the conductive thin film in the exposed area remains as an image on the transparent substrate via the photosensitive composition layer. An image forming method using peeling.