JPS6275438A - Image forming material - Google Patents

Abstract

PURPOSE:To obtain the titled material having improved peeling developing properties by incorporating a polymer capable of solubling or swelling to an aqueous alkaline solution, polyalkyl(meth)acrylates and a satd. polyester resin capable of solubling to a solvent as a main component to a film forming polymer. CONSTITUTION:The film forming polymer comprises the polymer (a) capable of solubling or swelling to the alkaline aqueous solution, the polyalkyl(meth) acrylates (b), and the satd. polyester resin (c) capable of solubling to the solvent as the main component. As the component (a) comprises the polymer capable of solubling or swelling to the alkaline aqueous solution as the essential component, the alkaline aqueous solution may be applied in removing the patterned resist. As the components (b) and (c) are used jointly with the component (a), the adhesive property between the photopolymerizable composition contg. these polymers and the transparent base composed of the polyethylene terephthalate film is improved. Thus, the titled material having the improved peeling- developing property is obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an image forming material used for manufacturing printed wiring boards and the like.

[Conventional technology]

Conventionally, a photopolymerizable composition layer containing a film-forming polymer, a photopolymerizable unsaturated compound, and a photoinitiator is provided on a transparent support, and the photopolymerizable composition layer is placed on a substrate on which a circuit is to be formed. By stacking the layers so as to form a contact surface and peeling off the transparent support after pattern-like exposure, the unexposed portion of the photopolymerizable composition layer is peeled off together with the support, and the exposed Various image forming materials have been proposed that are composed of so-called peel-and-develop type dry film resists in which portions remain on a substrate to form a predetermined resist pattern.

Formation of a circuit using such an image forming material involves forming a resist pattern on a substrate using the method described above, and then forming a resist pattern on a portion of the substrate that does not have a resist (an unexposed portion of the photopolymerizable composition layer). For example, if this board is a printed wiring board consisting of an insulating base and a conductive layer, the part from which the conductive layer has been peeled off and removed may be subjected to necessary steps such as etching the conductive layer or plating the conductive layer. This is done by performing a circuit forming process, and then removing the patterned resist using an organic solvent.

In this circuit formation method, the resist pattern can be formed on the substrate by peeling off the transparent support, which means that there is no need to use liquid for development, which has the advantage of being good for public health. Furthermore, since no developer is used, the development cost is low and the development operation is simple.

[Problem that the invention seeks to solve]

However, although conventional image-forming materials of this type have the above-mentioned advantages due to their ability to be peeled and developed, organic solvents are not used in the final stage of removing the patterned resist. However, public health issues and cost increases still remain at this stage.

Additionally, the unexposed portion of the photopolymerizable composition layer that has been peeled off from the substrate through peel development is incinerated together with the transparent support as waste, but during this incineration, a large amount of toxic gas (no gas is generated). This has become a major public health problem.

The reason why a large amount of toxic gas is generated during incineration is that chlorinated polyethylene, chlorinated polypropylene,
This is because a halogen-containing polymer such as chlorinated rubber is used. In other words, halogen-containing polymers have conventionally been widely used in this type of image forming materials as an essential component for imparting release developability to the photopolymerizable composition layer, but this polymer is not exposed to chlorine gas during incineration. It has the disadvantage that it tends to generate a lot of toxic gas such as and its oxides.

Therefore, the present invention makes it possible to form a clear resist pattern on a substrate by peeling development, and to remove the resist using an alkaline aqueous solution, which poses fewer public health problems and higher costs than organic solvents. It can be applied, and moreover, when the unexposed part of the photopolymerizable composition layer that has been peeled off from the transparent support by peeling development is incinerated as waste, there is less generation of toxic gas, which reduces costs and improves public health. The aim is to provide image-forming materials that make a significant contribution.

[Means for solving problems]

As a result of intensive studies to achieve the above object, the inventors have determined that the support of an image forming material consisting essentially of a transparent support and a photopolymerizable composition layer is composed of a polyethylene terephthalate film; The above-mentioned photopolymerizable composition layer is made of polymers other than halogen-containing polymers, such as polymers in which the film-forming polymer, which is one of the constituent components, is a polymer soluble or swellable in an aqueous alkali solution, an alkyl (meth)acrylic acid ester polymer, and a polymer other than a halogen-containing polymer. When the structure is such that it contains a solvent-soluble saturated polyester resin as an essential component, it has excellent peel developability and the resist pattern formed on the substrate by peel development can be easily finally removed using an alkaline aqueous solution. I learned that it is possible to obtain an image forming material that does not easily generate toxic gases when the unexposed portions peeled off from the substrate during the development are incinerated together with the support as waste.
This invention was completed.

That is, the present invention provides a peelable development type, which comprises a transparent support and a layer of a photopolymerizable composition containing a film-forming polymer other than a halogen-containing polymer, a photopolymerizable unsaturated compound, and a photopolymerization initiator. An image forming material consisting of a dry film resist, wherein the transparent support is composed of a polyethylene terephthalate film, and the film-forming polymer comprises a) a polymer soluble or swellable in an aqueous alkaline solution, and b) ( The present invention relates to an image forming material characterized by containing as essential components a meth) acrylic acid alkyl ester polymer and C) a solvent-soluble saturated polyester resin.

In addition, the average molecular weight described in this specification is
It shall mean the number average molecular weight measured by gel permeation chromatography (GPC) based on polystyrene.

[Structure and operation of the invention]

The photopolymerizable composition layer in the image forming material of this invention is
The film-forming polymer contains a film-forming polymer, a photopolymerizable unsaturated compound, and a photopolymerization initiator;
(meth)acrylic acid alkyl ester polymer and C
) A solvent-soluble saturated polyester resin is contained as an essential component.

That is, the photopolymerizable composition layer of the present invention does not use a conventionally widely used halogen-containing polymer as a film-forming polymer, so it has the characteristic that it is unlikely to generate toxic gas during disposal. Moreover, since a polymer that is soluble or swellable in an alkaline aqueous solution is used as an essential component as the a component, the alkaline aqueous solution can be applied when removing the patterned resist. By using these polymers in combination, the adhesion between the photopolymerizable MS containing these polymers and the transparent support made of polyethylene terephthalate film was improved, and the peel developability was improved even though no halogen-containing polymer was used. It has excellent characteristics.

The polymer that is soluble or swellable in an aqueous alkali solution as a component used in the invention contributes effectively as a component for imparting properties of being soluble or swellable in an aqueous alkali solution to the photopolymerizable composition layer after exposure and curing. and
Its average molecular weight is usually 1,000 or more, preferably io,
A value of about ooo to 300,000 is used.

Such polymers that are soluble or swellable in alkaline aqueous solutions include homopolymers of acrylic acid or methacrylic acid, or monopolymers of these unsaturated monomers and alkyl acrylates, alkyl methacrylates, acrylamide, acrylonitrile, styrene, etc. Copolymers with other monomers, or maleic anhydride, maleic acid,
Examples include copolymers of maleic acid half esters and other monomers such as styrene, acrylic acid alkyl esters, methacrylic acid alkyl esters, and butadiene.

The (meth)acrylic acid alkyl ester polymer as component b enhances the mutual solubility of the film-forming polymer and the photopolymerizable unsaturated compound, and enhances the mutual solubility of the unsaturated compound in the photopolymerizable composition layer. By preventing separation, it not only contributes as a component that brings good results to peeling and developability, but also increases the mechanical strength of the photopolymerizable composition layer, that is, the resist pattern, after exposure and curing, and improves resistance to etching and plating solutions. It also contributes as a component that increases the The average molecular weight of component b is usually 10.000 or more, preferably 1.
It is preferably about 00,000 to 300,000.

As such components, homopolymers or copolymers of acrylic acid alkyl esters and/or methacrylic acid alkyl esters are preferred, and copolymers of these monomers with other vinyl monomers that can be copolymerized are preferred. used.

As the alkyl group of the alkyl ester constituting the acrylic acid alkyl ester and the methacrylic acid alkyl ester, a methyl group, an ethyl group, a propyl group, a butyl group, etc. are effective. Among these b components, particularly preferred are:
Polymethyl methacrylate.

The solvent-soluble saturated polyester resin as component C improves the adhesion between the transparent support made of polyethylene terephthalate film and the photopolymerizable composition layer by being used in combination with components a and b, and is effective in peel development. This serves to avoid the possibility that the unexposed portion of the layer remains partially on the substrate together with the exposed portion, thereby enabling release development without using a conventional halogen-containing polymer.

The solvent-soluble saturated polyester resin that has this function is similar to the polyethylene terephthalate film used as a transparent support in that it has a polyester structure, but the latter film is a high condensation product of terephthalic acid and ethylene glycol. In addition to terephthalic acid and ethylene glycol, other polybasic acids or polyols such as adipic acid, sepatic acid, phthalic acid,
Crystallinity is reduced by using isophthalic acid, propylene glycol, butanediol, neopentyl glycol, jethylene gelicol, etc. as a co-condensation component, and the average molecular weight is usually about 30,000 or less, preferably 10,000 to 20,000. It is essentially different from the latter support film in that it is a polymer that is a low condensation product and is soluble in many solvents.

Representative examples of commercially available solvent-soluble saturated polyester resins include Byron-200 and Vylon-300 manufactured by Toyobo Co., Ltd. 500, product name Nisperu 1101° manufactured by Hitachi Chemical Co., Ltd. 1310. 1510, trade name Polyster 5P-170 manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd.
Examples include LP-011, LP-022, and Stafix LB manufactured by Fuji Photo Film Co., Ltd.

The ratio of each of these polymers constituting the film-forming polymer is 20 to 80% by weight, preferably 30 to 60% by weight of a polymer soluble or swellable in an alkaline aqueous solution as component C, and ( The meth)acrylic acid alkyl ester polymer is 20 to 80% by weight, preferably 30 to 60% by weight, and the solvent-soluble saturated polyester resin as component C is 1 to 50% by weight, preferably 5 to 30% by weight.
It is preferable to adjust the amount to % by weight. By using the amount within such a range, good results can be obtained in both peeling developability and resist removability with an alkaline aqueous solution.

In addition, as the film-forming polymer, the above-mentioned a.

In addition to components b and C as essential components, other polymers other than the halogen-containing polymer may be used in combination as necessary within a range that does not impair the characteristics of the present invention.

In this invention, the photopolymerizable unsaturated compound, which is one of the components constituting the photopolymerizable composition layer, includes monoethylenically unsaturated compounds having one ethylenically unsaturated bond in the molecule and polyethylene having two or more ethylenically unsaturated bonds. and sexually unsaturated compounds. Particularly preferably, a polyethylenically unsaturated compound is used alone or in a mixed system with a monoethylenically unsaturated compound.

Examples of monoethylenically unsaturated compounds include acrylic acid or its esters, methacrylic acid or its esters, acrylamides, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, N-vinyl compounds, styrenes, These include crotonic acid esters.

Specific examples of acrylic esters include propyl acrylate, butyl acrylate, amyl acrylate,
2-ethylhexyl acrylate, octyl acrylate, etc.; methacrylate esters include methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, etc.; acrylamides include acrylamide, N-alkyl group is methyl group, ethyl group, etc. basis,
Butyl group, isopropyl group, tert-butyl group, 2-
N-alkyl acrylamide, which consists of an ethylhexyl group, etc., is methacrylamide, and N-alkyl methacrylate, whose N-alkyl group is a methyl group, ethyl group, isopropyl group, tert-butyl group, 2-ethylhexyl group, etc. There are amides, etc.

In addition, allyl compounds include allyl esters such as allyl acetate, allyl caproate, allyl caprylate, allyl laurate, and allyl palmitate, and the vinyl ethers include hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, and 2-ethylhexyl vinyl ether. Alkyl vinyl ether is 1, vinyl esters are vinyl butyrate, vinyl isobutyrate,
Vinyl trimethyl acetate, vinyl diethyl acetate, vinyl valerate, vinyl caproate, etc.
- Vinyl compounds such as N-vinylpyrrolidone, styrenes such as styrene, methylstyrene, chloromethylstyrene, alkoxystyrene, halogenated styrene, and styrene benzoate, and crotonate esters such as methyl crotonate, ethyl crotonate, and crotonate. butyl acid,
Examples include hexyl crotonate and isopropyl crotonate.

Next, examples of polyethylenically unsaturated compounds include polyacrylate-1-11' (and polymethacrylates), which are polyhydric alcohols. Examples of the polyhydric alcohols include polyethylene glycol, polypropylene oxide, polybutylene oxide, ( β-hydroxyethoxy)benzene, glycerin, diglycerin, neopentyl glycol, trimethylolpropane, trimethylolpropane, pentaerythritol, dipentaerythritol, sorbitan, sorbitol, l, 4-butanediol, 1, 2, 4-butanetriol , 2-butenoto-4-diol, 2-butyl-2-ethyl-propanediol, 2-butenoto-4-diol, 1,3-propanediol, triethanolamine, decalindiol, 3-chloroto-2-propanediol, etc. .

In addition, other examples of polyethylenically unsaturated compounds include:
There are acrylate oligomers and methacrylate oligomers having two or more acryloyl groups or methacryloyl groups in the molecule, which are commercially available under the names of oligoester acrylate, oligoester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, urethane methacrylate, etc.

In addition to the above-mentioned compounds, examples of photopolymerizable unsaturated compounds include monoesters of dicarboxylic acids such as succinic acid, maleic acid, phthalic acid, and hexahydrophthalic acid with 2-hydroxyethyl acrylate or methacrylate. An unsaturated compound having a carboxyl group is effective. That is, the use of this type of compound is preferable because good results can be obtained due to the dissolution and removability of the cured resist with an alkaline aqueous solution.

Such photopolymerizable unsaturated compounds are generally used in an amount of 10 to 500 parts by weight, preferably 30 to 200 parts by weight, based on 100 parts by weight of the film-forming polymer.

If this amount is too small, the photopolymerizability, that is, the exposure curing property, will be poor; if it is too large, the peeling performance will be poor, and in either case, the peeling and developing properties will be likely to be impaired.In addition, this photopolymerizable unsaturated compound If the amount increases too much, the solubility or swelling property in an alkaline aqueous solution after exposure and curing will decrease, causing problems in resist removability, unless an unsaturated compound having a carboxyl group in the molecule as mentioned above is used. This may occur.

In this invention, the photopolymerization initiator, which is another component constituting the photopolymerizable composition layer, includes a wide range of conventionally known initiators. Specific examples include carbonyl compounds, organic sulfur compounds, peroxides, redox compounds, azo and diazo compounds, and photoreducible dyes.

Examples of the above carbonyl compounds include benzoin, benzophenone, anthraquinone, 2-methylanthraquinone, 2-tert-butylanthraquinone, 9,10-phenanthrenequinone, diacetyl, benzyl, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, etc. Examples of organic sulfur compounds include dibutyl disulfide, dioctyl disulfide, dibenzyl disulfide, diphenyl disulfide, dibenzoyl disulfide, and diacetyl disulfide.

In addition, as peroxides, hydrogen peroxide, g-tert-
Butyl peroxide, benzoyl peroxide, methyl ethyl ketone peroxide, etc. are redox compounds, such as those consisting of a combination of peroxide and reducing agent, such as ferrous ion and hydrogen peroxide, ferrous ion and persulfate ion, ferrous ion and persulfate ion, etc. Diferric ions and peroxides are used as azo and diazo compounds such as α・α′-azobisisobutyronitrile, 2-azobis-2-methylbutyronitrile,
(2)-Azobis-cyclohexanecarbonitrile, diazonium salt of p-aminodiphenylamine, etc.; photoreducible dyes include rose bengal, erythrosin, eosin, acriflavin, riboflavin, thionin, etc.

These photopolymerization initiators may be used alone or in combination of two or more. The amount used is usually in the range of 0.1 to 20 parts by weight per 100 parts by weight of the photopolymerizable unsaturated compound.

The photopolymerizable composition layer of the present invention contains the above-mentioned film-forming polymer, photopolymerizable unsaturated compound, and photopolymerization initiator as essential components. Various additives such as inhibitors, colorants, adhesion improvers, fillers, and plasticizers may be included.

In the present invention, such a photopolymerizable composition layer is obtained by uniformly dissolving and dispersing each of the above components in a solvent, and depositing this on a transparent support with a thickness of 5 to 100 μm, preferably 5 to 100 μm after drying.
It is formed by coating to a thickness of 50 μm and drying.

As the above-mentioned solvent, ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, and esters such as ethyl acetate, butyl acetate, and amyl acetate are preferably used. In addition, aromatic hydrocarbons such as toluene, benzene, and xylene, halogenated hydrocarbons such as carbon tetrachloride, chloroform, trichloroethylene, and methylene chloride, and alcohols such as methanol, ethanol, propatool, and butanol are also used in the form of mixed solvents. Can be used in

In addition, the above transparent support has a thickness of 10 to 50 μm.
A polyethylene terephthalate film having a thickness of about 100 m is used. This film has excellent adhesion to the photopolymerizable composition layer using the above-mentioned specific film-forming polymer, and has transparency to light in the wavelength range of 300 to 500 nm that can photopolymerize the photopolymerizable composition layer. Good and uniform surface,
Strength.

It also has excellent dimensional stability, heat resistance, and moisture absorption.

The image-forming material of the present invention consists of a peel-and-developable dry film resist containing the transparent support obtained as described above and a photopolymerizable composition layer, and this material may optionally be provided with a dry film resist during storage. In order to protect the photopolymerizable composition layer, a protective film made of polyethylene, polypropylene, or various plastic films subjected to release treatment may be provided on the composition layer.

Next, a method for forming a circuit using the image forming material of the present invention constructed as described above will be explained.

In this method, first, the surface of a substrate on which a circuit is to be formed, such as a copper-clad laminate board for obtaining a printed wiring board, is cleaned, and the image forming material of the present invention having the above structure is applied to the cleaned surface for protection. If a film is included, the protective film is peeled off, and then the photopolymerizable composition layer is pressure-bonded to the substrate so that the contact surface becomes the contact surface. The pressure bonding temperature at this time is usually about 20 to 80°C.

Next, for example, a negative mask having a circuit pattern is placed on the transparent support and exposed to light from a light source containing light with a wavelength of 300 to 500 nm, such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a carbon arc lamp, or the like.

After being exposed in this way, the substrate is preferably
When the transparent support is peeled off from the substrate while kept at a temperature of ℃, the photopolymerizable composition layer in the exposed areas in pattern exposure is photocured and remains on the substrate, while the unexposed areas remain uncured and remain on the transparent support. The resist material is peeled off along with the resist material, thereby forming a desired resist pattern on the substrate.

Next, the exposed surface of the substrate without resist, or in the case of a printed wiring board, the copper surface without resist, is etched using an etching solution such as ferric chloride solution or cupric chloride solution. After that, it is hardened by immersing it in an alkaline aqueous solution such as sodium hydroxide or potassium hydroxide containing about 3 to 8% by weight, preferably at a temperature of 40 to 80°C, or by spraying such an alkaline aqueous solution. The resist then dissolves or swells and peels off from the substrate.

Thereafter, by thoroughly rinsing with water and drying, a positive image circuit pattern etched onto the substrate is obtained.

In addition, when a positive mask is used instead of a negative mask in the above method, after forming a resist pattern in the same manner as above, copper, solder, gold, etc. are applied to the substrate surface that does not have a resist instead of etching. By performing plating treatment and then removing the resist using an alkaline aqueous solution in the same manner as described above, a positive image circuit pattern plated on the substrate can be obtained.

〔Effect of the invention〕

As described above, in this invention, the transparent support in the peelable and developable dry film resist is composed of a polyethylene terephthalate film, while the photopolymerizable composition layer contains a specific film-forming polymer other than the halogen-containing polymer. This makes it possible to perform peel-off development, and to remove the hardened resist after the necessary circuit formation treatment using an alkaline aqueous solution, which is cheaper than organic solvents and poses fewer public health problems. Moreover, it is possible to suppress the generation of toxic gases when incinerating the unexposed portions peeled off by peel development together with the transparent support as waste, making circuit formation cheaper and more sanitary than conventional methods. This has the advantage of being able to do the following.

〔Example〕

EXAMPLES Below, examples of the present invention will be described in more detail. In addition, in the following, parts shall mean parts by weight.

Example 1 Tiyanal Bl? -88) Benzophenone 6 parts Tribromomethylphenylsulfone 1 part Paramethoxyphenol 0.1 part Victoria Pure Blue
0.2 parts methyl ethyl ketone 3
00 parts A solution of the photopolymerizable composition was prepared by uniformly dissolving and mixing the above materials. This liquid was applied onto a polyethylene terephthalate film with a thickness of 25 μm so that the thickness after drying would be 25 μm, and then dried at 80°C for 5 minutes to form an image forming material consisting of a peelable and developable dry film resist. Obtained.

This image forming material was laminated under pressure at a temperature of 50°C on the copper-clad surface of a copper-clad glass epoxy laminate substrate whose surface had been cleaned, with the photopolymerizable composition layer side facing the contact surface, and then A negative original having a circuit pattern was brought into close contact with the transparent support of this image forming material, and a 60cm
Exposure was performed for 10 seconds from a distance a+. Next, when the substrate temperature is set to 30°C and the polyethylene terephthalate film, which is the transparent support for the image forming material, is peeled off from the substrate, the non-exposed areas are peeled off from the substrate and only the exposed areas remain on the substrate. A resist pattern constituting a positive circuit was formed.

Next, the copper-clad substrate having the resist pattern thus obtained was etched with a ferric chloride aqueous solution at 40 degrees Baumé to remove the exposed copper foil. Thereafter, a sodium hydroxide aqueous solution with a concentration of 3% by weight (
When the resist was immersed in a solution (temperature: 50° C.) for 5 minutes, the cured resist swelled and peeled off from the substrate. A desired printed wiring board was obtained by washing this board with water and drying it.

On the other hand, the unexposed portion of the photopolymerizable composition layer, which was peeled off along with the transparent support made of polyethylene terephthalate film by peel development, was transported together with the support to a disposal site and subjected to incineration. It was found that the amount of toxic gas generated during this process was small, and that the process could be carried out without causing any public health problems.

Example 2 Diethylthioxanthone 3 parts Isoamyl dimethylaminobenzoate 2 parts para-toluenesulfonyl chloride 1 part para-methoxyphenol
0.1 part crystal violet 0.
3 parts Methyl ethyl ketone 300 parts An image forming material was prepared in the same manner as in Example 1 using the above photopolymerizable composition solution, and a circuit was formed using this material in the same manner as in Example 1. A printed wiring board having the same desired circuit pattern as in Example 1 could be obtained. It should be noted that the patterned resist can be easily removed using an alkaline aqueous solution in the circuit formation process, and the incineration treatment of the unexposed portion of the photopolymerizable composition layer that has been peeled off and removed together with the transparent support also does not generate a large amount of toxic gas. It was possible to dispose of it without causing any problems in terms of public health.

Comparative Examples 1 to 3 The solvent-soluble saturated polyester resin in the photopolymerizable composition solution of Example 2 was not used, and the film-forming polymer in the solution was replaced with 45 parts of a copolymer of styrene and isopropyl maleate half ester. polymethyl methacrylate 50
(Comparative Example 1), 50 parts of a copolymer of styrene and isopropyl maleate half ester and 50 parts of polymethyl methacrylate (Comparative Example 2), 45 parts of a copolymer of styrene and isopropyl maleate half ester and polymethyl An image forming material was produced in the same manner as in Example 2, except that 55 parts of methacrylate (Comparative Example 3) and 55 parts of methacrylate were used.

Next, an attempt was made to form a circuit using each material in the same manner as in Example 2, but when the transparent support was peeled off after pattern exposure, the unexposed portions remained on the substrate along with the exposed portions, resulting in a good result. Peeling development could not be performed.

Example 3 Copolymer of methyl methacrylate and methacrylate 60 parts Hydrolic acid in a molar ratio of 8:2 Solvent-soluble saturated polyester resin 10 parts (trade name: Vylon 200, manufactured by Toyobo Co., Ltd.) Diethylthioxanthone 3 parts Isoamyl dimethylaminobenzoate 2 An image forming material was prepared in the same manner as in Example 1 using the above photopolymerizable composition solution,
When a circuit was formed using this material in the same manner as in Example 1, a printed wiring board having the same desired circuit pattern as in Example 1 could be obtained. Note that the patterned resist can be easily removed using an aqueous alkaline solution in the circuit formation process, and incineration of the non-exposed portion of the photopolymerizable composition layer that has been peeled off and removed together with the transparent support also does not generate a large amount of toxic gas. It was possible to dispose of it without causing any problems in terms of public health.

Claims (1)

[Claims] (1) From a peelable and developable dry film resist comprising a transparent support and a layer of a photopolymerizable composition containing a film-forming polymer other than a halogen-containing polymer, a photopolymerizable unsaturated compound, and a photopolymerization initiator. an image-forming material comprising: the transparent support comprising a polyethylene terephthalate film; and the film-forming polymer comprising:
An image forming material comprising as essential components a) a polymer soluble or swellable in an aqueous alkaline solution, b) an alkyl (meth)acrylic ester polymer, and c) a saturated polyester resin soluble in a solvent.