JPS6234152A - Image forming material and method for forming circuit using its material - Google Patents

Abstract

PURPOSE:To make a formation of a resist pattern and a removal of the formed resist pattern easy, thereby improving it from a sanitary point of view by incorporating a specific film forming polymer and a specific photopolymerizable unsatd. compd. in a photopolymerizable composition layer. CONSTITUTION:The titled material comprises a polymer capable of solubling to or swelling to an alkaline aqueous solution as the film forming polymer, and an ethylenically unsatd. compd. contg. a carboxylic group as the photopolymerizable unsatd. compd. so as to be the prescribed compounding ratio in the photopolymerizable composition layer. As the result, the cured resin may be easily removed with the alkaline aqueous solution, without interfering the peeling development and the curing properties of the titled material. Thus, the titled material may be easily effected the formation and the removal of the resist pattern and may be improved from the public sanitary point of view.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an image forming material used for manufacturing printed wiring boards and the like, and a circuit forming method using this material.

[Conventional technology]

Conventionally, a photopolymerizable composition layer is provided on a transparent support, and the photopolymerizable composition layer is laminated on the substrate on which a circuit is to be formed so that it becomes the contact surface, and then exposed to light in a pattern. By peeling off the transparent support, the non-exposed portion of the photopolymerizable composition layer is peeled off together with the support, and the exposed portion remains on the substrate to form a predetermined resist pattern, so-called peeling. Various image forming materials made of developable dry film resists have been proposed.

Formation of a circuit using such an image forming material involves forming a resist pattern on a substrate by the method described above, and then forming a resist pattern on a portion of the substrate that does not have a resist (a photopolymerizable composite layer). The non-exposed part was removed by 11 minutes)
On the other hand, for example, if this board is a printed wiring board consisting of an insulating base and a conductor layer, the necessary circuit formation processing such as etching the conductor layer or plating on the conductor layer is performed, Thereafter - by removing the patterned resist.

In this circuit formation method, the resist pattern can be formed on the substrate by peeling off the transparent support, which means that there is no need to use liquid for development, which has the advantage of being good for public health. Furthermore, since no developer is used, the development cost is low and the development operation is simple.

[Problems to be Solved by the Invention] However, after forming a resist pattern by such peeling development and performing necessary circuit formation processing such as etching and plating, there is a step of removing the patterned resist. Generally, an organic solvent is used, and a method is adopted in which the resist 1- is removed by 7 hours using this solvent. Therefore, even if stripping development can reduce costs and provide public health benefits, as long as organic solvents are used in the resist removal step, there will be no public health problems or increased costs at this step. still remains.

Therefore, an object of the present invention is to provide an image forming material and a circuit forming method using the same, which can reduce costs and improve public health both in the resist pattern formation stage and in the resist pattern removal stage.

[Means for solving problems]

As a result of intensive studies to achieve the above object, the inventors discovered that the photopolymerizable composition layer of the 'fJI release-developable dry film resist contains a specific film-forming polymer and a specific photopolymerizable unsaturated compound. When a resist containing both is used, a desired resist pattern can be formed by peeling development, and it can be removed very easily and especially in a short time using an alkaline aqueous solution.
It was discovered that such an aqueous solution could significantly reduce costs and improve public health compared to the use of conventional organic solvents, leading to the completion of this invention.

That is, the present invention comprises a transparent support, a) a film-forming polymer whose main components are a polymer soluble or swellable in an alkaline aqueous solution and a halogen-containing polymer, and b) at least an ethylenically unsaturated compound having a carboxyl group. and C) a photopolymerizable composition layer containing a photopolymerization initiator as an essential component. The image forming material is laminated on a substrate on which a circuit is to be formed so that the photopolymerizable composition layer is in close contact with the substrate, exposed to light in a pattern, and then peeled and developed to form a resist pattern. , a second invention relating to a circuit forming method characterized in that after performing necessary circuit forming processing such as etching or plating, the patterned resist is removed with an alkaline aqueous solution.

[Structure and operation of the invention]

The photopolymerizable composition layer in the image forming material of this invention is
a) a film-forming polymer whose main components are a polymer soluble or swellable in an alkaline aqueous solution and a halogen-containing polymer, b) a photopolymerizable unsaturated compound containing at least an ethylenically unsaturated compound having a carboxyl group, and C) light. It contains a polymerization initiator as an essential component, and J
Component 1 a contains a polymer that is particularly soluble or swellable in an alkaline aqueous solution, and the above components contain an ethylenically unsaturated compound having a carboxyl group,
The composition layer after exposure and curing contains a polymer having a carboxyl group in the molecule as a part of the composition, thereby ensuring that it is soluble or swellable in an alkaline aqueous solution.

In addition, there are cases where component a contains a polymer that is soluble or swellable in an alkaline aqueous solution, but component b does not contain an ethylenically unsaturated compound having a carboxyl group, or conversely, component b contains an ethylenically unsaturated compound having a carboxyl group. Even if component a contains an unsaturated compound but does not contain a polymer that is soluble or swellable in an alkaline aqueous solution, it is possible to dissolve and remove the photopolymerizable composition layer after curing with an alkaline aqueous solution. This applicant has already applied for a patent.

However, in the former case, in order to effectively remove the cured product with an alkaline aqueous solution, it is necessary to use a polymer that is soluble or swellable in the alkaline aqueous solution in a considerable proportion of the component a. As a result of the relative reduction in the amount of other polymers used, such as halogen polymers, there was a risk that peeling and developability would be impaired.

In the latter case, in order to similarly remove the cured product with an alkaline aqueous solution, it is necessary to use a considerable proportion of the ethylenically unsaturated compound having a carboxyl group in component b; As a result of the relative reduction in the use of other ethylenically unsaturated compounds used in conjunction with the
There was a risk that the ilt developability would be impaired. and,
In any of the above cases, if the amounts of each of the above components are set within the ranges that cause few problems, even if the cured product can be removed with an alkaline aqueous solution, there is a problem in that it takes some time to remove it. Ta.

On the other hand, as in the present invention, when a polymer that is widely soluble or swellable in alkaline aqueous solution is used as component a, and an ethylenically unsaturated compound having a carboxyl group as one of component b, both components are used together. By using the total amount in a predetermined ratio, that is, by setting the proportions of both components in the a component and the b component to a predetermined ratio that does not become too large, peeling developability, This provides the effect that the cured product can be removed satisfactorily with an alkaline aqueous solution without any hindrance to curability, that is, it can be removed in a very short time.

The polymer soluble or swellable in the aqueous alkali solution used in the present invention is a homopolymer of acrylic acid or methacrylic acid, or a combination of these unsaturated monomers with an acrylic acid alkyl ester, a mecric acid alkyl ester, acrylamide, or acrylonitrile. , copolymers with other monomers such as styrene, or copolymers of maleic anhydride, maleic acid, maleic acid half esters, etc. with other monomers such as styrene, acrylic acid alkyl esters, methacrylic acid alkyl esters, butadiene. There are copolymers with

In this invention, the halogen-containing polymer used in combination with the polymer soluble or swellable in an aqueous alkaline solution is
It is used to impart peel developability to the photopolymerizable composition layer, and specific examples thereof include chlorinated polyethylene, chlorinated polypropylene, and chlorinated rubber.

The film-forming polymer as component a is mainly composed of a polymer that is soluble or swellable in the above-mentioned alkaline water solution and a halogen-containing polymer, and both polymers generally have poor compatibility and are not suitable for image forming materials. If the two polymers form a phase, it may not be possible to obtain desirable results.

Therefore, in order to prevent this, it is preferable to use a third polymer that has good compatibility with both of them, and polymethyl methacrylate can be suitably used as an example of this.

The proportion of each of these polymers used is 10 to 90% by weight of a polymer that is soluble or swellable in an alkaline aqueous solution;
Preferably 20 to 80% by weight, halogen-containing polymer) 0
-50% by weight, preferably 10-40% by weight, and 0-40% by weight, preferably 1% by weight of a third polymer having good compatibility with both.
It is preferable to adjust the amount to 0 to 40% by weight.

In this invention, the ethylenically unsaturated compound having a carboxyl group used as one of the components b can be widely used as long as it has a carboxyl group in the molecule and one or more ethylenically unsaturated bonds. Examples include unsaturated monomers such as acrylic acid, methacrylic acid, and maleic acid, and the following general 2;
H2=CC0-0(R'0)-OCRCOOH (in the formula,
Examples include monoester compounds represented by the following formula: R is hydrogen or a methyl group, R' is an alkylene group, R is a dicarboxylic acid residue, and n is an integer of 1 or more.

Examples of the dicarboxylic acid for obtaining this ester compound include succinic acid, maleic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, etc., and as the glycol, R'O in the above general formula is ethylene oxide, Examples include alkylene oxides having 2 to 4 carbon atoms such as propylene oxide and butylene oxide, glycols in which n is 1, and polyalkylene oxide glycols in which n is 2 to 30.

Among such ester compounds, dicarboxylic acids and (
(PoIJ) Ester compounds represented by the following formulas, which are reaction products of ethylene glycol and acrylic acid, are most preferred.

CHz=C11CO-0-(CHzCI(zO)-0C
CIIzCH□COO11CH2=C) ICO-0(C
IIZC)120)-0CCI(=CIICOO1lC
H2=CHCO-0-CCH2C1+20)-,0CQ
COOtlCH2=C11CO-0-(C112CH2
0)-QCC0OH'' Also=ノC112=C11CO-0(CH2CH2O)-QC□
C0OH. It is preferable to use it in combination with one or more ethylenically unsaturated compounds.

In this combination system, it is preferable that the amount of the ethylenically unsaturated compound having a carboxyl group is 20% by weight or more in component b.

The ethylenically unsaturated compounds that can be used in combination include monoethylenically unsaturated compounds having one ethylenically unsaturated bond in the molecule and polyethylenically unsaturated compounds having two or more ethylenically unsaturated bonds. Particularly preferably, a polyethylenically unsaturated compound is used alone or in a mixed system with a monoethylenically unsaturated compound.

Examples of monoethylenically unsaturated compounds include acrylic esters, methacrylic esters, acrylamides, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, N-vinyl compounds, styrenes, and crotonic esters. and so on.

Specific examples of acrylic esters include propyl acrylate, butyl acrylate, amyl acrylate,
2-ethylhexyl acrylate, octyl acrylate, etc.; methacrylate esters include methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, etc.; acrylamides include acrylamide, N-alkyl group is methyl group, ethyl group, etc. basis,
Butyl group, isopropyl group, tert-butyl group, 2-
N-alkyl acrylamide, which consists of an ethylhexyl group, etc., is methacrylamide, and N-alkyl methacrylate, whose N-alkyl group is a methyl group, ethyl group, isopropyl group, tert-butyl group, 2-ethylhexyl group, etc. There are amides, etc.

In addition, allyl compounds include allyl esters such as allyl acetate, allyl caproate, allyl caprylate, allyl laurate, and allyl palmitate, and the vinyl ethers include hexyl vinyl ether, octyl vinyl ether,
Alkyl vinyl ethers such as decyl vinyl ether and 2-ethylhexyl vinyl ether are 1, and vinyl esters such as hahinyl butyrate, vinyl isobutyrate, vinyl trimethyl acetate, vinyl diethyl acetate, vinyl valerate, and vinyl caproate are N-
Vinyl compounds include N-vinylpyrrolidone, styrenes include styrene, methylstyrene, chloromethylstyrene, alkoxystyrene, halogenated styrene, and styrene benzoate, and crotonate esters include methyl crotonate, ethyl crotonate, and crotonate. Examples include butyl, hexyl crotonate, and isopropyl crotonate.

Next, examples of polyethylenically unsaturated compounds include polyester acrylates and polymethacrylates of polyhydric alcohols. The polyhydric alcohol mentioned above is
Polyethylene glycol, polypropylene oxide, polybutylene oxide, (β-hydroxyethoxy) hein, glycerin, diglycerin, neopentyl glycol, trimethylolpropane, trimethylolpropane, pentaerythritol, dipentaerythritol,
Sorbitan, sorbitol, 1,4-butanediol,
1,2,4-butanetriol, 2-ptento-4-diol, 2-butyl-2-ethyl-propanediol,
Examples include 2-butenoto-4-diol, 1,3-propanediol, triethanolamine, decalindiol, and 3-chloroto-2-propanediol.

In addition, other examples of polyethylenically unsaturated compounds include:
Acrylate oligomers and methacrylate oligomers having two or more acryloyl or methacryloyl groups in the molecule are commercially available under the names of oligoester acrylate, oligoester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, urethane methacrylate, etc. be.

The photopolymerizable unsaturated compound as component b consisting of such constituent components is usually 10 to 500 parts by weight, preferably 30 to 2 parts by weight, based on 100 parts by weight of the film-forming polymer.
It is used in the range of 00 double parts. If this gap is too small, the photopolymerizability, that is, the exposure curing property is poor, and if it is too large, the peeling performance is poor, and in either case, the peeling and developing properties tend to be impaired.

In addition, in this invention, in the usage ratio of component a and component b as described above, one component a is a polymer soluble or swellable in an alkaline aqueous solution, and one component b is an ethylenic inorganic compound having a carboxyl group. The total amount with the saturated compound is 10% by weight in the total amount of components a and b.
As mentioned above, it is preferable that the content is usually in the range of 30 to 60% by weight.

The photopolymerization initiator as component C used in this invention includes a wide variety of conventionally known photopolymerization initiators. Specific examples include carbonyl compounds, organic sulfur compounds, peroxides, redox compounds, azo and diazo compounds, and photoreducible dyes.

Examples of the above carbonyl compounds include benzoin, benzophenone, anthraquinone, 2-methylanthraquinone, 2-tert-butylanthraquinone, 9,10-phenanthrenequinone, diacetyl, benzyl, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, etc. Examples of the sulfur compound include dibutyl disulfide, dioctyl disulfide, dibenzyl disulfide, diphenyl disulfide, dibenzoyl disulfide, and diacetyl disulfide.

In addition, as peroxides, hydrogen peroxide, tart-
Butyl peroxide, benzoyl peroxide, methyl ethyl ketone peroxide, etc. are used as redox compounds. Diferric ions and peroxides are used as azo and diazo compounds such as α・α′-azobisisobutyronitrile, 2-azobis-2-methylbutyronitrile,
-azobis-cyclohexanecarbonitrile, diazonium salt of p-aminodiphenylamine, etc.; photoreducible dyes include rose hengal, erythrosin, eosin, acriflavin, riboflavin, thionin, etc.

These photopolymerization initiators may be used alone or in combination of two or more. The amount used is usually 0.1 parts by weight per 100 parts by weight of the photopolymerizable unsaturated compound as the above-mentioned component.
The amount may be in the range of 20 parts by weight.

The photopolymerizable composition layer of this invention comprises a, b as described above.
, component C are essential components, but in addition to these components, various additives such as a thermal polymerization inhibitor, a coloring agent, an adhesion improver, a filler, and a plasticizer may be included as necessary.

In the present invention, such a photopolymerizable composition layer is obtained by uniformly dissolving and dispersing each of the above components in a solvent, and applying this to a transparent support-F with a thickness of 5 to 100 μm, preferably 5 to 100 μm after drying.
It is formed by coating and drying to a thickness of ~50 μm.

Examples of the above solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate,
Esters such as butyl acetate and amyl acetate are preferably used. In addition, mixed solvents include aromatic hydrocarbons such as toluene, benzene, and xylene, halogenated hydrocarbons such as carbon tetrachloride, chloroform, trichloroethylene, and methylene chloride, and alcohols such as methanol, ethanol, propatool, and butanol. It can be used in the form of

Further, the above-mentioned transparent support preferably has good transmittance to light in a wavelength range of 300 to 500 nm that allows photopolymerization of the photopolymerizable composition layer, and has a uniform surface. Specific examples of such transparent supports include various plastic films such as polyethylene terephthalate, polypropylene, cellulose triacetate, cellulose diacetate, polycarbonate, and cellophane. Among these, polyethylene terephthalate is preferred from the viewpoints of strength, three-dimensional stability, heat resistance, and hygroscopicity. The preferred thickness of the transparent support is 10 to 50 μm.

The image-forming material of the present invention comprises a ♀11 release-developable dry film resist comprising the transparent support obtained as described above and a photopolymerizable composition layer. The major feature is that it contains the specific polymer as component a and the specific photopolymerizable unsaturated compound as component b. In addition, this material has
In order to protect the photopolymerizable composition layer during storage, a protective film 1 made of polyethylene, polypropylene, or various plastic films subjected to release treatment may be provided on the composition layer.

Next, a method for forming a circuit using the image forming material of the present invention constructed as described above will be explained.

In this method, first, the surface of a substrate on which a circuit is to be formed, such as a copper-clad laminate board for obtaining a printed wiring board, is purified by 7n, and the image forming material of the present invention having the above-mentioned structure is applied to the cleaned surface. If a protective film is included, the protective film is peeled off, and then the photopolymerizable composition layer side is pressure-bonded to the substrate so that the contact surface becomes the contact surface. The pressure bonding temperature at this time is usually about 20 to 80°C.

Next, for example, a negative mask having a circuit pattern is placed on the transparent support and exposed to light from a light source containing light with a wavelength of 300 to 500 nm, such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a carbon arc lamp, or the like.

After being exposed in this way, the substrate is preferably
When the transparent support is peeled off from the substrate while kept at a temperature of °C, the photopolymerizable composition layer in the exposed areas in pattern exposure is photocured and remains on the substrate, while the unexposed areas remain uncured and transparent. It is peeled off together with the support, thereby forming a desired resist pattern on the substrate.

Next, the exposed surface of the substrate without resist, or in the case of a printed wiring board, the copper surface without resist, is etched using an etching solution such as ferric chloride solution or cupric chloride solution. Thereafter, it is immersed in an alkaline aqueous solution such as sodium hydroxide or potassium hydroxide having a concentration of about 3 to 8% by weight, preferably at a temperature of 40 to 80°C, or is immersed in such alkaline water. 6? (By spraying M, the hardened resist dissolves or swells and is released from the substrate in a short time. After that, by thoroughly washing with water and drying, a positive image circuit pattern etched on the substrate is obtained. .

In addition, when a positive mask is used instead of a negative mask in the above method, after forming a resist pattern in the same manner as above, copper, solder, gold, etc. are applied to the substrate surface that does not have a resist instead of etching. By performing plating treatment and then removing the resist using an alkaline aqueous solution in the same manner as described above, a positive image circuit pattern plated on the substrate can be obtained.

[Effects of the Invention] As described above, in this invention, a specific film-forming polymer and a specific photopolymerizable unsaturated compound are included in the photopolymerizable composition layer of a peelable and developable dry film resist. By using this method, a resist pattern can be formed easily and well by peeling development, and it can also be removed very easily using an alkaline aqueous solution, which is inexpensive and poses no public health problems. It has the advantage that it is relatively inexpensive and can be formed hygienically.

〔Example〕

EXAMPLES Below, examples of the present invention will be described in more detail. In addition, in the following, parts shall mean parts by weight.

Example 1 (Product name: Dyanal BR-80, manufactured by Mitsubishi Rayon Co., Ltd.) Diethylthioxanthone 3 parts Isoamyl dimethylaminobenzoate 2 parts Paramethoxyphenol 0.1 part Tribromomethyl phenyl sulfone 2 parts Crystal violet 0.
2 parts Methyl ethyl ketone 300 parts A solution of the photopolymerizable composition was prepared by uniformly dissolving and mixing the above materials. This solution was applied onto a 25 μm thick polyethylene terrestrial film so that the thickness after drying would be 25 μm, and then dried at 80°C for 5 minutes. I got it.

This image forming material was laminated under pressure at a temperature of 50°C on the copper-clad surface of a copper-clad glass epoxy laminate substrate whose surface had been cleaned, so that the photopolymerizable composition layer side was the contact surface, Furthermore, a negative original having a circuit pattern was brought into close contact with the transparent support of this image forming material, and a 600 m
Exposure was performed for 10 seconds from a distance of cm. Next, when the substrate was heated to 30°C and the polyethylene terephthalate film, which is a transparent support for the image forming material, was peeled off from the substrate, the non-exposed areas were peeled off from the substrate along with the film, and the copper-clad surface of the substrate was hardened. A resist pattern constituting a positive image circuit consisting of exposed portions was formed.

The copper-clad substrate having the resist pattern thus obtained was etched with a ferric chloride aqueous solution at 40 degrees Baumé to remove the exposed copper foil. After that, a sodium hydroxide aqueous solution with a concentration of 3% by weight (liquid temperature 50%
℃) for 2 minutes, the cured resist swelled and peeled off from the substrate. A desired printed wiring board was obtained by washing this board with water and drying it.

Example 2 Example 1 except that a positive original was used, which was the opposite of the negative original.
In the same manner as above, a resist pattern constituting a negative circuit was formed on a copper-clad laminate board. Next, after applying solder plating to the exposed copper-clad surface of this board, alkaline water was applied. By removing the resist by drying, a solder-plated positive circuit pattern was formed on the copper-clad surface.

After that, etching is performed at 40°C using an alkaline etchant (trade name manufactured by Japan Metal Finishing Co., Ltd.) that does not melt solder but can melt copper, resulting in the desired solder-plated printed wiring board. Ta.

Comparative Example 1 The composition of the photopolymerizable composition solution of Example 1 was the same as Example 1 except that the number of oligoester acrylate used was 150 parts and 2-hydroxyethyl acrylate monoester of phthalic acid was not used. An image forming material was produced in the same manner as described above. Next, using this material, Example 1,
An attempt was made to form a circuit similar to Example 2, but it took about 20 minutes to remove the patterned resist with an alkaline aqueous solution, and it was difficult to form a circuit similar to Example 1.
It took more time to remove the resist than in ゜2.

Comparative Example 2 Of the composition of the photopolymerizable composition solution of Example 1, the number of parts used of chlorinated polyethylene was 50 parts, the number of parts used of polymethyl methacrylate was 50 parts, and styrene and isopropyl maleate half ester were copolymerized. An image forming material was produced in the same manner as in Example 1, except that no material was used.

Next, we attempted to form a circuit similar to Examples 1 and 2 using this material, but it took about 10 minutes to remove the patterned resist with an alkaline aqueous solution, and the resist removal was faster than in Examples 1 and 2. It took time.

Comparative Example 3 Of the composition of the photopolymerizable composition solution of Example 1, the number of parts used of polymethyl methacrylate was 40 parts, the number of parts used of a copolymer of styrene and isopropyl maleate half ester was 60 parts, and chlorination was performed. An image forming material was produced in the same manner as in Example 1 except that polyethylene was not used.

Next, this material was laminated onto a substrate and exposed in the same manner as in Examples 1 and 2, and then stripping development was performed, but both exposed and non-exposed areas remained on the substrate. , only the polyethylene terephthalate film peeled off. That is, with the above materials, it was not possible to form a desired resist pattern on the substrate by peeling and development.

Example 3 Acrylate monoester diethylthioxanthone 3 parts Isoamyl dimethylaminobenzoate 2 parts Paramethoxyphenol 0.1 part p-Toluenesulfonyl chloride 1 part Victoria Pure Blue 0.
3 parts Methyl ethyl ketone 300 parts An image forming material was prepared in the same manner as in Example 1 using the above photopolymerizable composition solution, and the following Examples 1 and 2 were prepared using this material.
When I formed the circuit in the same manner as above, ! F, IJ =
v Formation of a resist pattern by development and removal of patterned resist by an alkaline aqueous solution are both easy, and in particular, the resist removal time is as short as 2 minutes; Example 1.2
A printed wiring board having the same desired circuit pattern could be obtained.

Example 4 Latester diethylthioxanthone 3 parts Isoamyl dimethylaminobenzoate 2 parts Paramethoxyphenol 0.1 part p-) Luenesulfonyl chloride 1 part Victoria Pure Blue 0.
3 parts Methyl ethyl ketone 300 parts An image forming material was prepared in the same manner as in Example 1 using the above photopolymerizable composition solution, and this material was used in the following Examples 1 and 2.
When a circuit was formed in the same manner as in Example 1 and 2, both the formation of a resist pattern by peeling development and the removal of the patterned resist by an alkaline aqueous solution were easy, and the resist removal time was particularly short at 2 minutes, which was the same as in Examples 1 and 2. A printed wiring board having the desired circuit pattern could be obtained.

Claims (2)

[Claims] (1) Photopolymerization comprising a transparent support, a) a film-forming polymer whose main components are a polymer soluble or swellable in an alkaline aqueous solution and a halogen-containing polymer, and b) at least an ethylenically unsaturated compound having a carboxyl group. 1. An image forming material comprising a peelable and developable dry film resist comprising a photopolymerizable composition layer containing a polyunsaturated compound and c) a photopolymerization initiator as an essential component. (2) Photopolymerization comprising a transparent support, a) a film-forming polymer whose main components are a polymer soluble or swellable in an alkaline aqueous solution and a halogen-containing polymer, and b) at least an ethylenically unsaturated compound having a carboxyl group. An image forming material consisting of a peelable and developable dry film resist containing a photopolymerizable composition layer containing a photopolymerization initiator as an essential component and a photopolymerizable composition layer containing a photopolymerization initiator as an essential component is placed on a substrate on which a circuit is to be formed. After laminating the adhesive composition layer side so that it is the contact surface and exposing it to light in a pattern, a resist pattern is formed by peeling and development, and after performing necessary circuit forming processes such as etching and plating, the above pattern is formed. A circuit forming method characterized by removing a shaped resist using an alkaline aqueous solution.