JP2003289177A - Method of manufacturing wiring board for cof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method by which a wiring board for COF on which pattern abnormality hardly occurs can be manufactured by suppressing the intrusion of air between a flexible substrate and a photosensitive resin layer when the resin layer is laminated upon the substrate. <P>SOLUTION: The wiring board for COF is manufactured by laminating a photosensitive resin laminate upon the flexible substrate upon which copper foil chemically or mechanically polished to have average surface roughness (Ra-1) or an average center-line height (Ra-2) of 10-200 nm is laminated. In addition, a cured resist is obtained by exposing the photosensitive resin laminate to light correspondingly to a desired wiring pattern and the unexposed photosensitive resin is removed through development. Thereafter, the cured resist is removed by peeling after the portion of the copper foil not covered with the cured resist is removed from the substrate by etching or the portion is plated with a metal. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a COF wiring board. More specifically, the conductor width is 30 μm
The present invention relates to a method for manufacturing a COF wiring board having a fine pattern.

[0002]

2. Description of the Related Art In the present invention, COF (Chip On) is used.
The abbreviation of “Film” is a composite component in which a semiconductor IC (Chip) is mounted on a film-shaped fine wiring board (Film). In many cases, such COFs are used by connecting them to larger rigid wiring boards and display boards, and in further miniaturizing electronic devices,
This is a mounting form that has been particularly noticed in recent years. Film-shaped fine wiring board used here (that is, COF wiring board)
Can be said to be a kind of flexible printed wiring board because it is made of a flexible substrate obtained by laminating an organic polymer film such as polyimide or polyester and a copper foil, and is particularly characterized by a fine circuit. .

Historically, TAB (Tape Auto)
Although there is a mounting form called "Mated Bonding", a semiconductor IC is mounted on a film-shaped fine wiring board, and the wiring board is connected to another wiring board or display. From the above, it can be said that it is a kind of COF or a different name, so in the present invention, TA
In the sense including B, the expression COF is collectively adopted. The COF wiring board is manufactured by the same manufacturing method as that of a general printed wiring board.

That is, a photosensitive resin layer is laminated on the copper surface of a flexible substrate, exposure is performed in accordance with a desired wiring pattern, and the required portion of the photosensitive resin is photo-cured. Next, the photosensitive resin in the unexposed area is removed by development, and then the coated copper layer of the substrate that is not covered by the cured resist is removed by etching, or plating metal is applied to the area not covered by the cured resist by plating. To precipitate. Finally, the cured resist is removed by peeling to obtain a wiring board having a desired conductor pattern. As a method for laminating a photosensitive resin on a copper surface of a flexible substrate, a method of applying and drying a liquid resist has been widely used, but recently, in terms of productivity and quality, laminating a photosensitive resin laminate. The method has begun to be used.

The photosensitive resin laminate is a laminated film in which a photosensitive resin layer having a thickness of 1 to 100 μm is sandwiched between a support film and a protective film. When laminating this on a flexible substrate, peel off the protective film, and then stack the photosensitive resin layer and the copper surface of the flexible substrate in a stacking manner by pressing between a pair of upper and lower hot rolls for crimping. Let In the case of a double-sided plate in which copper is laminated on both sides of a flexible substrate, two flexible resin laminates are laminated on both sides of one flexible substrate.

It is desirable that the photosensitive resin laminated by lamination is in close contact with the entire copper surface of the flexible substrate. If a portion that does not adhere to a part is generated, the etching solution or the plating solution may enter there, causing disconnection, chipping, short circuit, deformation, etc. of the wiring pattern. In particular, in the case of manufacturing a COF wiring board including wiring having a conductor line width of 30 μm or less, it is difficult to obtain a normal wiring board even if a non-adhering portion occurs in a small area. However, in the conventional method, in the laminating step, minute air is introduced in some places between the flexible substrate and the photosensitive resin layer, so that a normal wiring board cannot be produced with high yield.

Further, the mixing of air occurs when laminating a thin photosensitive resin laminate having a photosensitive resin layer thickness of 25 μm or less, and hardly occurs in a photosensitive resin laminate having a thickness exceeding 25 μm. It was On the other hand, for fine wiring having a conductor line width of 30 μm or less, a thin photosensitive resin laminated body of 25 μm or less is suitable from the viewpoint of resolution and etching property. Due to this trade-off, in manufacturing a COF wiring board, The method of using the photosensitive resin laminate, which should be advantageous in terms of productivity and quality, has been a cause of hindering widespread use.

[0008]

DISCLOSURE OF THE INVENTION The present invention provides a method for manufacturing a COF wiring board in which air is prevented from being mixed between a flexible substrate and a photosensitive resin layer in a laminate and pattern abnormalities are less likely to occur. The purpose is to

[0009]

As a result of studies to solve the above problems, it was discovered that controlling the surface condition of a flexible substrate by chemical polishing or mechanical polishing significantly suppresses air mixing during lamination. The present invention has been completed. That is, in the present application, (1) a film having a thickness of 10 to 100 μm is subjected to chemical polishing or mechanical polishing to have an average surface roughness (Ra−
1) or center line average roughness (Ra-2) is 10 to 20
On a flexible substrate laminated with 0 nm copper foil,
(A) Laminating the photosensitive resin laminate, (b) performing exposure corresponding to a desired wiring pattern, photocuring the photosensitive resin in the exposed portion to obtain a cured resist, and (c) developing, The photosensitive resin in the unexposed portion is removed, and (d) the copper foil layer of the substrate not covered with the cured resist is removed by etching, or plating metal is deposited on the portion not covered with the cured resist by plating. After letting
(E) The invention provides a method of manufacturing a wiring board for COF, which comprises removing the cured resist by peeling.

The present application also provides the following inventions. (2) Before the laminating step, the copper foil laminated on the flexible substrate is chemically polished with a liquid containing at least one selected from the group consisting of sulfuric acid, persulfates, nitric acid and organic acids. The method for producing a COF wiring board according to (1) above, wherein the average surface roughness (Ra-1) or the center line average roughness (Ra-2) is set to 10 to 200 nm. (3) As a method for laminating the photosensitive resin laminate on the flexible substrate, under normal pressure, reduced pressure or vacuum environment,
The method for producing a COF wiring board according to (1) or (2) above, wherein a method of roll-pressing the flexible substrate and the photosensitive resin laminate with one or more pairs of hot rolls is used. (4) A wiring board for COF manufactured by the manufacturing method according to any one of (1) to (3) above. (5) The thickness of the support film is 5 to 20 μm, the thickness of the photosensitive resin layer is 1 to 25 μm, and the thickness of the protective film is 25.
Is 60 μm, and the imidazole dimer compound is contained in the photosensitive resin layer in an amount of 0.1 to 6% by mass, the wiring board for COF according to any one of (1) to (3) above. A photosensitive resin laminate used in the manufacturing method.

The flexible substrate used in the present invention is a substrate obtained by laminating a copper foil on an organic polymer film such as polyimide or polyester. A specific example of the organic polymer film is Kapton (registered trademark, manufactured by Toray DuPont). , Polyimide such as Upilex (registered trademark, manufactured by Ube Industries), polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of the method for laminating the copper foil include a plating method, a casting method, a laminating method and the like. The casting method is to prepare a flexible substrate by applying a polymer solution on a copper foil, drying it in some cases, and reacting it with heat.
In the laminating method, a copper foil and an organic polymer film are attached to each other with an adhesive layer interposed therebetween. The two methods are common in that a pre-manufactured copper foil is used, and the original copper surface shape of the flexible substrate is determined by the type of the copper foil.

A flexible substrate for a COF wiring board has an organic polymer film layer with a thickness of 10 to 100 μm.
The thickness of the copper foil is preferably 1 to 35 μm, and particularly preferably 3 to 18 μm. The photosensitive resin laminate used in the present invention is a laminated film in which a photosensitive resin layer is sandwiched between a support film and a protective film, and is also called a photosensitive element, a photosensitive film or a dry film (resist). is there. As the support film, an organic polymer film having high smoothness and high transparency to the actinic ray used for exposure is used. The thickness of the support film is preferably from 5 to 20 μm, particularly preferably from 9 to 16 μm. It is preferably 5 μm or more in order to keep the strength as a support, and 20 in order to keep good resolution of the photosensitive resin for making fine wiring.
μm or less is preferable.

Examples of such a support film include:
Polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyvinyl alcohol, polyvinyl chloride, vinyl chloride copolymer, polyvinylidene chloride, vinylidene chloride copolymer, polymethylmethacrylate copolymer, polystyrene, polyacrylonitrile, styrene copolymer Examples include coalesce, polyamide, and cellulose derivatives. Polyethylene terephthalate is preferably used. As the photosensitive resin layer used here, (a) a polymer containing a carboxylic acid such as (meth) acrylic acid, (b) a photopolymerizable monomer having at least one polymerizable ethylenically unsaturated group in the molecule And (c) a photoinitiator is used.

Here, the photoinitiator as the component (c) is a compound which generates radicals by actinic rays. Such a photoinitiator preferably contains an imidazole dimer compound from the viewpoint of manufacturing a COF wiring board. This is because this imidazole dimer compound has the effect of enhancing the resolution and the adhesion to the copper surface. From the viewpoint of sensitivity, the amount is preferably 0.1 to 6% by mass, and 0.5
It is particularly preferable that the content is ˜4% by mass. If it is less than 0.1% by mass, the effect of sensitivity cannot be expected, and if it exceeds 6% by mass, the photoinitiating ability is saturated.

The above-mentioned imidazole dimer compound includes
Specifically, 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer (for example, black imidazole, biimidazole, trade name), 2- (o-chlorophenyl)-
4,5-bis- (m-methoxyphenyl) imidazolyl dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazolyl dimer, 2,2 ', 5-tris-
(O-Chlorophenyl) -4- (3,4-dimethoxyphenyl) -4 ', 5'-diphenyl-1,1'-imidazolyl dimer, 2,2', 4,4'-tetra- (o- Chlorophenyl) -5,5'-bis- (3,4-dimethoxyphenyl) -1,1'-imidazolyl dimer, 2,
2'-bis- (o-chlorophenyl) -4,4 ', 5
5'-tetra- (m-methoxyphenyl) -1,1'-
Examples include imidazolyl dimer and the like.

If necessary, a dye, a radical polymerization inhibitor, a plasticizer, etc. may be added to the photosensitive resin. An appropriate amount of a solvent is added to make the photosensitive resin mixture have a viscosity suitable for coating, the support film is coated, then dried, and a protective film is laminated to obtain a photosensitive resin laminate. The thickness of the photosensitive resin layer is 1 to 25 μm.
m is preferable, and particularly preferably 4 to 15 μm. The thickness is preferably 1 μm or more in order to facilitate the coating with the photosensitive resin, and is preferably 25 μm or less in order to obtain a circuit having a conductor line width of 30 μm or less.

As the protective film used for the photosensitive resin laminate, an organic polymer film having high smoothness and lower adhesiveness to the photosensitive resin layer than the support film is used. The thickness is preferably 25 to 60 μm, particularly preferably 30 to
It is 50 μm. It is preferably 25 μm or more in order to maintain the smoothness of the protective film itself, and 60 μm or less in order to maintain the operability of the photosensitive resin laminate as a film. Examples of protective films include polyolefins such as polyethylene and polypropylene, polyesters, and polyesters whose release properties have been improved by silicone treatment or alkyd treatment. Preferably polyethylene is used.

Next, a specific example of manufacturing a COF wiring board will be described. (1) Laminating step: The photosensitive resin layer and the copper surface of the flexible substrate are laminated while peeling off the protective film of the photosensitive resin laminate, and the layers are pressed by passing between a pair of upper and lower hot rolls. Roll temperature is 50-12
It is preferable that the temperature is 0 ° C. and the laminating speed is 0.1 to 6 m / min. The pair of upper and lower rolls are pinched by an air cylinder or a spring, and the pressure is 0.1 to 1MP as the pressure per unit length of the laminating roll.
a / cm is preferable, and 0.2 to 0.5 MPa / cm is more preferable. As the laminator, there are a one-stage laminator using a pair of laminating rolls, a multi-stage laminator using two or more pairs of laminating rolls, a vacuum laminator for covering a portion to be laminated with a container and depressurizing or vacuuming with a vacuum pump, and the like. used. A vacuum laminator is preferable in terms of suppressing air mixing during lamination.

(2) Exposure step: A desired wiring pattern is exposed using an ultraviolet light source. A photomask on which a wiring pattern is drawn is placed on a support film through a minute gap or is brought into close contact with the film for exposure. In addition, a photomask image is formed on the photosensitive resin layer using a projection lens and exposed. When a photomask image is projected and exposed, the support film may be peeled off for exposure, or the support film may be left exposed. Examples of the ultraviolet light source include a high pressure mercury lamp, an ultrahigh pressure mercury lamp, an ultraviolet fluorescent lamp, a carbon arc lamp and a xenon lamp. In order to obtain a finer resist pattern, it is preferable to use a parallel light source.

(3) Development step: When the support film remains, the support film is peeled off, and then the unexposed portion of the photosensitive resin layer is dissolved or dispersed by using an alkali developing solution to cure. A resist pattern is formed on the substrate. Examples of the alkaline aqueous solution used in the developing step include aqueous solutions of sodium carbonate, potassium carbonate, sodium hydroxide, potassium hydroxide and the like. Most commonly,
A 0.2 to 2 mass% sodium carbonate aqueous solution is used.

(4) Circuit forming step: A copper surface not covered with the resist pattern is etched from the formed hardened resist pattern with an etching solution, or copper or solder is applied to the copper surface not covered with the resist pattern. , Nickel, tin, etc. are plated. (5) Stripping step: The resist pattern is removed from the substrate using an alkaline stripping solution. The alkaline aqueous solution used in the peeling step is more alkaline than the alkaline aqueous solution used in the development, and examples thereof include sodium hydroxide, potassium hydroxide and organic amine compounds. Most commonly, an aqueous solution of 1 to 5 wt% sodium hydroxide or potassium hydroxide is used.

The surface roughness of the flexible substrate is JIS
It is measured by AFM (atomic force microscope) according to the method specified in B 0601. From this measurement, the center line average roughness (Ra-2), the maximum height (Rmax), the ten-point average roughness (Rz), and the like are obtained. Furthermore, the roughness of the entire set surface can be measured. From this surface measurement, the average surface roughness (Ra-1, the average of the absolute values of the height from the surface where the area of the higher part and the area of the lower part are equal), the maximum height difference (P -V, the difference between the highest peak in the plane and the lowest valley bottom, and the root mean square surface roughness (RMS, the height from the surface where the area of the higher part and the area of the lower part are equal) Squared average) etc. are required.

The AFM measures on a square surface, but the length of one side is preferably 200 to 800 μm. The roughness value is preferably 200 μm or more from the viewpoint of accurately reflecting the surface condition of the flexible substrate. As the surface roughness of the copper surface of the flexible substrate used for the wiring board for COF, Ra-1 or Ra-2 is 10 to 200 nm, and preferably 20 to 100 nm. The thickness is preferably 10 nm or more in terms of difficulty in industrial production, and 200 nm or less in terms of suppressing air mixing after lamination.

The surface roughness of the copper surface of the conventionally used flexible substrate exceeds 200 nm in terms of average surface roughness (Ra-1) or center line average roughness (Ra-2). On the other hand, the average surface roughness (Ra-1) or the center line average roughness (Ra-2) is obtained by chemical polishing with a liquid containing at least one selected from sulfuric acid, persulfate, nitric acid and organic acid. By setting 10 to 200 nm, it is possible to remarkably suppress air mixing after lamination. Further, mechanical polishing may be adopted instead of the chemical polishing. Examples of mechanical polishing include buff roll polishing, scrub polishing, belt sander polishing and the like. The pretreatment liquid to be applied to the flexible substrate before laminating is an acidic liquid capable of corroding copper. If necessary, the substrate is heated by heating at 25 to 50 ° C. by a dipping method or a spray method.

As the pretreatment liquid, a mixed liquid of sulfuric acid and hydrogen peroxide water, an aqueous solution of ammonium persulfate or sodium persulfate, a mixed liquid of aqueous solution of ammonium persulfate or sodium persulfate and sulfuric acid, nitric acid, a metal nitrate and an organic acid. A mixed aqueous solution of, a mixed aqueous solution of a metal acetate and an organic acid, and the like,
Organic acids include formic acid, acetic acid, malic acid, acrylic acid,
Glycolic acid, maleic acid, itaconic acid, maleic anhydride and the like can be mentioned. A chemical liquid commercially available as a chemical polishing agent, a soft etching agent or a surface roughening agent can be used as long as it contains the above components. As an example, CPE-
900, CPE-500 (all manufactured by Mitsubishi Gas Chemical Co., Inc., trade name), CZ-8100, CB-801 (all manufactured by MEC, trade name). Hereinafter, examples of embodiments of the present invention will be described in more detail with reference to examples.

[0026]

[Examples] 1) Surface roughness measurement of a flexible substrate An atomic force microscope Nanopix 1000 (manufactured by Seiko Instruments Inc.) was used, and DFM was used as an observation mode.
(Resonance mode; Dynamic Force Mod
e) was used. 200 in the case of surface measurement for obtaining Ra-1
An area of μm × 200 μm was measured. In the line measurement for obtaining Ra-2, the measurement length was 200 μm and the cutoff value was 65 μm. 2) Preparation of Photosensitive Resin Laminate A mixed solution of the compounds shown in Examples and Comparative Examples described below was uniformly applied on a support film and dried in a dryer at 90 ° C. for 1 minute to obtain a film having a thickness of 7 μm. A photosensitive resin layer was formed. Further, a protective film was laminated on the photosensitive resin layer to obtain a photosensitive resin laminate.

3) Wiring board preparation (lamination) A photosensitive resin laminate was laminated on a flexible substrate using a laminator AL-70 (manufactured by Asahi Kasei). The conditions are laminating speed: 2m
/ Min, laminating roll temperature: 105 ° C., laminating pressure: 0.22 MPa / cm. (Exposure) A chrome glass photomask is placed on a support film, and an exposure machine (HMW-8) having an ultrahigh pressure mercury lamp is used.
01: manufactured by Oak Manufacturing Co., Ltd.), 100 mJ / cm ²
The photosensitive resin layer was exposed with the exposure amount of. The exposed portion becomes a cured resist.

(Development) The support film was removed and 0.4
A wt% sodium carbonate aqueous solution at 30 ° C. and a spray pressure of 0.
The unexposed portion of the photosensitive resin layer was removed by spraying at 15 MPa for 20 seconds. (Etching) The cupric chloride etchant was sprayed at 50 ° C. at a spray pressure of 0.12 MPa for 20 seconds to etch the copper in the portion not covered with the cured resist. (Peeling off) 5% of 3% sodium hydroxide aqueous solution
The cured resist was peeled off by spraying at 0 ° C. and a spray pressure of 0.2 MPa for 30 seconds.

[Evaluation of the number of lame air] The flexible substrate after the (laminating) step of the wiring board preparation in 3) above is examined by an optical microscope, and the number of air (laminate air) in an area of 1 × 6 cm is recorded and ranked according to the following criteria. Divided. ◎: When the number of air is 0 ○: When the number of air is 1 to 5 Δ: When the number of air is 6 to 20 ×: When the number of air is 21 or more

[Evaluation of Conductor Pattern Formation] In the wiring board preparation of 3), by exposure and development, a cured resist pattern was prepared in which five cured resist lines each having a length of 1 cm and a width of 18 μm were arranged side by side with a space of 12 μm. After that, etching and peeling were performed by the method shown in 3) for producing a wiring board, and the shape of the conductor pattern was observed with an optical microscope. ⊚: The conductor line was chipped and no break was observed. ◯: No break was observed in the conductor line with 5 μm or more chips at 5 or less places. Δ: There are 6 or more defects of 5 μm or more in the conductor line,
No disconnection is recognized. X: The conductor line has one or more breaks.

Example 1 Espanex (registered trademark, manufactured by Nippon Steel Chemical Co., Ltd.) was used as the flexible substrate. This flexible substrate was formed by laminating a 12 μm thick copper foil on a 40 μm thick polyimide film. The surface roughness of the flexible substrate is Ra-1 of 340 nm,
Ra-2 is 290 nm, PV is 2400 nm, RMS
Was 400 nm. Before laminating, this flexible substrate is CPE-900 (Mitsubishi Gas Chemical Co., Ltd., trade name) 3
It was immersed in a 0% by volume aqueous solution (hydrogen peroxide / sulfuric acid system) at room temperature for 1 minute.

As the photosensitive resin layer of the photosensitive resin laminate, one containing the following compounds was used. i) Methyl methacrylate / butyl acrylate / styrene /
Methacrylic acid = 30/25/20/25 weight ratio composition, weight average molecular weight 70,000 carboxylic acid containing polymer (methyl ethyl ketone solution of 35% solid content concentration): 14
2 parts (53.8 mass% as the content in the photosensitive resin after drying) ii) 2,2-bis {4- (methacryloxypolyethoxy) phenyl} propane, the average number of repeating ethylene glycol units 5 (Shin Nakamura Chemical Co., B
PE-500) 40 parts (43% by mass as the content in the photosensitive resin after drying)

Iii) Triethylene glycol-bis [3-
(3-t-butyl-5-methyl-4-hydroxyphenyl) propionate} [manufactured by Nippon Ciba-Geigy Strain IRG
ANOX (registered trademark) 245] 0.1 part (0.11 mass% as the content in the photosensitive resin after drying) iv) 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer (black Made by Kinkasei, biimidazole, trade name) 2 parts (as content in the photosensitive resin after drying,
2.2 mass%) v) N, N-tetraethyl-4,4-diaminobenzophenone (manufactured by Hodogaya Chemical Co., Ltd.) 0.4 part (0.43 mass% as the content in the photosensitive resin after drying) vi) Leuco Crystal Violet (Hodogaya Chemical)
0.4 parts (as a content in the photosensitive resin after drying, 0.
43 mass%)

Vii) Malachite Green (manufactured by Hodogaya Chemical Co., Ltd.) 0.08 part (0.086 mass% as the content in the photosensitive resin after drying) The support film is AT301 (manufactured by Teijin DuPont Films, polyethylene terephthalate). , 16 μm), and the protective film was T1-A742A (manufactured by Tama Poly, polyethylene, 35 μm thick). The surface roughness of the copper foil of the flexible substrate is Ra-1 of 70 nm and Ra.
-2 is 50 nm, P-V is 790 nm, RMS is 90 n
It was m. The number of Lamiair was 2, and the rank was ○. Regarding the conductor pattern formability, no chipping or disconnection was observed, and the rank was ⊚.

(Examples 2 to 3) Evaluations were made in the same manner as in Example 1 except that the chemical treatment before lamination was changed as shown in Table 1. The results are shown in Table 1. (Embodiment 4) The flexible substrate of Embodiment 1 is replaced with that of Embodiment 1.
The same substrate treatment was performed and laminated with a vacuum laminator (manufactured by Hitachi Industries). Vacuum degree is 1 Tor
r, the laminating speed is 2 m / min, the laminating roll temperature is 105 ° C., and the laminating pressure is 0.22 MPa /
I went in cm. The surface roughness of the flexible substrate is Ra-
1 is 70 nm, Ra-2 is 50 nm, and PV is 790 n.
m, RMS was 90 nm. The number of Lamiair was 0, and the rank was ◎. Regarding the conductor pattern formability, no chipping or disconnection was observed, and the rank was ⊚.

Comparative Example 1 Evaluation was made in the same manner as in Example 1 except that Espanex (registered trademark, manufactured by Nippon Steel Chemical Co., Ltd.) was used as the flexible substrate. The number of Lamiair is 58
It was an individual and the rank was x. Conductor pattern formability is
There were 6 breaks and the rank was x. (Comparative Example 2) Evaluation was made in the same manner as in Example 1 except that Microlux (registered trademark, manufactured by DuPont) was used as the flexible substrate. This flexible substrate is 50μ
It was a copper foil having a thickness of 12 μm laminated on a polyimide film having a thickness of m.

The surface roughness of the flexible substrate is Ra-1.
Is 270 nm, Ra-2 is 420 nm, and PV is 360.
0 nm and RMS were 340 nm. The number of Lamiair was 16, and the rank was △. Regarding the conductor pattern formability, there were 8 defects and the rank was Δ. The results of Examples 1 to 4 and Comparative Examples 1 and 2 described above are summarized in Table 1. According to the above results, by using the method for manufacturing a COF wiring board of the present invention, it is possible to suppress air from being mixed by laminating, so that it is possible to manufacture a fine conductor pattern with good quality and high yield. .

[0038]

[Table 1]

[0039]

According to the method for manufacturing a wiring board for COF of the present invention, air is less mixed when laminating a photosensitive resin laminate on a flexible substrate, and as a result, a circuit having a conductor width of 30 μm or less can be formed without pattern abnormality. Since it can be obtained with a high yield, it is extremely useful for manufacturing a COF wiring board.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akao Den             Asahi Kasei Co., Ltd. 1 No. 2 Samejima, Fuji City, Shizuoka Prefecture             In the company (72) Inventor Teruhiko Adachi             Asahi Kasei Co., Ltd. 1 No. 2 Samejima, Fuji City, Shizuoka Prefecture             In the company F-term (reference) 4E351 AA16 AA17 BB01 DD04 DD54                       DD55 GG11 GG20                 5E339 AA02 AB02 BC02 BD11 BE13                       CC01 CC02 CD01 CE11 CE14                       CE16 CF16 CF17 CG04 DD04                       GG01 GG10

Claims (5)

[Claims] 1. A film having a thickness of 10 to 100 μm,
(A) a photosensitive resin laminate on a flexible substrate on which a copper foil having an average surface roughness (Ra-1) or a center line average roughness (Ra-2) of 10 to 200 nm laminated by chemical polishing or mechanical polishing is laminated. Laminating, (b) performing exposure corresponding to a desired wiring pattern, photocuring the exposed portion of the photosensitive resin to obtain a cured resist, and (c) developing to remove the unexposed portion of the photosensitive resin. Then, (d) the copper foil layer of the substrate which is not covered with the cured resist is removed by etching, or plating metal is deposited on the portion not covered with the cured resist by plating, and then (e) peeling is performed. A method for manufacturing a COF wiring board, which comprises removing a cured resist. 2. Before the laminating step, the copper foil laminated on the flexible substrate is chemically polished with a liquid containing at least one selected from the group consisting of sulfuric acid, persulfate, nitric acid and organic acids. , Its average surface roughness (Ra-
1) or center line average roughness (Ra-2) of 10 to 20
The method for manufacturing a COF wiring board according to claim 1, wherein the thickness is set to 0 nm. 3. A method of laminating a photosensitive resin laminate on a flexible substrate by pressure-bonding the flexible substrate and the photosensitive resin laminate with one or more pairs of hot rolls under an environment of normal pressure, reduced pressure or vacuum. The CO according to claim 1 or 2, characterized in that
Manufacturing method of wiring board for F. 4. A wiring board for COF manufactured by the manufacturing method according to claim 1. 5. The support film has a thickness of 5 to 20 μm,
The photosensitive resin layer has a thickness of 1 to 25 μm, the protective film has a thickness of 25 to 60 μm, and the photosensitive resin layer contains an imidazole dimer compound in an amount of 0.1 to 6% by mass. The photosensitive resin laminated body used for the manufacturing method of the COF wiring board of any one of 1 to 3.