JPH01152151A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPH01152151A JPH01152151A JP30965787A JP30965787A JPH01152151A JP H01152151 A JPH01152151 A JP H01152151A JP 30965787 A JP30965787 A JP 30965787A JP 30965787 A JP30965787 A JP 30965787A JP H01152151 A JPH01152151 A JP H01152151A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- filler
- silica powder
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 21
- 239000000203 mixture Substances 0.000 title claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 12
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000035882 stress Effects 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- 230000008646 thermal stress Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000012778 molding material Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 230000008642 heat stress Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- -1 alicyclic cyclohexane derivatives Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30965787A JPH01152151A (ja) | 1987-12-09 | 1987-12-09 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30965787A JPH01152151A (ja) | 1987-12-09 | 1987-12-09 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01152151A true JPH01152151A (ja) | 1989-06-14 |
| JPH0588904B2 JPH0588904B2 (enrdf_load_stackoverflow) | 1993-12-24 |
Family
ID=17995693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30965787A Granted JPH01152151A (ja) | 1987-12-09 | 1987-12-09 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01152151A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268711A (ja) * | 1988-04-20 | 1989-10-26 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JP2002363384A (ja) * | 2001-06-13 | 2002-12-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| US6525160B1 (en) * | 1999-06-17 | 2003-02-25 | Arakawa Chemical Industries Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
| JP2007119547A (ja) * | 2005-10-26 | 2007-05-17 | Yoshikawa Kogyo Co Ltd | エポキシ樹脂組成物、及び半導体装置用中空パッケージ、並びに半導体部品装置 |
| DE112007002983T5 (de) | 2006-12-06 | 2009-10-08 | Nok Corp. | Dichtung und Abdichtungssystem |
-
1987
- 1987-12-09 JP JP30965787A patent/JPH01152151A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268711A (ja) * | 1988-04-20 | 1989-10-26 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| US6525160B1 (en) * | 1999-06-17 | 2003-02-25 | Arakawa Chemical Industries Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
| JP2002363384A (ja) * | 2001-06-13 | 2002-12-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2007119547A (ja) * | 2005-10-26 | 2007-05-17 | Yoshikawa Kogyo Co Ltd | エポキシ樹脂組成物、及び半導体装置用中空パッケージ、並びに半導体部品装置 |
| DE112007002983T5 (de) | 2006-12-06 | 2009-10-08 | Nok Corp. | Dichtung und Abdichtungssystem |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0588904B2 (enrdf_load_stackoverflow) | 1993-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |