JPH01146529U - - Google Patents

Info

Publication number
JPH01146529U
JPH01146529U JP4301188U JP4301188U JPH01146529U JP H01146529 U JPH01146529 U JP H01146529U JP 4301188 U JP4301188 U JP 4301188U JP 4301188 U JP4301188 U JP 4301188U JP H01146529 U JPH01146529 U JP H01146529U
Authority
JP
Japan
Prior art keywords
lands
external connection
holes
view
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4301188U
Other languages
English (en)
Other versions
JPH0625006Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988043011U priority Critical patent/JPH0625006Y2/ja
Publication of JPH01146529U publication Critical patent/JPH01146529U/ja
Application granted granted Critical
Publication of JPH0625006Y2 publication Critical patent/JPH0625006Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の実施例を示す補助基板を用
いてチツプ形電子部品を回路基板に搭載した状態
の斜視図、第２図は、第１図の状態に保護コーテ
イングを施した縦断側面図、第３図は、他の実施
例を示す補助基板を用いてチツプ形電子部品を回
路基板に搭載した状態の斜視図、第４図は、従来
におけるチツプ形電子部品の回路基板への搭載手
段を示す斜視図、第５図は、第４図の状態に保護
コーテイングを施した縦断側面図である。 １…回路基板、３…ボンデイングランド、６…
ワイヤ、７…保護コーテイング、１０…補助基板
、１１…貫通孔、１２…外部接続用ランド、１３
…配線パターン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁性の基板１０に一つ以上の貫通孔１１を形
    成し、この貫通孔１１の周囲にボンデイングラン
    ド３，３…を形成し、補助基板１０の周辺部に外
    部接続用ランド１２，１２…を形成し、前記ボン
    デイングランド３，３…と外部接続用ランド１２
    ，１２…とを配線パターン１３，１３…で接続し
    たことを特徴とするチツプ形電子部品ボンデイン
    グ用補助基板。
JP1988043011U 1988-03-31 1988-03-31 回路基板 Expired - Lifetime JPH0625006Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988043011U JPH0625006Y2 (ja) 1988-03-31 1988-03-31 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988043011U JPH0625006Y2 (ja) 1988-03-31 1988-03-31 回路基板

Publications (2)

Publication Number Publication Date
JPH01146529U true JPH01146529U (ja) 1989-10-09
JPH0625006Y2 JPH0625006Y2 (ja) 1994-06-29

Family

ID=31269412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988043011U Expired - Lifetime JPH0625006Y2 (ja) 1988-03-31 1988-03-31 回路基板

Country Status (1)

Country Link
JP (1) JPH0625006Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769766A (en) * 1980-10-17 1982-04-28 Matsushita Electric Ind Co Ltd Ship carrier
JPS5769765A (en) * 1980-10-17 1982-04-28 Matsushita Electric Ind Co Ltd Sealed body of semiconductor device
JPS57201839U (ja) * 1981-06-19 1982-12-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769766A (en) * 1980-10-17 1982-04-28 Matsushita Electric Ind Co Ltd Ship carrier
JPS5769765A (en) * 1980-10-17 1982-04-28 Matsushita Electric Ind Co Ltd Sealed body of semiconductor device
JPS57201839U (ja) * 1981-06-19 1982-12-22

Also Published As

Publication number Publication date
JPH0625006Y2 (ja) 1994-06-29

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