JPH01140873U - - Google Patents

Info

Publication number
JPH01140873U
JPH01140873U JP3682488U JP3682488U JPH01140873U JP H01140873 U JPH01140873 U JP H01140873U JP 3682488 U JP3682488 U JP 3682488U JP 3682488 U JP3682488 U JP 3682488U JP H01140873 U JPH01140873 U JP H01140873U
Authority
JP
Japan
Prior art keywords
circuit board
connection
slit
lands
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3682488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3682488U priority Critical patent/JPH01140873U/ja
Publication of JPH01140873U publication Critical patent/JPH01140873U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による一実施例の斜視図、第2
図a,bは第1図の接続用スリツトの加工工程順
を示す平面図、第3図は第1図の回路基板の他の
実施例の斜視図、第4図は従来技術による斜視図
である。 図において、1は第1の回路基板、2は第2の
回路基板、1aは縁端部、2aは接続用スリツト
、1bは接続用ランド、2a−1はスルホール、
1cは電子部品、2a−1aは接続用導体、1d
は切欠き、2a−2はスリツト、1d−1は端面
、をそれぞれ示す。
Fig. 1 is a perspective view of one embodiment of the present invention;
Figures a and b are plan views showing the order of processing steps for the connection slits in Figure 1, Figure 3 is a perspective view of another embodiment of the circuit board in Figure 1, and Figure 4 is a perspective view of the prior art. be. In the figure, 1 is a first circuit board, 2 is a second circuit board, 1a is an edge, 2a is a connection slit, 1b is a connection land, 2a-1 is a through hole,
1c is an electronic component, 2a-1a is a connecting conductor, 1d
2a-2 represents a notch, 2a-2 represents a slit, and 1d-1 represents an end surface.

Claims (1)

【実用新案登録請求の範囲】 縁端部両面に複数の接続用ランド1bを列設し
た第1の回路基板1と、上記接続用ランドに対応
する接続用導体2a−1aを有する接続用スリツ
ト2aを備えた第2の回路基板2とからなり、 上記第1の回路基板の縁端部1aを上記第2の
回路基板の接続用スリツト2aに嵌合させ接続用
ランド1bと接続用導体2a−1aとを接続する
ことを特徴とする回路基板の接続構造。
[Claims for Utility Model Registration] A first circuit board 1 having a plurality of connecting lands 1b lined up on both sides of the edge, and a connecting slit 2a having connecting conductors 2a-1a corresponding to the connecting lands. The edge portion 1a of the first circuit board is fitted into the connection slit 2a of the second circuit board to connect the connection land 1b and the connection conductor 2a-. 1a. A circuit board connection structure characterized by connecting 1a.
JP3682488U 1988-03-18 1988-03-18 Pending JPH01140873U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3682488U JPH01140873U (en) 1988-03-18 1988-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3682488U JPH01140873U (en) 1988-03-18 1988-03-18

Publications (1)

Publication Number Publication Date
JPH01140873U true JPH01140873U (en) 1989-09-27

Family

ID=31263411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3682488U Pending JPH01140873U (en) 1988-03-18 1988-03-18

Country Status (1)

Country Link
JP (1) JPH01140873U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017208381A (en) * 2016-05-16 2017-11-24 東芝シュネデール・インバータ株式会社 Electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017208381A (en) * 2016-05-16 2017-11-24 東芝シュネデール・インバータ株式会社 Electronic device

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