JPH01139447U - - Google Patents
Info
- Publication number
- JPH01139447U JPH01139447U JP1988035141U JP3514188U JPH01139447U JP H01139447 U JPH01139447 U JP H01139447U JP 1988035141 U JP1988035141 U JP 1988035141U JP 3514188 U JP3514188 U JP 3514188U JP H01139447 U JPH01139447 U JP H01139447U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- chip
- semiconductor
- multilayer wiring
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案の実施例に係るパワーハイブリ
ツドICの断面図、第2図は従来のハイブリツド
ICを示す図で、同図aは平面図、同図bは断面
図である。 1,12;基板内多層配線基板、2,13;内
部導体配線、3,14;スルーホール、4,11
;ヒートシンク、5,15;半導体ICチツプ、
6,18;ボンデイングワイヤ、7,19;保護
樹脂、8;リードランド、9;リードフレーム、
10,20;パツケージ樹脂、16;堀込み部、
17;ステツチランド。
ツドICの断面図、第2図は従来のハイブリツド
ICを示す図で、同図aは平面図、同図bは断面
図である。 1,12;基板内多層配線基板、2,13;内
部導体配線、3,14;スルーホール、4,11
;ヒートシンク、5,15;半導体ICチツプ、
6,18;ボンデイングワイヤ、7,19;保護
樹脂、8;リードランド、9;リードフレーム、
10,20;パツケージ樹脂、16;堀込み部、
17;ステツチランド。
Claims (1)
- ヒートシンクと、このヒートシンク上に形成さ
れ少なくとも一部に半導体ICチツプ搭載用の堀
込み部を設けてなる基板内多層配線基板と、この
基板内多層配線基板の前記堀込み部に前記ヒート
シンクと直接接触するように配置された半導体I
Cチツプとを具備したことを特徴とする混成集積
回路。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988035141U JPH01139447U (ja) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988035141U JPH01139447U (ja) | 1988-03-16 | 1988-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01139447U true JPH01139447U (ja) | 1989-09-22 |
Family
ID=31261796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988035141U Pending JPH01139447U (ja) | 1988-03-16 | 1988-03-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01139447U (ja) |
-
1988
- 1988-03-16 JP JP1988035141U patent/JPH01139447U/ja active Pending