JPH01135057A - リードフレーム材料の製造方法 - Google Patents

リードフレーム材料の製造方法

Info

Publication number
JPH01135057A
JPH01135057A JP62293806A JP29380687A JPH01135057A JP H01135057 A JPH01135057 A JP H01135057A JP 62293806 A JP62293806 A JP 62293806A JP 29380687 A JP29380687 A JP 29380687A JP H01135057 A JPH01135057 A JP H01135057A
Authority
JP
Japan
Prior art keywords
lead frame
copper
frame material
plating
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62293806A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055378B2 (cs
Inventor
Motohisa Miyato
宮藤　元久
Riichi Tsuno
津野　理一
Ryoichi Ozaki
良一 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP62293806A priority Critical patent/JPH01135057A/ja
Publication of JPH01135057A publication Critical patent/JPH01135057A/ja
Publication of JPH055378B2 publication Critical patent/JPH055378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP62293806A 1987-11-20 1987-11-20 リードフレーム材料の製造方法 Granted JPH01135057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62293806A JPH01135057A (ja) 1987-11-20 1987-11-20 リードフレーム材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62293806A JPH01135057A (ja) 1987-11-20 1987-11-20 リードフレーム材料の製造方法

Publications (2)

Publication Number Publication Date
JPH01135057A true JPH01135057A (ja) 1989-05-26
JPH055378B2 JPH055378B2 (cs) 1993-01-22

Family

ID=17799394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62293806A Granted JPH01135057A (ja) 1987-11-20 1987-11-20 リードフレーム材料の製造方法

Country Status (1)

Country Link
JP (1) JPH01135057A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351852A (ja) * 2005-06-16 2006-12-28 Tdk Corp 電子部品
KR20160054549A (ko) * 2013-09-09 2016-05-16 도와 메탈테크 가부시키가이샤 전자 부품 탑재 기판 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015744A (cs) * 1973-06-15 1975-02-19
JPS5679810A (en) * 1979-12-03 1981-06-30 Sumitomo Electric Industries Method of manufacturing lead wire for electronic part
JPS6218744A (ja) * 1985-07-17 1987-01-27 Kobe Steel Ltd リ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015744A (cs) * 1973-06-15 1975-02-19
JPS5679810A (en) * 1979-12-03 1981-06-30 Sumitomo Electric Industries Method of manufacturing lead wire for electronic part
JPS6218744A (ja) * 1985-07-17 1987-01-27 Kobe Steel Ltd リ−ドフレ−ム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351852A (ja) * 2005-06-16 2006-12-28 Tdk Corp 電子部品
KR20160054549A (ko) * 2013-09-09 2016-05-16 도와 메탈테크 가부시키가이샤 전자 부품 탑재 기판 및 그 제조 방법
EP3048640A4 (en) * 2013-09-09 2017-07-19 Dowa Metaltech Co., Ltd Electronic-component-equipped substrate and method for producing same
US9831157B2 (en) * 2013-09-09 2017-11-28 Dowa Metaltech Co., Ltd. Method of attaching an electronic part to a copper plate having a surface roughness

Also Published As

Publication number Publication date
JPH055378B2 (cs) 1993-01-22

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