JPH0113225B2 - - Google Patents

Info

Publication number
JPH0113225B2
JPH0113225B2 JP57001726A JP172682A JPH0113225B2 JP H0113225 B2 JPH0113225 B2 JP H0113225B2 JP 57001726 A JP57001726 A JP 57001726A JP 172682 A JP172682 A JP 172682A JP H0113225 B2 JPH0113225 B2 JP H0113225B2
Authority
JP
Japan
Prior art keywords
film
melting point
high melting
point metal
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57001726A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58119651A (ja
Inventor
Takashi Morimoto
Susumu Muramoto
Kohei Ebara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP172682A priority Critical patent/JPS58119651A/ja
Publication of JPS58119651A publication Critical patent/JPS58119651A/ja
Publication of JPH0113225B2 publication Critical patent/JPH0113225B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP172682A 1982-01-11 1982-01-11 半導体装置およびその製造方法 Granted JPS58119651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP172682A JPS58119651A (ja) 1982-01-11 1982-01-11 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP172682A JPS58119651A (ja) 1982-01-11 1982-01-11 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS58119651A JPS58119651A (ja) 1983-07-16
JPH0113225B2 true JPH0113225B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-03-03

Family

ID=11509563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP172682A Granted JPS58119651A (ja) 1982-01-11 1982-01-11 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS58119651A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2597703B2 (ja) * 1989-02-27 1997-04-09 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840525A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-09-21 1973-06-14
ES437060A1 (es) * 1974-04-29 1977-01-16 Alcan Res & Dev Un procedimiento para la recuperacion de componentes valio- sos del aislamiento de alumina empleado en una cuba de re- duccion de aluminio.
JPS5212545A (en) * 1975-07-21 1977-01-31 Hitachi Ltd Mos push-pull circuit
JPS5340278A (en) * 1976-09-27 1978-04-12 Hitachi Ltd Manufacture of semiconductor device
US4175597A (en) * 1977-08-01 1979-11-27 The Kendall Company Irrigation solution device
JPS5511354A (en) * 1978-07-12 1980-01-26 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor
JPS55131159A (en) * 1979-03-30 1980-10-11 Sumitomo Metal Ind Ltd High tensile low alloy steel for steel pipe

Also Published As

Publication number Publication date
JPS58119651A (ja) 1983-07-16

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