JPH01129841U - - Google Patents

Info

Publication number
JPH01129841U
JPH01129841U JP2531288U JP2531288U JPH01129841U JP H01129841 U JPH01129841 U JP H01129841U JP 2531288 U JP2531288 U JP 2531288U JP 2531288 U JP2531288 U JP 2531288U JP H01129841 U JPH01129841 U JP H01129841U
Authority
JP
Japan
Prior art keywords
semiconductor device
lead
resin
heat dissipation
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2531288U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2531288U priority Critical patent/JPH01129841U/ja
Publication of JPH01129841U publication Critical patent/JPH01129841U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体装置、第２図は従来の
半導体装置、第３図は本考案の半導体装置と外部
放熱板をプリント基板に実装したもの、第４図は
本考案の半導体装置を外部放熱板にネジ留めした
もの、第５図は本考案の半導体装置をプリント基
板に表面実装したもの、第６図は本考案の半導体
装置をプリント基板にネジ留めしたものである。 １……半導体装置の放熱金属部、２……封止樹
脂、３……リード、４……ネジ穴、５……プリン
ト基板、６……外部放熱板、７……ネジ。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード放熱金属部が封止樹脂外部に露出してい
    る樹脂封止型半導体装置において、前記封止放熱
    金属板部の封止樹脂外部に露出している面と相対
    向する樹脂面の間隔がリード導出部に近くなるほ
    ど広くなつている事を特徴とする半導体装置。
JP2531288U 1988-02-26 1988-02-26 Pending JPH01129841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2531288U JPH01129841U (ja) 1988-02-26 1988-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2531288U JPH01129841U (ja) 1988-02-26 1988-02-26

Publications (1)

Publication Number Publication Date
JPH01129841U true JPH01129841U (ja) 1989-09-04

Family

ID=31245939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2531288U Pending JPH01129841U (ja) 1988-02-26 1988-02-26

Country Status (1)

Country Link
JP (1) JPH01129841U (ja)

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