JPH0112671B2 - - Google Patents
Info
- Publication number
- JPH0112671B2 JPH0112671B2 JP13712980A JP13712980A JPH0112671B2 JP H0112671 B2 JPH0112671 B2 JP H0112671B2 JP 13712980 A JP13712980 A JP 13712980A JP 13712980 A JP13712980 A JP 13712980A JP H0112671 B2 JPH0112671 B2 JP H0112671B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper
- copper foil
- resin composition
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13712980A JPS5761554A (en) | 1980-09-30 | 1980-09-30 | Manufacture of heat-resisting copper lined laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13712980A JPS5761554A (en) | 1980-09-30 | 1980-09-30 | Manufacture of heat-resisting copper lined laminated plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5761554A JPS5761554A (en) | 1982-04-14 |
JPH0112671B2 true JPH0112671B2 (enrdf_load_stackoverflow) | 1989-03-01 |
Family
ID=15191492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13712980A Granted JPS5761554A (en) | 1980-09-30 | 1980-09-30 | Manufacture of heat-resisting copper lined laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5761554A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639899Y2 (ja) * | 1986-08-08 | 1994-10-19 | 株式会社マキタ | 回転電動工具におけるトルク調整装置 |
JPH02122776U (enrdf_load_stackoverflow) * | 1989-03-13 | 1990-10-09 | ||
JPH0460681U (enrdf_load_stackoverflow) * | 1990-10-02 | 1992-05-25 | ||
JP5983590B2 (ja) * | 2013-12-13 | 2016-08-31 | 株式会社デンソー | 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品 |
-
1980
- 1980-09-30 JP JP13712980A patent/JPS5761554A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5761554A (en) | 1982-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4526835A (en) | Multi-layer printed circuit board and process for production thereof | |
US4393188A (en) | Thermosetting prepolymer from polyfunctional maleimide and bis maleimide | |
CA1056541A (en) | Heat-resistant resin composition comprising polyaminobismaleimide, polyepoxy compound and aromatic vinyl copolymer and method for using the same | |
CN106977717A (zh) | 一种含烯基酯基化合物及其制备方法和利用其改性的双马来酰亚胺树脂 | |
JP2000109645A (ja) | 樹脂組成物 | |
TWI763282B (zh) | 一種無鹵阻燃型樹脂組成物及其應用 | |
JPH08193139A (ja) | プリント配線板用プリプレグ及びそれを用いた金属張積層板 | |
US4400438A (en) | Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor | |
JPH0112671B2 (enrdf_load_stackoverflow) | ||
US5206074A (en) | Adhesives on polymide films and methods of preparing them | |
JP2825519B2 (ja) | 積層材料用組成物 | |
JP3531082B2 (ja) | フレキシブル銅張積層板 | |
JP3724047B2 (ja) | プリント配線板用積層板 | |
JP4159902B2 (ja) | 樹脂組成物、プリプレグおよび積層板 | |
JP2847868B2 (ja) | 難燃性ポリアミノビスマレイミド樹脂積層板の製造方法 | |
EP0493414A1 (en) | POLYIMIDE RESIN LAMINATES. | |
JP2653603B2 (ja) | 熱硬化性樹脂組成物 | |
JPS60210640A (ja) | 積層板の製造法 | |
CN115838527B (zh) | 一种树脂组合物以及包含其的胶膜和印制电路板 | |
JP2653599B2 (ja) | 熱硬化性樹脂組成物 | |
JP3329861B2 (ja) | 耐熱積層材の製造方法 | |
JP2653601B2 (ja) | 熱硬化性樹脂組成物 | |
JP2004224817A (ja) | 樹脂組成物、これを用いたプリプレグおよび積層板 | |
CN119570029A (zh) | 改性马来酰亚胺预聚物、树脂组合物及其应用 | |
JPH02185517A (ja) | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 |