JPS5761554A - Manufacture of heat-resisting copper lined laminated plate - Google Patents
Manufacture of heat-resisting copper lined laminated plateInfo
- Publication number
- JPS5761554A JPS5761554A JP13712980A JP13712980A JPS5761554A JP S5761554 A JPS5761554 A JP S5761554A JP 13712980 A JP13712980 A JP 13712980A JP 13712980 A JP13712980 A JP 13712980A JP S5761554 A JPS5761554 A JP S5761554A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- heat
- laminated plate
- resisting copper
- copper lined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13712980A JPS5761554A (en) | 1980-09-30 | 1980-09-30 | Manufacture of heat-resisting copper lined laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13712980A JPS5761554A (en) | 1980-09-30 | 1980-09-30 | Manufacture of heat-resisting copper lined laminated plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5761554A true JPS5761554A (en) | 1982-04-14 |
JPH0112671B2 JPH0112671B2 (enrdf_load_stackoverflow) | 1989-03-01 |
Family
ID=15191492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13712980A Granted JPS5761554A (en) | 1980-09-30 | 1980-09-30 | Manufacture of heat-resisting copper lined laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5761554A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6330476U (enrdf_load_stackoverflow) * | 1986-08-08 | 1988-02-27 | ||
JPH02122776U (enrdf_load_stackoverflow) * | 1989-03-13 | 1990-10-09 | ||
JPH0460681U (enrdf_load_stackoverflow) * | 1990-10-02 | 1992-05-25 | ||
US20150166728A1 (en) * | 2013-12-13 | 2015-06-18 | Denso Corporation | Curable resin, sealing member, and electronic device product using sealing member |
-
1980
- 1980-09-30 JP JP13712980A patent/JPS5761554A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6330476U (enrdf_load_stackoverflow) * | 1986-08-08 | 1988-02-27 | ||
JPH02122776U (enrdf_load_stackoverflow) * | 1989-03-13 | 1990-10-09 | ||
JPH0460681U (enrdf_load_stackoverflow) * | 1990-10-02 | 1992-05-25 | ||
US20150166728A1 (en) * | 2013-12-13 | 2015-06-18 | Denso Corporation | Curable resin, sealing member, and electronic device product using sealing member |
Also Published As
Publication number | Publication date |
---|---|
JPH0112671B2 (enrdf_load_stackoverflow) | 1989-03-01 |
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