JPH01120044A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH01120044A
JPH01120044A JP27770987A JP27770987A JPH01120044A JP H01120044 A JPH01120044 A JP H01120044A JP 27770987 A JP27770987 A JP 27770987A JP 27770987 A JP27770987 A JP 27770987A JP H01120044 A JPH01120044 A JP H01120044A
Authority
JP
Japan
Prior art keywords
resin sealing
terminals
fixing sheet
semiconductor device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27770987A
Other languages
Japanese (ja)
Inventor
Takashi Abe
阿部　孝詩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP27770987A priority Critical patent/JPH01120044A/en
Publication of JPH01120044A publication Critical patent/JPH01120044A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To obtain a low-cost means used to align a terminal with a pattern on a printed-circuit board to be soldered when a flat package is to be soldered to the printed-circuit board by a method wherein a strip interlinked with an element-fixing sheet is projected to the outside of a resin sealing material and two or more positioning holes are made. CONSTITUTION:In a semiconductor device where a semiconductor element having many electrodes, an element-fixing sheet used to fix the semiconductor element, a strip 13 interlinked with the element-fixing sheet, two or more terminals 12 whose tip parts are situated near the element-fixing sheet and where the electrodes of the semiconductor element are connected electrically to the tip parts, a resin sealing material 11 which seales the semiconductor element and the element-fixing sheet, whose external form is nearly a quadrilateral and where two or more terminals 12 are extracted from four sides are contained, a width of said strip 13 is expanded at the outside of the resin sealing material 11, and at least two or more holes 15 are made at an expanded part 14. By this setup, when the semiconductor device is positioned by using the positioning hole 15 at the expanded part of the strip 13, it is possible to easily align the terminals 12 with patterns on a printed-circuit board during a soldering operation.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 〔発明の概要〕 本発明は、樹脂封止型半導体装置、特にフラットパッケ
ージニオいて、素子固着板に連なる帯状部材を樹脂封止
部材の外側に張り出させ、且、少なくても２つ以上の位
置決め用の穴を設ける事により、パッケージを高精度の
位置決めができる様にしたものである。[Detailed Description of the Invention] [Industrial Field of Application] [Summary of the Invention] The present invention relates to a resin-sealed semiconductor device, particularly a flat package, in which a strip member connected to an element fixing plate is placed outside the resin-sealed member. The package can be positioned with high accuracy by protruding from the package and providing at least two or more positioning holes.

〔従来の技術〕[Conventional technology]

従来のフラットパッケージの構造は第２図に示す如く、
樹脂封止部材２１より四方に端子２２が広っていた。パ
ッケージをプリント基板へハンダ付する時に、端子とハ
ンダ付されるプリント基板のパターンとを位置合わせす
る方法としては、樹脂封止部のコーナーを位置決圧２３
で位置決めした後プリント基板に搭載していた。あるい
は、端子位置を機械的にパターン認識し、搭α時にズレ
量を補正していた。The structure of a conventional flat package is shown in Figure 2.
The terminals 22 were wider than the resin sealing member 21 in all directions. When soldering a package to a printed circuit board, a method of aligning the terminals and the pattern of the printed circuit board to be soldered is to apply positioning pressure 23 to the corner of the resin sealing part.
After positioning, it was mounted on a printed circuit board. Alternatively, the terminal positions were mechanically pattern recognized and the amount of deviation was corrected during installation.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、前述の従来技術の内、樹脂封止部の、コーナー
を位置浅型で位置決する方法は、樹脂封止部と端子が相
対的なズレがある為、端子が微細ピッチになるに従がい
、接続の歩留り、信頼性が低下した。However, among the conventional techniques mentioned above, the method of positioning the corner of the resin sealing part using a shallow type has a relative misalignment between the resin sealing part and the terminal, so the terminals tend to have a finer pitch. , connection yield and reliability decreased.

又、端子位置をパターン認識する方法は、搭載機が非常
に高価になり、且パターン認識に時間を要し、槻械のサ
イクルタイムが低下した。In addition, the method of pattern recognition of terminal positions requires a very expensive machine and requires time for pattern recognition, reducing the cycle time of the machine.

そこで、本発明はこの様な間通を解決するもので、その
目的とするところは、フラットパッケージをプリント基
板にハンダ付する時に、端子とハング付するプリント基
板のパターンとの位置合わせする手段を安価で提供する
事にある。Therefore, the present invention is intended to solve this problem, and its purpose is to provide a means for aligning the terminals with the pattern of the printed circuit board to be hung when soldering the flat package to the printed circuit board. The purpose is to provide it at a low price.

Ｃ問題点を解決するための手段〕 本発明の半導体装置は、素子固着板に連なる帯状部材は
、樹脂封止部材の外側で幅が広がり、且この部分に少な
くても２つ以上の穴を育し、この穴は、プレス加工、あ
るいはエツチング加工等端子、部の形状加工と同一方法
で加工された事を特徴とする。Means for Solving Problem C] In the semiconductor device of the present invention, the band-like member connected to the element fixing plate is widened on the outside of the resin sealing member, and at least two or more holes are formed in this part. This hole is characterized by being processed by the same method as the shape of the terminal, such as press processing or etching.

〔実施例〕 等１図は、本発明の実施例における平面図で、樹脂封止
部材１１の四辺より端子１２が４出されている。[Embodiment] Figure 1 is a plan view of an embodiment of the present invention, in which four terminals 12 are protruded from the four sides of a resin sealing member 11.

素子固着板に連なる帯状部材１３は幅が広がっている部
分１４を有し、少なくても２つ以上のパッケージの位置
決め用の穴１５がおいている。The strip member 13 connected to the element fixing plate has a widened portion 14, and has at least two or more holes 15 for positioning the packages.

第３図はミニフララフトパッケージに応用した例であり
、３１は樹脂封止部材、３２は端子、３４は帯状部材の
広がり、３５は位置決め用の穴である。FIG. 3 shows an example in which the present invention is applied to a mini flat raft package, in which 31 is a resin sealing member, 32 is a terminal, 34 is an extension of a band-shaped member, and 35 is a hole for positioning.

第４図は本発明の半導体装置４１をプリント基板４２に
搭載している図である。バット４３で真空吸着された半
導体装置は、位置決め穴４４に位置決めピン４５が入り
位置決めされている為、端子４６とパターン４７の間に
ズレは生じない。FIG. 4 is a diagram showing a semiconductor device 41 of the present invention mounted on a printed circuit board 42. Since the semiconductor device vacuum-adsorbed by the bat 43 is positioned with the positioning pin 45 inserted into the positioning hole 44, no misalignment occurs between the terminal 46 and the pattern 47.

〔発明の効果〕〔Effect of the invention〕

以上に述べた様に本発明によれば、帯状部材の広がり部
にある位置決め用の穴で半導体装置を位置決めする事に
より、ハンダ付時、端子と、プリント基板のパターンを
容易に合わせる事ができ、接続の歩留り、信超性を向上
させる事ができる。As described above, according to the present invention, by positioning the semiconductor device using the positioning hole in the widening part of the band-shaped member, it is possible to easily match the terminal and the pattern of the printed circuit board during soldering. , connection yield and reliability can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の半導体装置を示す平面図。 第２図は従来の半導体装置を示す平面図。 第３図は本発明の半導体Ｒ’　Ｒの他の実施例を示す図
。 第４図は、本発明の半導体装置の実施例を示す図。 １１・・・樹脂封止部材 １２・・・端子 １４・・・帯状部材床がり部 １５・・・位置決め用穴 ４２・・・プリント基板 ４５・・・位置決めピン ４６・・・端子 ４７・・・バターンFIG. 1 is a plan view showing a semiconductor device of the present invention. FIG. 2 is a plan view showing a conventional semiconductor device. FIG. 3 is a diagram showing another embodiment of the semiconductor R'R of the present invention. FIG. 4 is a diagram showing an embodiment of the semiconductor device of the present invention. 11... Resin sealing member 12... Terminal 14... Band-shaped member flooring portion 15... Positioning hole 42... Printed circuit board 45... Positioning pin 46... Terminal 47... Bataan

Claims (1)

【特許請求の範囲】 　多数の電極を有する半導体素子と、該半導体素子を固
着する素子固着板と 該素子固着板に連なる帯状部材と 該素子固着板近傍に先端部を有し 該先端部に前記半導体素子の電極が電気的に接続された
複数の端子と 前記半導体素子及び前記素子固着板を封止し外形が概略
四辺形で前記複数の端子が４つの辺から導出される樹脂
封止部材とを有する半導体装置において 前記帯状部材は、前記樹脂封止部材の外側で幅が広がり
、且この部分に少なくても２つ以上の穴があいている事
を特徴とする半導体装置。[Scope of Claims] A semiconductor element having a large number of electrodes, an element fixing plate for fixing the semiconductor element, a band-like member continuous to the element fixing plate, and a tip part in the vicinity of the element fixing plate; a resin sealing member that seals a plurality of terminals to which electrodes of a semiconductor element are electrically connected, the semiconductor element and the element fixing plate, and has an approximately quadrilateral outer shape and the plurality of terminals are led out from four sides; 2. A semiconductor device having a semiconductor device characterized in that the width of the band member increases on the outside of the resin sealing member, and at least two or more holes are formed in this portion.
JP27770987A 1987-11-02 1987-11-02 Semiconductor device Pending JPH01120044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27770987A JPH01120044A (en) 1987-11-02 1987-11-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27770987A JPH01120044A (en) 1987-11-02 1987-11-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH01120044A true JPH01120044A (en) 1989-05-12

Family

ID=17587221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27770987A Pending JPH01120044A (en) 1987-11-02 1987-11-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH01120044A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643835A (en) * 1992-12-18 1997-07-01 Lsi Logic Corporation Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643835A (en) * 1992-12-18 1997-07-01 Lsi Logic Corporation Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs

Similar Documents

Publication Publication Date Title
EP0661743A2 (en) Film carrier tape for use in tape automated bonding
JPH01120044A (en) Semiconductor device
JP2833174B2 (en) Semiconductor device and mounting method thereof
JPH05335438A (en) Leadless chip carrier
KR960002496B1 (en) Semiconductor package
JPH08181246A (en) Bga fixing and mounting structure
KR100379090B1 (en) Lead frame for semiconductor package
KR100395694B1 (en) Surface mounting substrate having bonding pads in staggered arrangement
JPH05166966A (en) Semiconductor device mounting board
JPH0349418Y2 (en)
KR940004278Y1 (en) Cot package
JPS6258146B2 (en)
JP2003031623A (en) Semiconductor device using cof film and method of manufacturing the same
KR970001138Y1 (en) Surface mount structure of a semiconductor package
JPS6097653A (en) Semiconductor device
JPH06326446A (en) Board and manufacture thereof
KR20010065254A (en) Substrate for manufacturing semiconductor package
JPS5834766Y2 (en) Thick film hybrid integrated circuit
JPH05152709A (en) Electronic device
JPH0567048U (en) Printed circuit board equipment
JPS5851526A (en) Semiconductor element pellet and semiconductor device with said pellet
JPS63164226A (en) Manufacture of tape carrier element
JPH0923099A (en) Semiconductor component and its mounting method
JPH07297341A (en) Composite lead frame
JPS61206247A (en) Lead frame for semiconductor device