JPS6097653A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6097653A
JPS6097653A JP20520583A JP20520583A JPS6097653A JP S6097653 A JPS6097653 A JP S6097653A JP 20520583 A JP20520583 A JP 20520583A JP 20520583 A JP20520583 A JP 20520583A JP S6097653 A JPS6097653 A JP S6097653A
Authority
JP
Japan
Prior art keywords
main body
resin main
alternately arranged
semiconductor device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20520583A
Other languages
Japanese (ja)
Inventor
Hirofumi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP20520583A priority Critical patent/JPS6097653A/en
Publication of JPS6097653A publication Critical patent/JPS6097653A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To produce multiple pin resin sealed semiconductor device subject to easy installation with less lead bending by a method wherein the external leads bent inward along the resin main body and the other external leads bent outward and stepwise are alternately arranged. CONSTITUTION:External lead 3a bent outward and stepwise outside a resin main body 1 and the other external leads 3b bent inward along the resin main body 1 are alternately arranged at the side of the resin main body 1. The bottom points of the leads 3b and 3a are made flush to make installation of wiring pads 12, 13 for contact on a print wiring substrate 11 easier. The outside wiring pads 12 and the inside wiring pads 13 are also alternately arranged so that the pad width size may be designed wider requiring less precision of the wiring pattern as well as less precision of locating semiconductor device on the substrate 11 in case of installation.
JP20520583A 1983-11-01 1983-11-01 Semiconductor device Pending JPS6097653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20520583A JPS6097653A (en) 1983-11-01 1983-11-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20520583A JPS6097653A (en) 1983-11-01 1983-11-01 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6097653A true JPS6097653A (en) 1985-05-31

Family

ID=16503136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20520583A Pending JPS6097653A (en) 1983-11-01 1983-11-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6097653A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794446A (en) * 1985-10-25 1988-12-27 Mitsubishi Denki Kabushiki Kaisha Electrode device and a method for making the same
JPH0245650U (en) * 1988-09-24 1990-03-29
US9084348B2 (en) 2009-12-07 2015-07-14 Murata Manufacturing Co., Ltd. High-frequency module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794446A (en) * 1985-10-25 1988-12-27 Mitsubishi Denki Kabushiki Kaisha Electrode device and a method for making the same
JPH0245650U (en) * 1988-09-24 1990-03-29
US9084348B2 (en) 2009-12-07 2015-07-14 Murata Manufacturing Co., Ltd. High-frequency module

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