JPH08264705A - Semiconductor device and package structure and packaging method using the same - Google Patents

Abstract

PURPOSE: To reduce sharply the thickness of a semiconductor package at the time of mounting a board, to make a pitch interval of external connection terminals small and to attain ultra-high density packaging by providing cuts (noches) in external connection terminal parts of a lead time. CONSTITUTION: A semiconductor package is of a type wherein a semiconductor element is sealed with molding resin and wherein external connection terminals 12 are led outside the mounting resin being a sealing part. In these external connection terminals 12 of a lead frame, cuts (notch parts) 14 are provided at an interval of 0.5-3.5mm and external leads can be bent arbitrarily at the notch parts 14 as the starting points of bending. First external connection terminals and second external connection terminals bent upward and downward and in the shape of L respectively are shown in the Fig. According to this constitution, packaging of a semiconductor device on a board for packaging thereof can be simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a mounting structure and a mounting method using the same, and more specifically, a semiconductor device characterized by external connection terminals protruding from a sealing portion and the semiconductor device using the same. The present invention relates to a mounting structure and a mounting method.

[0002]

2. Description of the Related Art A resin mold type semiconductor device will be described below as an example of a sealing structure when a semiconductor element is sealed.

A lead frame for a semiconductor device as shown in FIG. 5 is used for assembling a resin mold type semiconductor device.

FIG. 5 (a) is a plan view, and FIG. 5 (b) is a sectional view taken along the line AA of the plan view. The lead frame 1 for a semiconductor device is formed by partially removing a thin metal plate by etching or punching by pressing.

Structurally, a semiconductor device lead frame 1
Has a frame outer frame 2 formed of a rectangular frame, and has a rectangular die pad 3 to which a semiconductor circuit element is attached at substantially the center of the frame outer frame 2. Further, the die pad 3 is supported by the frame frame 2 by the tab suspension leads 4.
A large number of thin inner leads 5 extend toward the die pad 3 from the inside of the frame outer frame 2, and each inner lead 5 is supported by a dam bar 6 that prevents resin from flowing out during resin molding. The dam bar 6 also serves as a reinforcing member.

[0006] Such a semiconductor device lead frame 1
In this case, after fixing the semiconductor circuit element 7 on the die pad 3, each electrode 10 of the semiconductor circuit element 7 and the inner end of the lead 5 corresponding to these electrodes are connected by a connecting means such as a thin metal wire 8. After that, the inner mold region 9 near the dam bar 6 is molded with a resin called a mold resin, and the circuit element 7, the wire 8,
Cover the inner lead 5.

Next, a method of mounting the semiconductor device and a substrate to be mounted will be described.

FIG. 6 is an explanatory view of a conventional semiconductor device mounting substrate. 6A is a plan view, and FIG. 6B is a substrate B.
It is sectional drawing cut | disconnected by the B cross section.

First, the semiconductor device package 20 is placed on the substrate 30. At this time, the external connection terminals 12 are connected to the lands 3.
Put it according to 1. Then, the solder is melted to electrically and mechanically connect and fix the external connection terminal 12 and the land 31. In this explanatory view, an example of a type (double-sided mounting type) mounted on both front and back surfaces of the substrate is shown. The semiconductor device shown in this figure is a QFP (quad flat package) in which gull wing-shaped external connection terminals are projected in four directions from the body portion of the semiconductor device as an example of a conventional semiconductor device.
The type is shown in the figure. In the conventional semiconductor device, as shown in the figure, one semiconductor device can connect the external connection terminal to only one side of the board. When mounting on both front and back surfaces of the board, two or more semiconductor devices are connected. is necessary.

[0010]

At present, in the resin-molded semiconductor package as described above, only one side of the substrate is used for mounting in actual use, or the substrate is intended for high integration. Both sides of the semiconductor device package are mounted on both sides. However, according to these methods, the mounted substrate has a drawback that the thickness of the package is increased by mounting the package. Further, the pitch of the external connection terminals is also defined by the pitch of the lands 31 of the semiconductor device substrate, which makes it difficult to increase the number of external connection terminals.

It is an object of the present invention to significantly reduce the thickness of a package when mounted, and to enable ultra-high density mounting.

[0012]

In order to achieve the above object,
The semiconductor device according to claim 1, wherein the external connection terminal has an external connection terminal protruding from a sealing portion, and the external connection terminal has a first end in a thickness direction of the semiconductor device. It is characterized by having a first external connection terminal arranged in a direction and a second external connection terminal arranged in a direction opposite to the first direction.

According to a first aspect of the present invention, the external connection terminal has at least two notches.

Furthermore, in claim 2, at least one of the notch portions is 0.5 to 3.0 mm from the resin sealing portion.
It is characterized in that it is provided between.

Further, in claims 1 to 3, the first and second external connection terminals are mixed.

Further, in the first to third aspects, the first and second external connection terminals are alternately arranged.

Also, in the mounting structure using the semiconductor device according to claim 1, there is an opening for disposing the semiconductor device, and lands are arranged on the first surface and a second surface which is a back surface of the first surface. Using the substrate provided, the first and second external connection terminals of the semiconductor device arranged in the opening, the first surface land and the first external connection terminal and the second surface land The second external connection terminals are connected to each other.

Also, in a mounting method using the semiconductor device according to claim 1, the step of disposing the semiconductor device according to claim 1 in an opening of a substrate, and the first and second external connection terminals of the semiconductor device are It is characterized by including a step of forming so as to face a desired land of the substrate, and a step of joining the first and second external connection terminals to the desired land.

By providing the above, it is a means for solving this problem.

[0020]

1 is an explanatory view for explaining an embodiment of a semiconductor device according to the present invention.

FIG. 1A is a plan view of a semiconductor device of the present invention, FIG. 1B is a sectional view taken along the line AA of the semiconductor device, and FIG. It is an enlarged view of the side view of FIG. A semiconductor device (hereinafter referred to as a package) according to the present invention is a type in which a semiconductor element is sealed with a mold resin, and an external connection terminal 12 is drawn out to the outside of the mold resin, which is a sealing portion, as shown in FIG. The external connection terminal 12 has a first bent portion 50 as a starting point, and an end portion of the external connection terminal 12 faces the first direction in the thickness direction of the package. There is a second external connection terminal facing in the opposite direction. In FIG. 1, the first external connection terminal and the second external connection terminal are oriented in both the upper and lower directions and are bent in an L shape. The package according to the present invention has a structure in which a second bent portion, which is a substantially central portion of the external connection terminal, is etched from the root of the package to 0. 5-
The notch 14 is provided between 3.0 mm to realize simple mounting. That is, when mounting, this notch 1
By bending the external leads starting from 4, it is possible to easily mount the package. Forming becomes easier if a notch is also provided in the first bent portion.

In FIG. 1C, a type in which external connection terminals are alternately bent in the vertical direction is shown as an example of the present invention.
It is not necessary to bend the external leads evenly above and below, and it is possible to change the bending angle, the number of bends, and the distribution of the bent leads above and below depending on the substrate and the type of the semiconductor element. Since the package of the present invention is thus mounted on both the front and back sides of the board, the external connection terminals can be distributed and bent according to the wiring patterns on the front and back of the board. Therefore, the external connection terminals have a structure sandwiching the substrate, the bonding strength is increased, and a highly reliable structure can be provided.

FIG. 2 shows an explanatory view of the lead frame for a semiconductor device of the present invention.

FIG. 2A is a plan view of a lead frame for a semiconductor device according to the present invention, and FIG.
It is sectional drawing when it cut | disconnects by A. The lead frame 1 for a semiconductor device is formed by partially removing a thin metal plate by etching or punching by pressing. Structurally, the lead frame 1 for a semiconductor device has a frame outer frame 2 formed of a rectangular frame, and a rectangular die pad 3 for mounting a semiconductor circuit element at a substantially central portion of the frame outer frame 2. Further, the die pad 3 is supported by the frame frame 2 by tie bars 4. A large number of thin inner leads 5 extend toward the die pad 3 from the inside of the frame outer frame 2, and each inner lead 5 is supported by a dam bar 6 that prevents resin from flowing out during resin molding. The dam bar 6 also serves as a reinforcing member. Then, the semiconductor element 7 is placed on the die pad 3 located substantially at the center, and thereafter, the inner lead 5 and the electrode 15 of the semiconductor element are electrically connected to the metal thin wire 8. The external connection terminal 12 is provided with a notch portion 14, and the position thereof is appropriately provided outside the mold line 9 (to the external connection terminal side) within a range of 0.5 to 3.5 mm. The position or depth at which these notch portions are provided can be appropriately determined depending on the thickness of the substrate to be mounted and the position of wiring on the substrate.

FIG. 3 is an explanatory view for explaining the mounting board according to the present invention. 3 (a) is a plan view and FIG. 3 (b).
FIG. 3 is a cross-sectional view of the plan view taken along the line BB. In the present invention, a glass epoxy material is used for the semiconductor device substrate 30. As a matter of course, other than glass epoxy, ceramic substrates or silicon substrates can be used instead. Then, a mounting hole 28 for mounting a semiconductor device is provided at substantially the center of the substrate for semiconductor device, and the mounting hole 28 is provided.
A land 31 for connecting the external lead of the semiconductor device to the wiring on the substrate for the semiconductor device is appropriately arranged as required. In the present invention, gold is used as the material for the land. The size of the arranging hole 28, the space between the lands, and the wiring pattern are appropriately determined depending on the size and type of the package in which the mounting pattern is mounted.
In addition, wiring patterns and lands do not have to be the same wiring on both the front and back sides of the board. Can be provided. Further, the material of the semiconductor device substrate or the material of the land can be appropriately determined depending on the type of the semiconductor device substrate and the type of the semiconductor device.

Next, a mounting substrate of the semiconductor device according to the present invention and a mounting method on the substrate will be described.

FIG. 4 is an explanatory diagram for explaining the mounting method of the present invention. FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along the line AA of the plan view. The substrate according to the present invention has a semiconductor device arranging hole 28 for arranging a semiconductor device in substantially the center thereof, and a land 31 for connecting an external connection terminal of the semiconductor device to the periphery thereof. The spacing and the position of placement are appropriately determined depending on the type and size of the semiconductor device. To mount the semiconductor device, the semiconductor device according to the present invention is inserted into the semiconductor device mounting hole 28 of the substrate, and the notch portion 1 is formed.
The bending land 31 and the external connection terminal 12 are brought into contact with each other on the side of the land 31 with 4 as the starting point, and then the contact point is connected and fixed by soldering or the like. This is done for both the front and back, and the mounting is completed. The figure after mounting is shown in FIG. In the present invention, the method of connecting the semiconductor device and the semiconductor device substrate is performed by soldering, but it is also possible to connect by a conductive adhesive or the like.

In the present specification, the method of bending the external lead from the notch portion 14 as the starting point has been described.
It is also possible to bend the external leads and mount them without providing 4. Further, it is not necessary to mount the external leads on both the upper and lower sides of the substrate, and it is possible to bend the external leads only to one upper side or one lower side of the substrate.

Although the resin mold type semiconductor device has been described as an example of the sealing structure, any sealing structure may be adopted as long as the semiconductor device has a structure in which the external connection terminals are projected from the sealing portion. Needless to say, it is okay.

[0030]

From the above description, the following effects can be obtained by using the semiconductor device and the mounting substrate according to the present invention.

(1) The mounting height of the semiconductor device is reduced, and high-density mounting is possible.

(2) The pitch of the external connection terminals of the semiconductor device can be made fine, and high-density mounting is possible.

[Brief description of drawings]

FIG. 1 is an explanatory diagram for explaining an embodiment of a semiconductor device according to the present invention.

FIG. 2 is an explanatory diagram of a lead frame for a semiconductor device according to the present invention.

FIG. 3 is an explanatory view of a substrate for a semiconductor device according to the present invention.

FIG. 4 is an explanatory diagram of a substrate on which a semiconductor device according to the present invention is mounted.

FIG. 5 is an explanatory diagram of a conventional semiconductor device lead frame.

FIG. 6 is an explanatory diagram of a conventional mounting method.

[Explanation of symbols]

 1 Lead Frame 2 Frame Outer Frame 3 Die Pad 4 Tab Suspension Lead 5 Inner Lead 6 Dam Bar 7 Semiconductor Element 8 Metal Fine Wire 9 Mold Line 10 Bonding Pad 11 Frame Gate 12 External Connection Terminal 14 Notch 20 Semiconductor Device 28 Semiconductor Device Mounting Hole 30 Semiconductor device substrate 31 Land 50 First bent portion

Claims (7)

[Claims] 1. A semiconductor device having an external connection terminal protruding from a sealing portion, wherein the external connection terminal is arranged such that an end portion of the terminal is arranged in a first direction in a thickness direction of the semiconductor device. A semiconductor device, comprising: a first external connection terminal formed by: and a second external connection terminal formed by disposing the terminal in a direction opposite to the first direction. 2. The semiconductor device according to claim 1, wherein the external connection terminal has at least two notches. 3. The semiconductor device according to claim 2, wherein at least one of the notch portions is provided within 0.5 to 3.0 mm from the resin sealing portion. 4. The semiconductor device according to claim 1, wherein the first and second external connection terminals are mixed. 5. The semiconductor device according to claim 1, wherein the first and second external connection terminals are alternately arranged. 6. A substrate having an opening for arranging a semiconductor device and having lands arranged on a first surface and a second surface which is a back surface of the first surface is arranged in the opening. First and second external connection terminals of the semiconductor device are connected to the land of the first surface and the first external connection terminal and the land of the second surface and the second external connection terminal, respectively. A mounting structure using the semiconductor device according to claim 1. 7. A step of disposing the semiconductor device according to claim 1 in an opening of a substrate, and a step of forming the first and second external connection terminals of the semiconductor device so as to face a desired land of the substrate. And a step of joining the first and second external connection terminals to the desired land, the mounting method using the semiconductor device according to claim 1.