JPH07297341A - Composite lead frame - Google Patents

Abstract

PURPOSE:To obtain a composite lead frame having a recognizing mark, which can readily align the position of an inner FPC or TAB table carrier and the position of a lead frame at the outside accurately. CONSTITUTION:This is a composite lead frame 10, which is formed by linking an inner FPC 12 or a TAB table carrier and an outer lead frame 14. At least one dummy lead 24 is provided at one of the corresponding position of the FPC or TAB table carrier and the lead frame, respectively. A recognizing mark 22 for position alignment is provided in the vicinity at the tip of the dummy lead or in the vicinity of the tip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an inner FPC or T
Regarding a composite lead frame formed by connecting an AB tape carrier and an outer lead frame, in more detail, a copper foil lead pattern formed on an inner FPC or TAB tape carrier is joined to an inner lead of an outer lead frame. The present invention relates to a composite lead frame having a positioning means for aligning.

[0002]

2. Description of the Related Art A composite lead frame is a copper foil lead pattern formed on an inner FPC or TAB tape carrier corresponding to an inner lead for connecting to a semiconductor element (LSI chip) and an external printed circuit board or the like. The outer lead for this purpose is joined to the inner lead of the outer lead frame. Therefore, when manufacturing this composite lead frame, an important problem is how to align the copper foil lead pattern formed on the inner FPC or TAB tape carrier with the inner lead of the outer lead frame. Become.

These FPCs, TAB tape carriers,
The lead frame is generally provided with an identification-shaped mark, an index mark, or the like. For example,
In the case of an FPC or TAB tape carrier, an identification mark is provided in the vicinity of a device hole for alignment when bonding an LSI chip and an inner lead.
J. ED-7431, for example, describes how to attach index marks to the leads of a quat tape carrier package. As an example, the actual Kaihei 3-
In the lead frame disclosed in Japanese Patent No. 88337, the leading end of the outermost lead or the leading end of the lead near this lead is provided with an identification shape so that the lack of these leads can be easily confirmed visually. I am able to do it.

However, these recognition-shaped marks, index marks, etc. are mainly used for alignment when bonding the terminals (pads) of the LSI chip and the inner leads of the lead frame, as described above, and the leads. Since some of the inner and outer leads of the lead frame are enlarged so that it is possible to easily visually check for missing parts, in addition to the problem that the lead pattern design is restricted, There is also a problem that it becomes a bottleneck to the conversion.

On the other hand, also in the composite lead frame, the recognition shape is used for the alignment when the terminal of the LSI chip to be mounted and the tip of the copper foil lead pattern formed on the FPC or TAB tape carrier are bonded. Although the mark is provided, it cannot be used for aligning the FPC or TAB tape carrier inside the composite lead frame with the lead frame outside the composite lead frame. There has been a problem that the inner and outer leads cannot be accurately and easily aligned in the lead frame manufacturing process, and the manufacturing yield of the composite lead frame cannot be improved.

[0006]

SUMMARY OF THE INVENTION The object of the present invention is to solve various problems based on the above-mentioned prior art, and to solve
An object of the present invention is to provide a composite lead frame having a recognition mark capable of accurately and easily aligning a PC or TAB tape carrier with an outer lead frame. Another object of the present invention is to provide, in addition to the above object, a composite lead frame capable of facilitating the flow of molding resin when mounting a semiconductor element.

[0007]

In order to achieve the above object, the present invention is a composite lead frame in which an inner FPC or TAB tape carrier and an outer lead frame are connected to each other. At least one dummy lead is provided at a position corresponding to the TAB tape carrier and the lead frame, and a recognition mark for alignment is provided at a tip of the dummy lead or in the vicinity of the tip. To provide a composite lead frame.

Here, the composite lead frame is QF
In the P-type composite lead frame, the dummy leads provided on the FPC or TAB tape carrier are provided at at least one corner, and the dummy leads provided on the lead frame are the FPC or TAB tape carrier. It is preferable that the dummy leads are provided at the same corners as the dummy leads. Further, it is preferable that the recognition mark provided on the dummy lead of the FPC or TAB tape carrier and the recognition mark provided on the dummy lead of the lead frame have the same shape. Further, the recognition mark preferably has at least two corners.

[0009]

The composite lead frame of the present invention is applied to the FPC or TAB tape carrier to connect the copper foil lead pattern formed on the inner FPC or TAB tape carrier and the inner lead of the outer lead frame. A dummy lead is provided, and a dummy lead is also provided on the lead frame at a position corresponding to the dummy lead of the FPC or TAB tape carrier, and further, a recognition for alignment is provided at or near the tips of these dummy leads. It is provided with a mark.

That is, at the connecting portion between the inner FPC or TAB tape carrier and the outer lead frame, the recognition mark provided on the dummy lead of the FPC or TAB tape carrier and the recognition mark provided on the dummy lead of the lead frame. Based on the mark and the inside F
By aligning the PC or TAB tape carrier and the outer lead frame, the outer tip of the copper foil pattern formed on the inner FPC or TAB tape carrier and the inner lead of the inner lead of the outer lead frame are aligned. Since the tip portion is automatically aligned with each other, these may be joined and electrically connected to each other.

Therefore, according to the composite lead frame of the present invention, the FPC or TAB tape carrier, which has been a big problem in manufacturing the conventional composite lead frame,
Since the alignment with the lead frame can be performed accurately and easily, the reliability and manufacturing yield of the composite lead frame can be significantly improved.

In the QFP type composite lead frame, it is preferable that at least one dummy lead of the FPC or TAB tape carrier and one dummy lead of the lead frame are formed at the same corner. Most preferably, they are formed at the four corners. In this case, when the composite lead frame of the present invention is resin-sealed, a special effect of facilitating the flow of the molding resin is produced, and thus the productivity and reliability can be further improved.

The recognition mark on the FPC or TAB tape carrier and the recognition mark on the lead frame are
It is preferable that they have the same shape, but based on these recognition marks, the outer end portion of the copper foil pattern formed on the inner FPC or TAB tape carrier and the inner tip portion of the inner lead of the outer lead frame. If and can be aligned, they do not necessarily have the same shape.

Further, if the recognition mark has at least two corners, the FPC or TAB tape carrier can be accurately aligned with the lead frame. Any shape may be used as long as the inner FPC or TAB tape carrier can be aligned with the outer lead frame. Here, the shape having two corners is a shape having corners such as a polygon such as a triangle or a quadrangle, but the recognition mark may be, for example, a part of the polygon or a part of the polygon. It is also possible to use a curved line on all sides.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The composite lead frame of the present invention will be described in detail below with reference to the preferred embodiments shown in the accompanying drawings.

FIG. 1 is a plan view of an embodiment of the composite lead frame of the present invention. The composite lead frame 10 shown in the figure is a QFP type composite lead frame 10, and includes an inner FPC 12 corresponding to an inner lead for connecting with an LSI chip and an outer lead for connecting with an external printed circuit board or the like. It is composed of a corresponding outer lead frame 14.

Here, the inner FPC 12 has an L
A flat plate-shaped insulator 18 having the SI mounting portion 16, a copper foil pattern 20 formed on the insulator 18 by etching so as to extend radially from the center of the insulator 18, and the insulator 18 And a dummy lead 24 extending from the four corners of the insulator 18 toward the center of the insulator 18 and having a recognition mark 22 at the end of the insulator 18 on the center side. And the terminals (pads) of the LSI chip mounted on the LSI mounting portion 16 of the insulator 18 are electrically connected to each other.

The outer lead frame 14 has an inner lead 26 extending radially from the center thereof, and a first tie bar 28 connecting the inner leads 26 at the outer end of the inner lead 26. This first
The dummy leads 32 extending from the four corners of the tie bar 28 toward the center of the lead frame 14 and having the recognition mark 30 at the end of the lead frame 14 on the center side, and extending vertically from the first tie bar 28 in the outward direction. Existing outer lead 3
4, and a second tie bar 36 that connects the outer leads 34 at the outer end of the outer leads 34,
The inner leads 26, the outer leads 34, and the dummy leads 32, which are composed of the cushion leads 38 and 40 and the outer frame portion 42 and whose leads are connected by the first and second tie bars 28 and 36, are the cushion leads 38. , 40 to be supported by the outer frame portion 42.

At these joints 44, F
When the recognition marks 22 of the dummy leads 24 formed at the four corners of the insulator 18 of the PC 12 and the recognition marks 30 of the dummy leads 32 formed at the four corners of the first tie bar 28 of the lead frame 14 are aligned with each other. Based on this, the tip portion of the copper foil pattern 20 of the inner FPC 12 on the lead frame 14 side and the outer lead frame 14
The inner lead 26 of the FPC 12 side end portion of the inner lead 26 is automatically aligned.
By electrically connecting, the composite lead frame 10 of the present invention is configured.

Next, in the composite lead frame 10 of the present invention, the inner FPC 12 and the outer lead frame 14 are used.
Dummy lead 2 used when aligning and
4, 32 and the recognition marks 22, 30 will be described using the specific examples shown in FIGS. 2, 3 and 4.

First, FIG. 2 is a partially enlarged plan view of the dummy lead 24 portion of the inner FPC 12. FIG. 3 is a partially enlarged plan view of the dummy lead 32 portion of the outer lead frame 14. 4 is a partially enlarged view of the dummy leads 24, 32 of the composite lead frame 10 in which the recognition mark 22 of the dummy lead 24 shown in FIG. 2 and the recognition mark 30 of the dummy lead 32 shown in FIG. 3 are aligned with each other. It is a top view. The recognition marks 22 and 30 shown in FIGS. 2 and 3 are formed in the same quadrangular shape.

As shown in FIGS. 2 to 4, the composite lead frame 10 of the present invention has an FPC 12 inside thereof.
And the outer lead frame 14, both of which have the same shape of the recognition marks 22, 30 for aligning them.
Particularly, since the rectangular recognition marks 22 and 30 are formed for facilitating the alignment, it is only necessary to align the positions of the recognition mark 22 provided on the FPC 12 and the recognition mark 30 provided on the lead frame 14. , FPC1
The end portion of the copper foil pattern 20 on the side of the second lead frame 14 and the end portion of the inner lead 26 of the lead frame 14 can be accurately and easily aligned, and these can be completely joined.

In the embodiment described above, the dummy leads 24 and the rectangular recognition marks 22 are provided at the four corners of the insulator 18 of the FPC 12, and the dummy leads 32 are the same as the dummy leads 32 at the four corners of the first tie bar 28 of the lead frame 14. The rectangular recognition mark 30 is provided, and the recognition mark 22 of the FPC 12 and the recognition mark 30 of the lead frame 14 are aligned with each other, and the FPC 12 and the lead frame 14 are joined to each other to form the composite lead frame 10 of the present invention. Although one example of the configuration is shown, the composite lead frame 10 of the present invention is not limited to this.

For example, in the case of the QFP type composite lead frame, the dummy leads 24 provided on the FPC 12 and the dummy leads 32 provided on the lead frame 14 are arranged at positions F, respectively, as in the above-described embodiment.
The four corners of the insulator 18 of the PC 12 and the lead frame 14
It is optimal that the first tie bars 28 are arranged at the four corners of the first tie bar 28. However, for example, they may be formed only at two diagonally opposite two corners, or the copper foil pattern 20 and the lead of the FPC 12 facing each other may be formed. Part of the inner lead 26 of the frame 14 may be replaced by the dummy lead 24 and the dummy lead 32, respectively, as long as the alignment marks 22 and 30 formed on both the FPC 12 and the lead frame 14 enable accurate alignment. , It may be arranged at any position.

As in the above-mentioned embodiment, the FPC1
2 and the dummy lead 32 provided on the lead frame 14 are respectively connected to the FPC.
In addition to the above effects, the composite lead frame 10 of the present invention, in particular, the QFP, is formed in the four corners of the insulator 18 and the four corners of the first tie bar 28 of the lead frame 14.
It is possible to obtain a special effect that the flow of the mold resin is facilitated and the productivity can be improved when the type of composite lead frame is sealed with the resin.

Further, the FPC 12 and the lead frame 1
It is optimal that the recognition marks 22 and 30 formed on the position 4 are arranged at the tips of the dummy leads 24 and 32 or near the tips, as in the above-described embodiment.
For example, it may be arranged at an intermediate portion between the dummy leads 24 and 32, and may be arranged at any position as long as it is connected to the dummy leads 24 and 32. Furthermore, FP
The shape of the recognition marks 22 and 30 formed on the C12 and the lead frame 14 is optimally a quadrangle as in the above-described embodiment, but if the shape has at least two corners, it is formed on both the FPC and the lead frame. As a matter of course, it is possible to perform accurate alignment with the recognition marks that are formed.

[0027]

As described above in detail, the composite lead frame of the present invention has the recognition mark of the FPC or TAB tape carrier at the joint between the inner FPC or TAB tape carrier and the outer lead frame. By aligning the lead frame recognition mark with each other, the inner FPC or TAB tape carrier copper foil pattern and the outer lead frame inner lead are automatically aligned. , Electrically connected.

Therefore, according to the composite lead frame of the present invention, the FPC or TAB tape carrier, which has been a big problem in manufacturing the conventional composite lead frame,
Since the alignment with the lead frame can be performed accurately and easily, the reliability and yield of the composite lead frame can be significantly improved. When the dummy leads of the FPC or TAB tape carrier and the dummy leads of the lead frame are formed at the corners, especially at the four corners, the composite lead frame of the present invention, especially the QFP.
When the type of composite lead frame is sealed with resin, the flow of the mold resin is facilitated, so that productivity and reliability can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of a composite lead frame of the present invention.

FIG. 2 is an F used in the composite lead frame of the present invention.
It is a partial enlarged plan view of an example of a dummy lead portion of a PC.

FIG. 3 is a partially enlarged plan view of an embodiment of a dummy lead portion of a lead frame used in the composite lead frame of the present invention.

FIG. 4 is a partially enlarged plan view of an embodiment of the dummy lead and the dummy lead portion of the composite lead frame of the present invention.

[Explanation of symbols]

 10 Composite lead frame 12 FPC 14 Lead frame 16 LSI chip (semiconductor element) mounting part 18 Insulator 20 Copper foil pattern 22, 30 Recognition mark 24 Dummy lead 26 Inner lead 28, 36 Tie bar 32 Dummy lead 34 Outer lead 38, 40 Cushion Lead 42 Outer frame 44 Joint

Claims (4)

[Claims] 1. A composite lead frame formed by connecting an inner FPC or TAB tape carrier and an outer lead frame, each of which is provided at a corresponding position of the FPC or TAB tape carrier and the lead frame. At least 1
A composite lead frame, characterized in that individual dummy leads are provided, and recognition marks for alignment are respectively provided at or near the tips of these dummy leads. 2. The composite lead frame according to claim 1,
In a QFP type composite lead frame, the dummy leads provided on the FPC or TAB tape carrier are provided at at least one corner, and the dummy leads provided on the lead frame are
A composite lead frame provided at the same corner as the dummy lead provided on the PC or TAB tape carrier. 3. The composite lead according to claim 1, wherein the recognition mark provided on the dummy lead of the FPC or TAB tape carrier and the recognition mark provided on the dummy lead of the lead frame have the same shape. flame. 4. The composite lead frame according to claim 1, wherein the recognition mark has at least two corners.