JPH01118406U - - Google Patents

Info

Publication number
JPH01118406U
JPH01118406U JP1401988U JP1401988U JPH01118406U JP H01118406 U JPH01118406 U JP H01118406U JP 1401988 U JP1401988 U JP 1401988U JP 1401988 U JP1401988 U JP 1401988U JP H01118406 U JPH01118406 U JP H01118406U
Authority
JP
Japan
Prior art keywords
electronic component
holding plate
board
substrate
component substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1401988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1401988U priority Critical patent/JPH01118406U/ja
Publication of JPH01118406U publication Critical patent/JPH01118406U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP1401988U 1988-02-02 1988-02-02 Pending JPH01118406U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1401988U JPH01118406U (enrdf_load_stackoverflow) 1988-02-02 1988-02-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1401988U JPH01118406U (enrdf_load_stackoverflow) 1988-02-02 1988-02-02

Publications (1)

Publication Number Publication Date
JPH01118406U true JPH01118406U (enrdf_load_stackoverflow) 1989-08-10

Family

ID=31224837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1401988U Pending JPH01118406U (enrdf_load_stackoverflow) 1988-02-02 1988-02-02

Country Status (1)

Country Link
JP (1) JPH01118406U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005324330A (ja) * 2004-05-12 2005-11-24 Tamakkusu:Kk チップ部品用セラミック基板の分割装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005324330A (ja) * 2004-05-12 2005-11-24 Tamakkusu:Kk チップ部品用セラミック基板の分割装置

Similar Documents

Publication Publication Date Title
JPS6099542A (ja) ジグ
JPH01118406U (enrdf_load_stackoverflow)
JPH01166545A (ja) ジグザグ型ic
JPH0615424Y2 (ja) コネクタ実装構造
JPS5969491U (ja) 端子挿通装置
JPS61140588U (enrdf_load_stackoverflow)
JPH02111093A (ja) 半導体装置の表面実装構造
JPS6046669U (ja) 給電端子ブロツク
JPH0729584Y2 (ja) サ−フエイスマウント用コネクタ
JP3415770B2 (ja) 多連チップ電子部品
JPH0531676Y2 (enrdf_load_stackoverflow)
JPH0711419Y2 (ja) Icソケット
JPH04369893A (ja) 電子部品の支持装置
JP2531130Y2 (ja) 半導体デバイスの電極部構造
JPS61294774A (ja) 導通金具
JPS5840859U (ja) 電子部品取付具
JPH0211790Y2 (enrdf_load_stackoverflow)
JPH0588000U (ja) 電子部品のリードピン整形装置
JPS58143176U (ja) 平板ピン插入治具
JP2502368Y2 (ja) 配線基板
JPH0716300Y2 (ja) 混成集積回路用基板のクリップ端子構造
JPH04352488A (ja) 有機混成集積回路
JPH0350638Y2 (enrdf_load_stackoverflow)
JPH06244347A (ja) 半導体部品の実装構造
JPS6130975U (ja) プリント基板実装端子