JPH01116479U

JPH01116479U -

Info

Publication number: JPH01116479U
Application number: JP1117688U
Authority: JP
Priority date: 1988-02-01
Filing date: 1988-02-01
Publication date: 1989-08-07

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図及び第３図は本考案に係る連結ピンとしてのリ
ードピンの正面断面図及び側面断面図、第４図は
本考案における多層化加工の完了後の状態を示す
正面断面図、第５図及び第６図は従来の多層化加
工を説明する各層図及び積層断面図である。１，２…プリント基板、４…スルーホール、５
…連結ピン（リードピン）、６…プリントパター
ン、５１…ヘツド、５２…膨出部。 Fig. 1 is a sectional view showing one embodiment of the present invention;
3 and 3 are a front sectional view and a side sectional view of a lead pin as a connecting pin according to the present invention, FIG. 4 is a front sectional view showing the state after completion of multilayer processing in the present invention, and FIGS. FIG. 6 is a diagram of each layer and a sectional view of the laminated layers for explaining conventional multilayer processing. 1, 2...Printed circuit board, 4...Through hole, 5
...Connecting pin (lead pin), 6...Print pattern, 51...Head, 52...Bulging portion.

Claims

[Scope of Claim for Utility Model Registration] (1) By overlapping multiple synthetic resin printed circuit boards, the through holes provided in each printed circuit board are connected in a straight line to form an insertion hole, and the outer periphery is A printed circuit board characterized in that each printed circuit board is connected in multiple layers by press-fitting a hard connecting pin having a protrusion on the surface into the insertion hole and causing the protrusion to bite into the metal layer of the through hole. Multilayer structure. (2) The multilayer structure of a printed circuit board according to claim (1) of the utility model registration, characterized in that the connecting pin is a lead pin made of metal. (3) Scope of claims for utility model registration, paragraph (1) or (2)
3.) The multilayer structure of a printed circuit board according to item 1, wherein the outer periphery of the connecting pin and the land of the printed circuit board are soldered. (4) The multilayer structure of printed circuit boards as described in claim (1) of the utility model registration, characterized in that an adhesive layer is formed between the stacked printed circuit boards. (5) Scope of claims for utility model registration, paragraph (1) or (2)
2.) The multilayer structure of a printed circuit board according to item 1, wherein the protrusion is formed by crushing a part of the connection pin, and has an oval cross-sectional shape. (6) In claim (1) of the utility model registration, the axial length of the protrusion is shorter than the axial length of the insertion hole, and the protrusion is housed in the insertion hole. Features a multilayer printed circuit board structure. (7) Scope of claims for utility model registration, paragraph (1) or (2)
In the multilayer structure of the printed circuit board according to item (), one end of the connecting pin is provided with a head portion extending in a direction perpendicular to the axial direction, and the head portion is in contact with a land portion of the printed circuit board. body. (8) The multilayer structure of a printed circuit board as set forth in claim (1) of the utility model registration, characterized in that a spacer substrate without a conductive pattern is superimposed with the plurality of printed circuit boards. (9) The multilayer structure of a printed circuit board according to claim (8) of the utility model registration, characterized in that the mechanical strength of the spacer substrate is greater than the strength of the printed circuit board.