JPH01115255U - - Google Patents

Info

Publication number
JPH01115255U
JPH01115255U JP983988U JP983988U JPH01115255U JP H01115255 U JPH01115255 U JP H01115255U JP 983988 U JP983988 U JP 983988U JP 983988 U JP983988 U JP 983988U JP H01115255 U JPH01115255 U JP H01115255U
Authority
JP
Japan
Prior art keywords
semiconductor device
conductive part
insulating sealant
control element
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP983988U
Other languages
English (en)
Japanese (ja)
Other versions
JP2511979Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP983988U priority Critical patent/JP2511979Y2/ja
Publication of JPH01115255U publication Critical patent/JPH01115255U/ja
Application granted granted Critical
Publication of JP2511979Y2 publication Critical patent/JP2511979Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP983988U 1988-01-27 1988-01-27 半導体装置 Expired - Lifetime JP2511979Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP983988U JP2511979Y2 (ja) 1988-01-27 1988-01-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP983988U JP2511979Y2 (ja) 1988-01-27 1988-01-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH01115255U true JPH01115255U (OSRAM) 1989-08-03
JP2511979Y2 JP2511979Y2 (ja) 1996-09-25

Family

ID=31216938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP983988U Expired - Lifetime JP2511979Y2 (ja) 1988-01-27 1988-01-27 半導体装置

Country Status (1)

Country Link
JP (1) JP2511979Y2 (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002103781A1 (en) * 2001-06-14 2002-12-27 Tokyo Electron Limited Wafer supporter
JP2009252886A (ja) * 2008-04-03 2009-10-29 Denso Corp 電子装置
WO2019017283A1 (ja) * 2017-07-21 2019-01-24 株式会社村田製作所 電子部品
JP2024515109A (ja) * 2021-04-21 2024-04-04 ヒタチ・エナジー・リミテッド 半導体パワーモジュール、ならびに半導体パワーモジュールおよび半導体パワーデバイスを製造するための方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740966A (en) * 1980-08-25 1982-03-06 Hitachi Ltd Semiconductor device
JPS6037248U (ja) * 1983-08-19 1985-03-14 富士電機株式会社 混成集積回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740966A (en) * 1980-08-25 1982-03-06 Hitachi Ltd Semiconductor device
JPS6037248U (ja) * 1983-08-19 1985-03-14 富士電機株式会社 混成集積回路

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002103781A1 (en) * 2001-06-14 2002-12-27 Tokyo Electron Limited Wafer supporter
JP2009252886A (ja) * 2008-04-03 2009-10-29 Denso Corp 電子装置
WO2019017283A1 (ja) * 2017-07-21 2019-01-24 株式会社村田製作所 電子部品
US11335617B2 (en) 2017-07-21 2022-05-17 Murata Manufacturing Co., Ltd. Electronic component
JP2024515109A (ja) * 2021-04-21 2024-04-04 ヒタチ・エナジー・リミテッド 半導体パワーモジュール、ならびに半導体パワーモジュールおよび半導体パワーデバイスを製造するための方法

Also Published As

Publication number Publication date
JP2511979Y2 (ja) 1996-09-25

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