JPH01110105A - 硬脆材料の切断方法 - Google Patents

硬脆材料の切断方法

Info

Publication number
JPH01110105A
JPH01110105A JP26910687A JP26910687A JPH01110105A JP H01110105 A JPH01110105 A JP H01110105A JP 26910687 A JP26910687 A JP 26910687A JP 26910687 A JP26910687 A JP 26910687A JP H01110105 A JPH01110105 A JP H01110105A
Authority
JP
Japan
Prior art keywords
inner peripheral
peripheral blade
cut
warpage
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26910687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH052489B2 (enExample
Inventor
Tetsuya Hirota
哲也 廣田
Masaharu Ninomiya
二宮　正晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KYUSHU ELECTRON METAL CO Ltd
Nippon Steel Corp
Osaka Titanium Co Ltd
Original Assignee
KYUSHU ELECTRON METAL CO Ltd
Osaka Titanium Co Ltd
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYUSHU ELECTRON METAL CO Ltd, Osaka Titanium Co Ltd , Sumitomo Metal Industries Ltd filed Critical KYUSHU ELECTRON METAL CO Ltd
Priority to JP26910687A priority Critical patent/JPH01110105A/ja
Publication of JPH01110105A publication Critical patent/JPH01110105A/ja
Publication of JPH052489B2 publication Critical patent/JPH052489B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/005—Vibration-damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP26910687A 1987-10-23 1987-10-23 硬脆材料の切断方法 Granted JPH01110105A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26910687A JPH01110105A (ja) 1987-10-23 1987-10-23 硬脆材料の切断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26910687A JPH01110105A (ja) 1987-10-23 1987-10-23 硬脆材料の切断方法

Publications (2)

Publication Number Publication Date
JPH01110105A true JPH01110105A (ja) 1989-04-26
JPH052489B2 JPH052489B2 (enExample) 1993-01-12

Family

ID=17467753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26910687A Granted JPH01110105A (ja) 1987-10-23 1987-10-23 硬脆材料の切断方法

Country Status (1)

Country Link
JP (1) JPH01110105A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0358805A (ja) * 1989-07-27 1991-03-14 Tokyo Seimitsu Co Ltd スライシングマシンの切断方法及びその装置
EP0456223A1 (en) * 1990-05-10 1991-11-13 Tokyo Seimitsu Co.,Ltd. A slicing machine and a slicing method by the same
JPH0494408U (enExample) * 1990-12-28 1992-08-17
CN105666710A (zh) * 2016-04-05 2016-06-15 东旭科技集团有限公司 用于板材切割的内圆切片机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0333484A (ja) * 1989-06-29 1991-02-13 Harman Co Ltd 流体輸送装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0333484A (ja) * 1989-06-29 1991-02-13 Harman Co Ltd 流体輸送装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0358805A (ja) * 1989-07-27 1991-03-14 Tokyo Seimitsu Co Ltd スライシングマシンの切断方法及びその装置
EP0456223A1 (en) * 1990-05-10 1991-11-13 Tokyo Seimitsu Co.,Ltd. A slicing machine and a slicing method by the same
US5287843A (en) * 1990-05-10 1994-02-22 Tokyo Seimitsu Co., Ltd. Slicing machine employing an axial force to provide rigidity to a rotary blade
JPH0494408U (enExample) * 1990-12-28 1992-08-17
CN105666710A (zh) * 2016-04-05 2016-06-15 东旭科技集团有限公司 用于板材切割的内圆切片机

Also Published As

Publication number Publication date
JPH052489B2 (enExample) 1993-01-12

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