JPH0110934Y2 - - Google Patents
Info
- Publication number
- JPH0110934Y2 JPH0110934Y2 JP1988066148U JP6614888U JPH0110934Y2 JP H0110934 Y2 JPH0110934 Y2 JP H0110934Y2 JP 1988066148 U JP1988066148 U JP 1988066148U JP 6614888 U JP6614888 U JP 6614888U JP H0110934 Y2 JPH0110934 Y2 JP H0110934Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- nail
- leadless
- diode
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 24
- 238000007789 sealing Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 229940112669 cuprous oxide Drugs 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988066148U JPH0110934Y2 (ko) | 1988-05-19 | 1988-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988066148U JPH0110934Y2 (ko) | 1988-05-19 | 1988-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195742U JPS63195742U (ko) | 1988-12-16 |
| JPH0110934Y2 true JPH0110934Y2 (ko) | 1989-03-29 |
Family
ID=30903884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988066148U Expired JPH0110934Y2 (ko) | 1988-05-19 | 1988-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0110934Y2 (ko) |
-
1988
- 1988-05-19 JP JP1988066148U patent/JPH0110934Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63195742U (ko) | 1988-12-16 |
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