JPH01101362A - 樹脂組成物 - Google Patents

樹脂組成物

Info

Publication number
JPH01101362A
JPH01101362A JP62259377A JP25937787A JPH01101362A JP H01101362 A JPH01101362 A JP H01101362A JP 62259377 A JP62259377 A JP 62259377A JP 25937787 A JP25937787 A JP 25937787A JP H01101362 A JPH01101362 A JP H01101362A
Authority
JP
Japan
Prior art keywords
parts
compound
epoxy resin
resin composition
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62259377A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563486B2 (enExample
Inventor
Yasuhiro Okamoto
康弘 岡本
Takatoshi Morimoto
孝敏 森本
Hiroaki Nanba
宏彰 難波
Masato Tamao
玉生　征人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Priority to JP62259377A priority Critical patent/JPH01101362A/ja
Publication of JPH01101362A publication Critical patent/JPH01101362A/ja
Publication of JPH0563486B2 publication Critical patent/JPH0563486B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP62259377A 1987-10-14 1987-10-14 樹脂組成物 Granted JPH01101362A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62259377A JPH01101362A (ja) 1987-10-14 1987-10-14 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62259377A JPH01101362A (ja) 1987-10-14 1987-10-14 樹脂組成物

Publications (2)

Publication Number Publication Date
JPH01101362A true JPH01101362A (ja) 1989-04-19
JPH0563486B2 JPH0563486B2 (enExample) 1993-09-10

Family

ID=17333280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62259377A Granted JPH01101362A (ja) 1987-10-14 1987-10-14 樹脂組成物

Country Status (1)

Country Link
JP (1) JPH01101362A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
US5318243A (en) * 1991-07-03 1994-06-07 Shimano Inc. Spinning reel having a device for preventing backward rotation of a rotor
JPWO2021193303A1 (enExample) * 2020-03-23 2021-09-30
JP7869933B1 (ja) * 2024-12-02 2026-06-03 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料
WO2026121174A1 (ja) * 2024-12-02 2026-06-11 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
US5318243A (en) * 1991-07-03 1994-06-07 Shimano Inc. Spinning reel having a device for preventing backward rotation of a rotor
JPWO2021193303A1 (enExample) * 2020-03-23 2021-09-30
WO2021193303A1 (ja) * 2020-03-23 2021-09-30 日本化薬株式会社 エポキシ樹脂、エポキシ化合物、エポキシ樹脂組成物、樹脂シート、プリプレグ、炭素繊維強化複合材料、及びフェノール樹脂
CN115335427A (zh) * 2020-03-23 2022-11-11 日本化药株式会社 环氧树脂、环氧化合物、环氧树脂组合物、树脂片材、预浸体、碳纤维增强复合材料及酚醛树脂
KR20220157963A (ko) * 2020-03-23 2022-11-29 닛뽄 가야쿠 가부시키가이샤 에폭시 수지, 에폭시 화합물, 에폭시 수지 조성물, 수지 시트, 프리프레그, 탄소 섬유 강화 복합 재료 및, 페놀 수지
TWI849301B (zh) * 2020-03-23 2024-07-21 日商日本化藥股份有限公司 環氧樹脂、環氧樹脂組成物、樹脂片、預浸體、及碳纖維強化複合材料
CN115335427B (zh) * 2020-03-23 2024-09-24 日本化药株式会社 环氧树脂、环氧化合物、环氧树脂组合物、树脂片材、预浸体、碳纤维增强复合材料及酚醛树脂
US12522690B2 (en) 2020-03-23 2026-01-13 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy compound, epoxy resin composition, resin sheet, prepreg, carbon fiber reinforced composite material and phenol resin
JP7869933B1 (ja) * 2024-12-02 2026-06-03 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料
WO2026121174A1 (ja) * 2024-12-02 2026-06-11 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料

Also Published As

Publication number Publication date
JPH0563486B2 (enExample) 1993-09-10

Similar Documents

Publication Publication Date Title
JP2769590B2 (ja) エポキシ樹脂組成物
JPH0340053B2 (enExample)
JP3509236B2 (ja) エポキシ樹脂組成物及び半導体封止材料
JPH0563486B2 (enExample)
JP3915938B2 (ja) エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料
CN102300899A (zh) 环氧树脂组合物、该环氧树脂组合物的制造方法及其固化物
JPH07247409A (ja) エポキシ樹脂組成物、エポキシ樹脂混合物の製造方法及び半導体封止材料
JP3508289B2 (ja) エポキシ樹脂組成物および樹脂封止型半導体装置
JPS6181427A (ja) エポキシ樹脂組成物
EP0536749A1 (en) Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom
JP2572293B2 (ja) エポキシ樹脂硬化剤及び硬化性エポキシ樹脂組成物
JP2002128868A (ja) 半導体封止用エポキシ樹脂組成物
JPS62260820A (ja) 重合用組成物
JP3681020B2 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物及びその硬化物
JPH02235918A (ja) 半導体封止用エポキシ樹脂組成物
JP2010053293A (ja) エポキシ樹脂組成物
JP3235672B2 (ja) 電子部品用エポキシ樹脂組成物
JPH06145306A (ja) エポキシ樹脂組成物
JP3173629B2 (ja) エポキシ樹脂組成物及びその硬化物
JP3464821B2 (ja) エポキシ樹脂硬化剤及びエポキシ樹脂組成物
JPH04282331A (ja) 新規化合物、樹脂、樹脂組成物及び硬化物
JPH10310631A5 (enExample)
JPH07216052A (ja) エポキシ樹脂及びエポキシ樹脂組成物
JPH01104615A (ja) 難燃性エポキシ樹脂組成物
JPH1017642A (ja) エポキシ樹脂混合物、エポキシ樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees