JP7834452B2 - カードエッジ型プリント配線基板 - Google Patents

カードエッジ型プリント配線基板

Info

Publication number
JP7834452B2
JP7834452B2 JP2021181750A JP2021181750A JP7834452B2 JP 7834452 B2 JP7834452 B2 JP 7834452B2 JP 2021181750 A JP2021181750 A JP 2021181750A JP 2021181750 A JP2021181750 A JP 2021181750A JP 7834452 B2 JP7834452 B2 JP 7834452B2
Authority
JP
Japan
Prior art keywords
layer
wear
terminal
edge
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021181750A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023069689A5 (https=
JP2023069689A (ja
Inventor
真也 榎本
紀 西村
孔一 伊藤
大輔 佐分
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tanshi Co Ltd
Original Assignee
Nippon Tanshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Tanshi Co Ltd filed Critical Nippon Tanshi Co Ltd
Priority to JP2021181750A priority Critical patent/JP7834452B2/ja
Priority to US18/708,035 priority patent/US20250393135A1/en
Priority to CN202280073862.XA priority patent/CN118202794A/zh
Priority to PCT/JP2022/027556 priority patent/WO2023079794A1/ja
Publication of JP2023069689A publication Critical patent/JP2023069689A/ja
Publication of JP2023069689A5 publication Critical patent/JP2023069689A5/ja
Application granted granted Critical
Publication of JP7834452B2 publication Critical patent/JP7834452B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2021181750A 2021-11-08 2021-11-08 カードエッジ型プリント配線基板 Active JP7834452B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021181750A JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板
US18/708,035 US20250393135A1 (en) 2021-11-08 2022-07-13 Card edge type printed wiring board
CN202280073862.XA CN118202794A (zh) 2021-11-08 2022-07-13 卡缘型印刷线路板
PCT/JP2022/027556 WO2023079794A1 (ja) 2021-11-08 2022-07-13 カードエッジ型プリント配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021181750A JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板

Publications (3)

Publication Number Publication Date
JP2023069689A JP2023069689A (ja) 2023-05-18
JP2023069689A5 JP2023069689A5 (https=) 2024-10-16
JP7834452B2 true JP7834452B2 (ja) 2026-03-24

Family

ID=86241177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021181750A Active JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板

Country Status (4)

Country Link
US (1) US20250393135A1 (https=)
JP (1) JP7834452B2 (https=)
CN (1) CN118202794A (https=)
WO (1) WO2023079794A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266618A (ja) 2001-07-30 2007-10-11 Seiko Epson Corp 回路基板、及びこれを用いたインクカートリッジ、回路基板用接続装置およびこれを用いたインクジェット式記録装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458872A (en) * 1977-10-20 1979-05-11 Nippon Telegraph & Telephone Metallic core enclosed print plug board
JPS54147667U (https=) * 1978-04-06 1979-10-13
JPH07231153A (ja) * 1994-02-15 1995-08-29 Ibiden Co Ltd カードエッジ基板
JP2000113920A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp モジュール
JP3894774B2 (ja) * 2001-10-31 2007-03-22 富士通株式会社 カードエッジコネクタ及びその製造方法、電子カードならびに電子機器
JP5253016B2 (ja) * 2008-06-30 2013-07-31 キヤノン株式会社 回路基板
JP2018174281A (ja) * 2017-03-31 2018-11-08 ブラザー工業株式会社 回路基板、液体カートリッジ及び記憶装置
US10617000B2 (en) * 2017-12-20 2020-04-07 Intel Corporation Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266618A (ja) 2001-07-30 2007-10-11 Seiko Epson Corp 回路基板、及びこれを用いたインクカートリッジ、回路基板用接続装置およびこれを用いたインクジェット式記録装置

Also Published As

Publication number Publication date
WO2023079794A1 (ja) 2023-05-11
CN118202794A (zh) 2024-06-14
US20250393135A1 (en) 2025-12-25
JP2023069689A (ja) 2023-05-18

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