CN118202794A - 卡缘型印刷线路板 - Google Patents

卡缘型印刷线路板 Download PDF

Info

Publication number
CN118202794A
CN118202794A CN202280073862.XA CN202280073862A CN118202794A CN 118202794 A CN118202794 A CN 118202794A CN 202280073862 A CN202280073862 A CN 202280073862A CN 118202794 A CN118202794 A CN 118202794A
Authority
CN
China
Prior art keywords
layer
edge
terminal portion
wear
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280073862.XA
Other languages
English (en)
Chinese (zh)
Inventor
榎本真也
西村纪
伊藤孔一
佐分大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tanshi Co Ltd
Original Assignee
Nippon Tanshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Tanshi Co Ltd filed Critical Nippon Tanshi Co Ltd
Publication of CN118202794A publication Critical patent/CN118202794A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202280073862.XA 2021-11-08 2022-07-13 卡缘型印刷线路板 Pending CN118202794A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021181750A JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板
JP2021-181750 2021-11-08
PCT/JP2022/027556 WO2023079794A1 (ja) 2021-11-08 2022-07-13 カードエッジ型プリント配線基板

Publications (1)

Publication Number Publication Date
CN118202794A true CN118202794A (zh) 2024-06-14

Family

ID=86241177

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280073862.XA Pending CN118202794A (zh) 2021-11-08 2022-07-13 卡缘型印刷线路板

Country Status (4)

Country Link
US (1) US20250393135A1 (https=)
JP (1) JP7834452B2 (https=)
CN (1) CN118202794A (https=)
WO (1) WO2023079794A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458872A (en) * 1977-10-20 1979-05-11 Nippon Telegraph & Telephone Metallic core enclosed print plug board
JPS54147667U (https=) * 1978-04-06 1979-10-13
JPH07231153A (ja) * 1994-02-15 1995-08-29 Ibiden Co Ltd カードエッジ基板
JP2000113920A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp モジュール
JP2007266618A (ja) 2001-07-30 2007-10-11 Seiko Epson Corp 回路基板、及びこれを用いたインクカートリッジ、回路基板用接続装置およびこれを用いたインクジェット式記録装置
JP3894774B2 (ja) * 2001-10-31 2007-03-22 富士通株式会社 カードエッジコネクタ及びその製造方法、電子カードならびに電子機器
JP5253016B2 (ja) * 2008-06-30 2013-07-31 キヤノン株式会社 回路基板
JP2018174281A (ja) * 2017-03-31 2018-11-08 ブラザー工業株式会社 回路基板、液体カートリッジ及び記憶装置
US10617000B2 (en) * 2017-12-20 2020-04-07 Intel Corporation Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards

Also Published As

Publication number Publication date
WO2023079794A1 (ja) 2023-05-11
JP7834452B2 (ja) 2026-03-24
US20250393135A1 (en) 2025-12-25
JP2023069689A (ja) 2023-05-18

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