JP2021068829A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2021068829A JP2021068829A JP2019193804A JP2019193804A JP2021068829A JP 2021068829 A JP2021068829 A JP 2021068829A JP 2019193804 A JP2019193804 A JP 2019193804A JP 2019193804 A JP2019193804 A JP 2019193804A JP 2021068829 A JP2021068829 A JP 2021068829A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- degrees
- capacitor
- wiring board
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000003780 insertion Methods 0.000 claims abstract description 37
- 230000037431 insertion Effects 0.000 claims abstract description 37
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 23
- 238000000605 extraction Methods 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 67
- 238000000034 method Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
10 基板
20 能動部品
30 受動部品
31 本体
32、33 電極
C1、C2、C3 コンデンサ
CN1、CN2、CN3 コネクタ
Claims (4)
- コネクタ及び積層セラミックコンデンサが基板に実装され、
平面視において、前記コネクタに他のコネクタを挿抜する時に応力が生じる起点となる挿抜位置の中心点をA、前記積層セラミックコンデンサの電極の中心同士を結ぶ第1の線分の中心点をB、前記第1の線分と、前記Aと前記Bとを結ぶ第2の線分とのなす角を前記積層セラミックコンデンサの実装角度(但し、前記実装角度は、0度以上90度以下である)としたときに、
少なくとも前記コネクタの周囲10mm以内の範囲では、前記積層セラミックコンデンサは、実装角度が0度から5度の間、又は、85度から90度の間の範囲のみに配置されている配線基板。 - 前記挿抜位置は、コネクタ長手方向に対し、両端及び/又は中心部である請求項1に記載の配線基板。
- 前記基板は樹脂基板である請求項1又は2に記載の配線基板。
- 前記樹脂基板はガラスエポキシ基板又は紙フェノール基板である請求項3に記載の配線基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019193804A JP7419747B2 (ja) | 2019-10-24 | 2019-10-24 | 配線基板 |
US16/936,487 US10881003B1 (en) | 2019-10-24 | 2020-07-23 | Wiring board |
EP20194506.0A EP3813498A1 (en) | 2019-10-24 | 2020-09-04 | Wiring board |
CN202011090070.2A CN112714545A (zh) | 2019-10-24 | 2020-10-13 | 布线电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019193804A JP7419747B2 (ja) | 2019-10-24 | 2019-10-24 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021068829A true JP2021068829A (ja) | 2021-04-30 |
JP7419747B2 JP7419747B2 (ja) | 2024-01-23 |
Family
ID=72380934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019193804A Active JP7419747B2 (ja) | 2019-10-24 | 2019-10-24 | 配線基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10881003B1 (ja) |
EP (1) | EP3813498A1 (ja) |
JP (1) | JP7419747B2 (ja) |
CN (1) | CN112714545A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021136406A (ja) * | 2020-02-28 | 2021-09-13 | 三菱電機株式会社 | 回路基板および回路基板の設計方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08242047A (ja) * | 1995-03-06 | 1996-09-17 | Oki Electric Ind Co Ltd | プリント配線板 |
US6541711B1 (en) * | 2000-05-22 | 2003-04-01 | Cisco Technology, Inc. | Isolated ground circuit board apparatus |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3002467U (ja) * | 1994-01-05 | 1994-09-27 | 茂 海老原 | 放電管点灯電源の構造 |
US5530622A (en) * | 1994-12-23 | 1996-06-25 | National Semiconductor Corporation | Electronic assembly for connecting to an electronic system and method of manufacture thereof |
EP1110277B1 (de) * | 1998-09-10 | 2002-06-12 | Siemens Aktiengesellschaft | Leiterplattenanordnung mit mehrpoligem steckverbinder |
JP4468597B2 (ja) | 2001-01-29 | 2010-05-26 | オリンパス株式会社 | 電気機器 |
US6862184B2 (en) * | 2002-06-27 | 2005-03-01 | Intel Corporation | High performance microprocessor power delivery solution using flex connections |
JP4860990B2 (ja) * | 2005-11-29 | 2012-01-25 | キヤノン株式会社 | 回路接続構造およびプリント回路板 |
US7367849B2 (en) * | 2006-03-07 | 2008-05-06 | Surtec Industries, Inc. | Electrical connector with shortened contact and crosstalk compensation |
JP4834484B2 (ja) * | 2006-08-08 | 2011-12-14 | 矢崎総業株式会社 | プリント配線基板 |
JP2009218437A (ja) | 2008-03-11 | 2009-09-24 | Toyota Motor Corp | 配線板 |
US8273996B2 (en) * | 2009-07-23 | 2012-09-25 | Lexmark International, Inc. | Z-directed connector components for printed circuit boards |
US8198548B2 (en) * | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed capacitor components for printed circuit boards |
JP5672277B2 (ja) * | 2012-08-29 | 2015-02-18 | 株式会社デンソー | 電子装置 |
US9627784B1 (en) * | 2015-12-01 | 2017-04-18 | International Business Machines Corporation | Method and apparatus for strain relieving surface mount attached connectors |
KR20190072992A (ko) * | 2017-12-18 | 2019-06-26 | 엘지디스플레이 주식회사 | 인쇄회로기판 및 표시장치 |
-
2019
- 2019-10-24 JP JP2019193804A patent/JP7419747B2/ja active Active
-
2020
- 2020-07-23 US US16/936,487 patent/US10881003B1/en active Active
- 2020-09-04 EP EP20194506.0A patent/EP3813498A1/en not_active Withdrawn
- 2020-10-13 CN CN202011090070.2A patent/CN112714545A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08242047A (ja) * | 1995-03-06 | 1996-09-17 | Oki Electric Ind Co Ltd | プリント配線板 |
US6541711B1 (en) * | 2000-05-22 | 2003-04-01 | Cisco Technology, Inc. | Isolated ground circuit board apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021136406A (ja) * | 2020-02-28 | 2021-09-13 | 三菱電機株式会社 | 回路基板および回路基板の設計方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112714545A (zh) | 2021-04-27 |
US10881003B1 (en) | 2020-12-29 |
JP7419747B2 (ja) | 2024-01-23 |
EP3813498A1 (en) | 2021-04-28 |
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