JP2023069689A5 - - Google Patents

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Publication number
JP2023069689A5
JP2023069689A5 JP2021181750A JP2021181750A JP2023069689A5 JP 2023069689 A5 JP2023069689 A5 JP 2023069689A5 JP 2021181750 A JP2021181750 A JP 2021181750A JP 2021181750 A JP2021181750 A JP 2021181750A JP 2023069689 A5 JP2023069689 A5 JP 2023069689A5
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JP
Japan
Prior art keywords
layer
wiring board
printed wiring
terminal portion
type printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021181750A
Other languages
English (en)
Japanese (ja)
Other versions
JP7834452B2 (ja
JP2023069689A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021181750A priority Critical patent/JP7834452B2/ja
Priority claimed from JP2021181750A external-priority patent/JP7834452B2/ja
Priority to US18/708,035 priority patent/US20250393135A1/en
Priority to CN202280073862.XA priority patent/CN118202794A/zh
Priority to PCT/JP2022/027556 priority patent/WO2023079794A1/ja
Publication of JP2023069689A publication Critical patent/JP2023069689A/ja
Publication of JP2023069689A5 publication Critical patent/JP2023069689A5/ja
Application granted granted Critical
Publication of JP7834452B2 publication Critical patent/JP7834452B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021181750A 2021-11-08 2021-11-08 カードエッジ型プリント配線基板 Active JP7834452B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021181750A JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板
US18/708,035 US20250393135A1 (en) 2021-11-08 2022-07-13 Card edge type printed wiring board
CN202280073862.XA CN118202794A (zh) 2021-11-08 2022-07-13 卡缘型印刷线路板
PCT/JP2022/027556 WO2023079794A1 (ja) 2021-11-08 2022-07-13 カードエッジ型プリント配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021181750A JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板

Publications (3)

Publication Number Publication Date
JP2023069689A JP2023069689A (ja) 2023-05-18
JP2023069689A5 true JP2023069689A5 (https=) 2024-10-16
JP7834452B2 JP7834452B2 (ja) 2026-03-24

Family

ID=86241177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021181750A Active JP7834452B2 (ja) 2021-11-08 2021-11-08 カードエッジ型プリント配線基板

Country Status (4)

Country Link
US (1) US20250393135A1 (https=)
JP (1) JP7834452B2 (https=)
CN (1) CN118202794A (https=)
WO (1) WO2023079794A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458872A (en) * 1977-10-20 1979-05-11 Nippon Telegraph & Telephone Metallic core enclosed print plug board
JPS54147667U (https=) * 1978-04-06 1979-10-13
JPH07231153A (ja) * 1994-02-15 1995-08-29 Ibiden Co Ltd カードエッジ基板
JP2000113920A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp モジュール
JP2007266618A (ja) 2001-07-30 2007-10-11 Seiko Epson Corp 回路基板、及びこれを用いたインクカートリッジ、回路基板用接続装置およびこれを用いたインクジェット式記録装置
JP3894774B2 (ja) * 2001-10-31 2007-03-22 富士通株式会社 カードエッジコネクタ及びその製造方法、電子カードならびに電子機器
JP5253016B2 (ja) * 2008-06-30 2013-07-31 キヤノン株式会社 回路基板
JP2018174281A (ja) * 2017-03-31 2018-11-08 ブラザー工業株式会社 回路基板、液体カートリッジ及び記憶装置
US10617000B2 (en) * 2017-12-20 2020-04-07 Intel Corporation Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards

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