JP7825476B2 - 基板処理システム - Google Patents

基板処理システム

Info

Publication number
JP7825476B2
JP7825476B2 JP2022044900A JP2022044900A JP7825476B2 JP 7825476 B2 JP7825476 B2 JP 7825476B2 JP 2022044900 A JP2022044900 A JP 2022044900A JP 2022044900 A JP2022044900 A JP 2022044900A JP 7825476 B2 JP7825476 B2 JP 7825476B2
Authority
JP
Japan
Prior art keywords
substrate
chamber
module
tiles
processing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022044900A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023139392A5 (https=
JP2023139392A (ja
Inventor
東偉 李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2022044900A priority Critical patent/JP7825476B2/ja
Priority to KR1020230030871A priority patent/KR102867756B1/ko
Priority to US18/120,195 priority patent/US12438025B2/en
Priority to CN202310241262.6A priority patent/CN116798909A/zh
Publication of JP2023139392A publication Critical patent/JP2023139392A/ja
Publication of JP2023139392A5 publication Critical patent/JP2023139392A5/ja
Priority to US19/304,971 priority patent/US20250372427A1/en
Priority to KR1020250139972A priority patent/KR20250150507A/ko
Priority to JP2026016791A priority patent/JP2026063525A/ja
Application granted granted Critical
Publication of JP7825476B2 publication Critical patent/JP7825476B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/20—Electromagnets; Actuators including electromagnets without armatures
    • H01F7/206—Electromagnets for lifting, handling or transporting of magnetic pieces or material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2022044900A 2022-03-22 2022-03-22 基板処理システム Active JP7825476B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2022044900A JP7825476B2 (ja) 2022-03-22 2022-03-22 基板処理システム
KR1020230030871A KR102867756B1 (ko) 2022-03-22 2023-03-09 기판 처리 시스템
US18/120,195 US12438025B2 (en) 2022-03-22 2023-03-10 Substrate processing system
CN202310241262.6A CN116798909A (zh) 2022-03-22 2023-03-14 基板处理系统
US19/304,971 US20250372427A1 (en) 2022-03-22 2025-08-20 Substrate Processing System
KR1020250139972A KR20250150507A (ko) 2022-03-22 2025-09-26 기판 처리 시스템
JP2026016791A JP2026063525A (ja) 2022-03-22 2026-02-04 システムおよび基板処理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022044900A JP7825476B2 (ja) 2022-03-22 2022-03-22 基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026016791A Division JP2026063525A (ja) 2022-03-22 2026-02-04 システムおよび基板処理システム

Publications (3)

Publication Number Publication Date
JP2023139392A JP2023139392A (ja) 2023-10-04
JP2023139392A5 JP2023139392A5 (https=) 2025-01-07
JP7825476B2 true JP7825476B2 (ja) 2026-03-06

Family

ID=88045767

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022044900A Active JP7825476B2 (ja) 2022-03-22 2022-03-22 基板処理システム
JP2026016791A Pending JP2026063525A (ja) 2022-03-22 2026-02-04 システムおよび基板処理システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2026016791A Pending JP2026063525A (ja) 2022-03-22 2026-02-04 システムおよび基板処理システム

Country Status (4)

Country Link
US (2) US12438025B2 (https=)
JP (2) JP7825476B2 (https=)
KR (2) KR102867756B1 (https=)
CN (1) CN116798909A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433159B2 (ja) * 2020-07-30 2024-02-19 東京エレクトロン株式会社 真空搬送装置、基板処理システム、および基板処理方法
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
WO2026070572A1 (ja) * 2024-09-27 2026-04-02 東京エレクトロン株式会社 基板処理システム、および搬送方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098354A (ja) 2011-11-01 2013-05-20 Nikon Corp 移動体装置及び露光装置
JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備
JP2021086987A (ja) 2019-11-29 2021-06-03 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP2022025913A (ja) 2020-07-30 2022-02-10 東京エレクトロン株式会社 真空搬送装置、基板処理システム、および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07117849A (ja) * 1993-10-22 1995-05-09 Ebara Corp 磁気浮上搬送装置
DE102014106400A1 (de) * 2014-04-25 2015-11-12 Weber Maschinenbau Gmbh Breidenbach Individueller transport von lebensmittelportionen
JP7370233B2 (ja) 2019-11-29 2023-10-27 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP7608898B2 (ja) * 2021-03-16 2025-01-07 東京エレクトロン株式会社 基板を処理する装置及び基板を搬送する方法
JP7743708B2 (ja) * 2021-03-30 2025-09-25 東京エレクトロン株式会社 基板を搬送する装置、基板を処理するシステム及び基板の搬送を行う方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098354A (ja) 2011-11-01 2013-05-20 Nikon Corp 移動体装置及び露光装置
JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備
JP2021086987A (ja) 2019-11-29 2021-06-03 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP2022025913A (ja) 2020-07-30 2022-02-10 東京エレクトロン株式会社 真空搬送装置、基板処理システム、および基板処理方法

Also Published As

Publication number Publication date
KR20230137827A (ko) 2023-10-05
JP2026063525A (ja) 2026-04-10
KR102867756B1 (ko) 2025-10-01
KR20250150507A (ko) 2025-10-20
CN116798909A (zh) 2023-09-22
US20250372427A1 (en) 2025-12-04
US12438025B2 (en) 2025-10-07
US20230307278A1 (en) 2023-09-28
JP2023139392A (ja) 2023-10-04

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