CN112840447A - 运输系统 - Google Patents
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- CN112840447A CN112840447A CN201980067458.XA CN201980067458A CN112840447A CN 112840447 A CN112840447 A CN 112840447A CN 201980067458 A CN201980067458 A CN 201980067458A CN 112840447 A CN112840447 A CN 112840447A
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Abstract
本文的实施方式涉及运输系统和基板处理及传送(SPT)系统。SPT系统包含连接两个处理工具的运输系统。运输系统包含真空隧道,真空隧道被配置为在处理工具之间运输基板。真空隧道包含基板运输载具,以移动基板通过真空隧道。SPT系统具有多种配置以允许用户根据期望的基板处理程序所需的处理腔室来增加或移除处理腔室。
Description
技术领域
本申请一般涉及设备,且更特定地涉及运输系统。
背景技术
制造半导体装置通常涉及对例如硅基板、玻璃板等的基板或晶片实行一系列程序。这些步骤可包含抛光、沉积、蚀刻、光刻、热处理等。通常,可在包含多个处理腔室的单一处理系统或工具中实行多个不同的处理步骤。然而,通常情况是在制造设施内的其他处理位置处实行其他处理,且据此有必要在制造设施内将基板从一个处理位置运输至另一处理位置。取决于要制造的半导体装置的类型,在制造设施内的许多不同处理位置处可能要实行相对大量的处理步骤。
传统上是在例如密封盒、匣、容器等基板载体内将基板从一个处理位置运输至另一处理位置。传统上也包含自动基板载体运输装置,例如自动引导车辆、高架运输系统、基板载体搬运机器人等,以在制造设施内将基板载体从一个位置移动至另一位置,或从基板载体运输装置传送基板载体或将基板载体传送至基板载体运输装置。
基板的该运输通常涉及将基板暴露于室内空气或至少暴露于非真空条件。任一种都可使基板暴露于不期望的环境(例如,氧化性物质)和/或污染物中。
因此,需要用于在处理工具之间传送基板的改进的传送系统。
发明内容
本文公开的实施方式包含传输系统及基板处理及运输(SPT)系统。运输和SPT系统包含真空隧道、载具、和其他特征以帮助保护基板免受不期望环境的影响。
在一个实施方式中,提供了一种运输系统,包含:真空隧道,该真空隧道被配置为与第一处理工具及第二处理工具交界。该真空隧道包含:扩大区域;基板运输载具和设置于该扩大区域中的旋转台。该旋转台被配置为在约0度及约180度之间旋转该基板运输载具。该基板运输载具包含:载具主体;和末端执行器,该末端执行器耦接至该载具主体。该末端执行器被配置为在运输期间在该真空隧道内支撑基板。该末端执行器被配置为延伸进入该第一处理工具或该第二处理工具以取出或放置基板,同时该载具主体保持于该真空隧道内。
在另一实施方式中,提供了一种基板处理及运输(SPT)系统,包含:第一处理工具及第二处理工具,每一处理工具包含:传送腔室,该传送腔室被配置为耦接至一个或多个处理腔室;装载锁定腔室,该装载锁定腔室具有第一进出开口,该第一进出开口被配置为从设备前端模块接收基板;第二进出开口,该第二进出开口被配置为传送基板进出该第一处理工具的该传送腔室;和第三进出开口;和真空隧道,该真空隧道在该第一处理工具的该第三进出开口与该第二处理工具的该第三进出开口之间耦接。该真空隧道包含基板运输载具。该基板支撑载具包含:载具主体;和末端执行器,该末端执行器耦接至该载具主体。该末端执行器被配置为在运输期间在该真空隧道内支撑该基板,且被配置为使用该第一处理工具及该第二处理工具的每一者的该第三进出开口来延伸进入该第一处理工具及该第二处理工具的所述装载锁定腔室。
而在另一实施方式中,提供了一种运输系统,包含:真空隧道,该真空隧道被配置为在第一处理工具及第二处理工具之间延伸,该真空隧道包含基板运输载具;第一升降器单元,第一升降器单元置于该第一处理工具附近,以便允许该基板运输载具在该第一处理工具与该真空隧道之间的运输;第二升降器单元,该第二升降器单元置于该第二处理工具附近,以便允许该基板运输载具在该第一处理工具与该真空隧道之间的运输;和紧急制动系统,该紧急制动系统被配置为防止该第一升降器单元及该第二升降器单元内的基板运输载具系统在电力损耗期间掉落。该真空隧道置于该第一处理工具及该第二处理工具上方。
附图说明
为了可详细理解本公开内容的上述特征的方式,可通过参考实施方式来对本公开内容进行更特定的描述(在上面简要地概述),其中一些图示于附图中。然而,应注意,附图仅图示了本公开内容的示例性实施方式,且因此不应被认为是对其范围的限制,因为本公开内容可应用至其他等效实施方式。
图1A至1E图示了根据一个实施方式的运输系统的顶部示意图。
图2图示了根据一个实施方式的基板处理及运输(SPT)系统的顶部示意图。
图3图示了根据一个实施方式的装载锁定腔室。
图4A图示了根据一个实施方式的运输系统的示意正视图。
图4B图示了根据一个实施方式的运输系统的示意侧视图。
图4C图示了根据一个实施方式的运输系统的示意正视图。
图4D图示了根据一个实施方式的运输系统的示意侧视图。
图4E图示了根据一个实施方式的磁悬浮系统的侧视图。
图5A图示了根据一个实施方式的升降器单元的立面侧视图。
图5B图示了根据一个实施方式的升降器单元的立面顶部视图。
图5C和5D图示了根据一个实施方式的突片的放大视图。
图6图示了根据一个实施方式的SPT系统的顶部示意图。
图7图示了根据一个实施方式的SPT系统的顶部示意图。
图8图示了根据一个实施方式的SPT系统的顶部示意图。
图9图示了根据一个实施方式的SPT系统的顶部示意图。
图10图示了根据一个实施方式的SPT系统的顶部示意图。
为了便于理解,尽可能使用相同的附图标记来表示附图中共有的相同元件。可以预期的是,一个实施方式的元件和特征可被有益地并入其他实施方式中,而无需进一步叙述。
具体实施方式
根据本文所述的实施方式,一个或多个处理工具经由一个或多个真空隧道耦接在一起。该系统允许基板在真空下被运输至多个处理工具的各个腔室位置,且有效地增加了可用的高真空或清洁腔室位置(例如,小面)的数量。这样的处理工具通常将用作彼此独立操作的分开的、独立运作的处理工具。
在一些实施方式中,使用真空隧道在第一处理工具的装载锁定腔室与第二处理工具的装载锁定腔室之间传送基板。例如,在与处理工具相同的高度水平处或在不同的高度处(例如,处理工具上方)实行基板传送。在一些实施方式中,当在处理工具之间运输基板时,真空隧道允许对基板实行计量和/或检查。在一个或多个实施方式中,磁悬浮(maglev)被用于在处理工具之间的真空隧道内运输基板。
如本文所使用,术语“约”是指与标称值变化+/-10%。应理解,该变化可包含于本文提供的任何值中。
图1A至1E图示了根据一个实施方式的运输系统100的顶部示意图。运输系统100被配置为在多个处理工具之间运输基板。如图所示,运输系统100包含真空隧道102。真空隧道102被配置为在第一处理工具104a与第二处理工具104b之间延伸。处理工具104a、104b可为任何合适的处理工具,例如可从加利福尼亚州圣克拉拉市的应用材料公司取得的Endura 2主机、也可从应用材料公司获得的Centura ACP主机等。可使用其他处理工具和/或主机。
处理工具104a、104b可包含耦接至传送腔室的处理腔室、设备前端模块、装载锁定腔室、预处理腔室和/或类似物(下文进一步描述)。示例性处理腔室包含沉积腔室(例如,物理气相沉积、化学气相沉积、等离子体增强化学气相沉积等)、蚀刻腔室、脱气腔室和/或任何其他类型的处理腔室。任何数量的处理腔室可实行相同或不同的处理。
一般而言,真空隧道102可耦接至设备前端模块、装载锁定腔室、传送腔室、处理腔室或处理工具的其他位置。尽管可使用其他真空水平,真空隧道102的范例真空水平在约10-10Torr至约760Torr的范围。
如图所示,真空隧道102包含具有载具主体108的基板运输载具106和耦接至载具主体108的末端执行器110。末端执行器110被配置为在运输期间在真空隧道102内支撑基板112。末端执行器110被配置为将基板延伸进入第一处理工具104a或第二处理工具104b,以取出(extract)或放置基板112,同时载具主体108完全或部分保持在真空隧道102内。例如,末端执行器110具有足够长度以延伸进入装载锁定腔室、处理腔室、传送腔室或处理工具104a、104b内的其他位置,以接收或放置基板,同时基板运输载具106的其余部分仍保持在真空隧道102中。在一些实施方式中,基板运输载具106被升高或降低以便于基板传送至处理工具104a或104b或从处理工具104a或104b取出(例如,经由z轴马达,增加的磁悬浮系统的磁场强度等)。在其他实施方式中,在基板拾取和/或放置操作期间,基板运输载具106依赖于在处理工具104a和/或104b内的升降销、机器人等来提供z轴运动。
在一些实施方式中,真空隧道102包含具有旋转台116的扩大区域114,旋转台116被配置为在所需的角度范围(例如,在一些实施方式中为0度和180度)之间旋转基板运输载具106。这允许了末端执行器110旋转以面对处理工具104a或处理工具104b。图1A至1E图示了在基板112从处理工具104a传送至处理工具104b期间基板运输载具106、末端执行器110和基板112的范例运动。
在一些实施方式中,运输系统100包含相关于真空隧道102放置的计量或检查工具118,以便允许对放置于末端执行器110上的基板112进行计量或检查,同时通过旋转台116来旋转基板运输载具106。例如,计量工具118被配置为测量膜厚度、膜均匀性、基板缺陷水平、实行边缘检查等。在其他实施方式中,计量工具118被配置为用于刻痕查找、基板重新对准等。可使用其他计量和/或检查工具。而在其他实施方式中,计量工具118或另一工具使用于真空隧道102的扩大区域114内的其他工艺,例如基板脱气、基板冷却、预清洁等操作。
在一些实施方式中,运输系统100包含磁悬浮系统120,磁悬浮系统120被配置为悬浮基板运输载具106且在第一处理工具104a与第二处理工具104b之间移动基板运输载具106。例如,基板运输载具106包含被驱动机构所使用的永久和/或其他磁体排斥的多个永久和/或其他磁体,该驱动机构在一些实施方式中位于真空隧道102外部。电磁体可被配置为便于控制基板运输载具106的移动和/或定位。控制器122(例如一个或多个微控制器、可编程逻辑控制器、专用硬件和/或软件等)可被配置为控制计量工具118、磁悬浮系统120、真空隧道102等的一个或多个操作。
在操作中,通过将末端执行器110从真空隧道102延伸进入处理工具104a,基板运输载具106可被配置为从第一处理工具104a取回(retrieve)基板112。例如,末端执行器110延伸进入处理工具104a的装载锁定腔室、传送腔室、处理腔室等,以取回基板112(例如,在基板运输载具106提供或不提供z方向运动的情况下)。此后,基板运输载具106朝向处理工具104b行进,在扩大区域114内旋转适当的量,使得末端执行器110经定向以延伸进入处理工具104b。基板运输载具106旋转大约180度,使得末端执行器110面对处理工具104b。在其他实施方式中,其中处理工具104a、104b不沿着直线放置,可使用其他旋转角度(例如45度、90度等)。
在基板运输载具106旋转期间,计量工具118可对基板112实行一个或多个计量、检查或其他测量。另外地或可替代地,在扩大区域114内实行其他工艺(例如,脱气、预清洁、冷却等)。
一旦末端执行器110面对处理工具104b,基板运输载具106可行进以将基板112放置在处理工具104b中。例如,末端执行器110延伸进入处理工具104b的装载锁定腔室、传送腔室、处理腔室等以将基板112放置在其中(例如,在基板运输载具106提供或不提供z方向运动的情况下)。
图2图示了根据一个实施方式的基板处理及运输(SPT)系统200的顶部示意图。如图所示,SPT系统200包含两个处理工具202a、202b。例如,处理工具202a、202b为可从应用材料公司取得的Endura 2系统,或另一种合适的处理工具(例如,单或双传送腔室处理工具)。SPT系统200被配置为在两个处理工具202a、202b之间移动基板。
如图所示,处理工具202a包含耦接至传送腔室208a和208b的处理腔室206a至g,以及在传送腔室208a和设备前端模块(EFEM)212之间耦接的装载锁定腔室210a、210b。如图所示,处理工具202b包含耦接至传送腔室214a和214b的处理腔室202h至n,以及在传送腔室214a和EFEM 218之间耦接的装载锁定腔室216a、216b。在一些实施方式中,处理工具202a和/或202b各自包含脱气和/或预清洁腔室220a、220b。可使用其他数量和/或类型的腔室。处理工具202a、202b被配置为使基板绕着处理工具的各个腔室移动,从而允许在每一个别处理腔室中处理基板。
处理腔室206a至n可为任何类型的处理腔室,例如沉积腔室(例如,物理气相沉积、化学气相沉积、等离子体增强化学气相沉积等)、蚀刻腔室、脱气腔室和/或任何其他类型的处理腔室。任何数量的处理腔室206a至n可实行相同或不同的处理。
处理工具202a、202b经由真空隧道102耦接。例如,真空隧道102将处理工具202a的装载锁定腔室210b耦接至处理工具202b的装载锁定腔室216b。在一些实施方式中,装载锁定腔室210b具有第一进出(access)开口、第二进出开口和第三进出开口,该第一进出开口被配置为从EFEM 212接收基板或将基板供应至EFEM 212,该第二进出开口被配置为向第一处理工具202a的传送腔室208a传送基板或从第一处理工具202a的传送腔室208a传送基板,该第三进出开口耦接至真空隧道102。同样地,装载锁定腔室216b具有第一进出开口、第二进出开口和第三进出开口,该第一进出开口被配置为从EFEM 218接收基板或将基板供应至EFEM 218,该第二进出开口被配置为向第二处理工具202b的传送腔室214a传送基板或从第二处理工具202b的传送腔室214a传送基板,该第三进出开口耦接至真空隧道102。
图3图示了根据一个实施方式的装载锁定腔室300。装载锁定腔室300可用于图2的装载锁定腔室210b或216b。装载锁定腔室300被配置为从处理工具202a、202b接收基板。如图所示,装载锁定腔室300包含第一进出开口302、第二进出开口304和第三进出开口306,第一进出开口302被配置为从EFEM(例如,212)接收基板和/或将基板供应至EFEM,第二进出开口304被配置为向传送腔室(例如,208a)传送基板和/或从传送腔室传送基板,第三进出开口306被配置为耦接至真空隧道102。
回到图2,真空隧道102可包含扩大区域114,扩大区域114包含旋转台116。旋转台116被配置为使基板运输载具106在约0度及约180度之间旋转。这允许末端执行器110旋转以便面对处理工具202a或处理工具202b。
在一些实施方式中,相对于真空隧道102放置计量工具118,以便允许对放置于末端执行器110上的基板进行计量和/或检查,同时基板运输载具106位于扩大区域114中和/或由旋转台116旋转。范例的计量工具118包含测量膜厚度、膜均匀性、基板缺陷水平、边缘特性等的工具,以及刻痕查找器、基板对准器和/或重新定向器等,以在基板在处理工具202a、202b之间通过时,决定和/或调整基板的对准/定向。真空隧道102可在与处理工具202a、202b相同的高度处或在不同高度处在处理工具202a、202b之间传送基板。
图4A图示了根据一个实施方式的运输系统400的示意正视图。图4B图示了根据一个实施方式的运输系统400的示意侧视图。放置真空隧道102于处理工具202a、202b上方。升降器单元402a可被配置为在处理工具202a和真空隧道102之间传送基板运输载具106。相似地,升降器单元402b可被包含以在处理工具202b和真空隧道102之间传送基板运输载具106。升降器单元402a、402b可包含机械的、磁悬浮的或其他升降机构。如图所示,方向改变模块404a、404b可被配置为将基板运输载具106的方向从沿着y轴(垂直)改变为沿着x轴(水平),和/或反之亦然(例如,使用合适的传送或移交操作)。在一些实施方式中,升降器单元402a、402b和/或方向改变模块404a、404b被维持在与真空隧道102相似的真空水平。
图4C图示了根据一个实施方式的运输系统401的示意正视图。图4D图示了根据一个实施方式的运输系统401的示意侧视图。运输系统401包含在不同高度处的堆叠的真空隧道102a、102b。运输系统401包含在升降器单元402a、402b的其中一者内的计量工具118。展示了许多额外的方向改变模块404a至e。这样的升高的真空隧道102a和/或102b可被包含在本文描述的任何运输系统内。例如,在一些实施方式中,装载锁定腔室300(图3)包含进出开口以允许从装载锁定腔室300的顶部进出基板。可包含额外的堆叠和/或升高的真空隧道(例如,3、4、5个真空隧道等)。
回到图4A,置于第一处理工具202a附近的升降器单元402a允许在第一处理工具202a与真空隧道102之间运输基板运输载具106。置于第二处理工具202b附近的升降器单元402b允许在第二处理工具202b和真空隧道102之间运输基板运输载具106。在图4C和4D中,将额外的真空隧道102b置于处理工具上方,且可由第一升降器单元402a和第二升降器单元402b进出。基板运输载具106也可被配置为支撑一个以上的基板。
图4E图示了根据一个实施方式的磁悬浮系统120的侧视图。如图所示,磁悬浮系统120包含被动动子424,被动动子424包含上端执行器466和下端执行器468。尽管两个末端执行器允许快速地从装载锁定或其他腔室取回基板及在装载锁定或其他腔室中放置另一基板,可包含更少或更多的末端执行器。在一些实施方式中,多个永久和/或其他磁体460位于下端执行器468中。磁体460被位于架板472中的磁体462排斥。例如,架板472被附接至或位于相对于水平磁悬浮轨道464的固定位置中。水平磁悬浮轨道464可包含驱动线圈和位置传感器(未图示),以经由磁力移动被动动子424。在一些实施方式中,水平磁悬浮轨道464(和/或驱动线圈和/或位置传感器)位于真空区域外部,该真空区域含有被动动子424和末端执行器466、468。例如,轨道464位于大气环境中。
架板472包含顶部表面474,在一些实施方式中,顶部表面474以小于90度的角度与水平磁悬浮轨道464相交,或平行于以小于90度的角度与水平磁悬浮轨道464相交的平面。下端执行器468具有可平行于架板472的顶部表面474的下表面476。
在操作中,被动动子424通过磁体460、462维持在远离架板472的垂直位置中。无论是否向磁悬浮系统120供电,都可维持该垂直位置。在被动动子424和水平磁悬浮轨道464中的磁体(未图示)维持水平磁悬浮轨道464和被动动子424之间的间隙480。在功率损失的情况下,水平磁悬浮轨道464不能在水平磁悬浮轨道464和被动动子424之间维持间隙480。随后,顶部表面474和下表面476的斜率迫使被动动子424朝向水平磁悬浮轨道464至被动动子424接触水平磁悬浮轨道464处,并通过摩擦防止移动(例如,水平移动)。被动动子424保持由磁力垂直地支撑。
在一些实施方式中,只要维持间隙480以保持被动动子424在水平磁悬浮轨道464上不受约束,水平磁悬浮轨道464是弯曲的。
当具有末端执行器466、468的被动动子424由永久磁场支撑时,可由磁悬浮分离板(未图示)后面的线圈(未图示)沿着水平磁悬浮轨道464水平驱动被动动子424。这些线圈不限定被动动子的垂直位置,而仅维持轨道464和被动动子424之间的间隙480,且沿着轨道464水平地推动被动动子424。这可允许水平磁悬浮轨道464非常简单,且使用更少的功率,因为减低了或没有接触、摩擦和与重力的对抗。
回到图4A,在一些实施方式中,升降器单元402a、402b包含紧急制动系统406a、406b,被配置为防止在第一升降器单元402a或第二升降器单元402b内的基板运输载具在电力损耗期间掉落。紧急制动系统406a、406b可用作备用或代替标准的不间断电源。
图5A图示了根据一个实施方式的升降器单元402b的立面侧视图。图5B图示了根据一个实施方式的升降器单元402b的立面顶部视图。第二升降器单元402b被展示为处于解锁状态。如图所示,第二升降器单元402b包含线性马达520,被配置为升高和降低耦接至基板运输载具106的被动动子424。在一些实施方式中,被动动子424是其中没有任何电子装置的被动装置。如果线性马达520失灵,紧急制动系统406b可防止被动动子424自由下落。第一升降器单元402a可具有相似的锁定和解锁状态。
紧急制动系统406b可包含位于线性马达520上的摩擦表面522,或摩擦表面522可位于线性马达520附近。条带526可延伸第二升降器单元402b的长度且可被配置为由电磁体528磁化。例如,响应于电磁体528被通电,条带526的外表面被极化。例如,当电磁体528被通电时,条带526的外表面极化成南。可使用相反的极性。
图5C和5D图示了根据一个实施方式的突片530的放大视图。突片530被包含在制动系统406b中。突片530可绕着枢转点532相对于被动动子424枢转。突片530可绕着枢转点532在逆时针方向534上偏置(例如,经由弹簧或其他张紧装置,未图示)。据此,突片530的下部朝着摩擦表面522偏置。突片530可包含永久磁体538,永久磁体538具有面对条带526的磁极,该磁极的极性与当条带被电磁体528磁化时条带526的极性相同。
尽管在图5B中图示了两个紧急制动系统406b,每一者位于被动动子424的每一侧上,应理解,可使用更少或更多的紧急制动系统。
在操作中,可从操作线性马达520的源向电磁体528通电。通电的电磁体528使条带526磁化,从而排斥磁体538并迫使突片530相对于方向534枢转,如图5D中所图示。在该配置中,第二升降器单元402b处于解锁状态,且基板运输载具106可自由地升高或降低。当功率损失至线性马达520时,电磁体528不能使条带526磁化,因此突片530逆时针旋转进入摩擦表面522,如图5C中所图示。突片530与摩擦表面522的接触锁定了第二升降器单元402b并防止被动动子424掉落。当突片530接触摩擦表面522时,支架540可防止被动动子424掉落或移动远离线性马达520。
图6图示了根据一个实施方式的SPT系统60的顶部示意图。SPT系统600相似于SPT系统200,但SPT系统600包含带有处理工具202a的双装载锁定腔室602a。另外,真空隧道102不包含扩大区域或旋转台。双装载锁定腔室602a的尺寸被设置成允许基板运输载具106延伸进入双装载锁定腔室602a,使得传送腔室208a内的机器人可从基板运输载具106取回基板(或将基板放置于该机器人上)。例如,双装载锁定腔室602a的内部区域具有足够的空间,以允许基板运输载具106在其中行进一足够距离,以使从基板运输载具106中取回基板。在一些实施方式中,装载锁定腔室602a包含用于允许基板运输载具106在其中移动的机构(例如,磁悬浮轨道或其他移动机构)。以此方式,当在处理工具202a和202b之间运输基板时不采用旋转。在一些实施方式中,双装载锁定腔室602b相似地被配置为双装载锁定腔室602a,尽管单一装载锁定腔室可与处理工具202b一起使用。
图7图示了根据一个实施方式的SPT系统700的顶部示意图。SPT系统700相似于SPT系统200,但在SPT系统700中,移动EFEM 212以提供对装载锁定腔室210b的进出,且移动EFEM 218以提供对装载锁定腔室216b的进出。以此方式,真空隧道102在装载锁定腔室210b的前进出开口与装载锁定腔室216b的前进出开口之间延伸。在一些实施方式中,提供了两个旋转台702a和702b,以允许基板运输载具106经定向以用于从装载锁定腔室210b或装载锁定腔室216b放置或取回基板(如虚线所图示)。该配置为采用处理工具202a和202b的额外的小面F1和F2个别提供了足够的空间。额外的小面F1、F2允许处理工具202a、202b容纳额外的处理腔室。
图8图示了根据一个实施方式的SPT系统800的顶部示意图。SPT系统800相似于SPT系统700,但在SPT系统700中,移除了装载锁定腔室210b和201b(例如,以提供更紧密的布局)。相反地,SPT系统800的每一处理工具202a、202b仅包含单一装载锁定腔室210a、210b。真空隧道102直接与传送腔室208a、208b交界。
图9图示了根据一个实施方式的SPT系统900的顶部示意图。SPT系统900相似于SPT系统800,但SPT系统900包含在真空隧道102内的弯曲路径。由于真空隧道102是弯曲的,当在处理工具202a和202b之间实行基板传送时,使用单一旋转台902来重新定向基板运输载具106。
图10图示了根据一个实施方式的SPT系统1000的顶部示意图。真空隧道102被配置为在两个或更多个处理工具(例如,至少处理工具202a和202b)之间线性地延伸。与图6的SPT系统600一样,SPT系统1000不包含旋转台。
真空隧道102置于处理工具202a的装载锁定腔室210a、210b与EFEM 212之间,及处理工具202b的装载锁定腔室216a、216b与EFEM 218之间。使用EFEM212内的机器人或传送腔室208a内的机器人,将基板传送进入处理工具202a附近的真空隧道102。例如,传送腔室208a内的机器人通过延伸穿过装载锁定腔室210a或210b来于真空隧道102内拾取或放置基板。隔绝阀1002a至1002g允许在基板传送期间隔绝真空隧道102的部分,尤其是在EFEM 212与真空隧道102之间传送基板时,因为通常不在真空水平下操作EFEM 212。隔绝阀1002a至1002g防止真空隧道102和/或装载锁定腔室210a、210b的其余部分暴露于EFEM212内的大气压力环境。真空隧道102可相似地在处理工具202b附近配置有隔绝阀(未图示),以允许在真空隧道102、装载锁定腔室216a、216b和EFEM 218之间传送基板。
SPT系统1000的一个优点为:当在处理工具202a、202b之间移动时不采用旋转。另外,在一些实施方式中,由于在拾取和放置操作期间基板运输载具不延伸进入处理工具202a、202b,因此简化了基板运输载具106。相反地,EFEM212、218或传送腔室208a、214a内的机器人进入真空隧道102。进一步地,可使用真空隧道102使任何数量的处理工具互连。基板运输载具106不包含末端执行器(尽管可使用末端执行器)。
在一些实施方式中,装载锁定腔室210a、210b、216a、216b用于预热、冷却、计量、检查等,或以这样的腔室置换,因为真空隧道102有效地起到装载锁定腔室的作用。
在一些实施方式中,包含一个或多个辅助基板缓冲位置1004,且辅助基板缓冲位置被配置为存储基板。例如,采用隔绝阀1006将基板与真空隧道102隔绝。基板缓冲位置1004可与真空隧道102位于相同的平面中、垂直于真空隧道102、垂直定向等。
如上所述,提供了运输系统及SPT系统。SPT系统包含连接两个处理工具的运输系统。运输系统包含真空隧道,真空隧道被配置为在处理工具之间运输基板。真空隧道包含基板运输载具,以移动基板通过真空隧道。
SPT系统具有多种配置以允许用户根据期望的基板处理程序所需的处理腔室来增加或移除处理腔室。可包含一个或多个真空隧道,而允许了传送多个基板的可能性。带有制动系统的升降器单元在断电时防止了对SPT系统的基板和部件的损坏。
本领域技术人员将理解,前述范例是示例性的而非限制性的。意图对本领域技术人员而言,在阅读说明书和研究附图之后显而易见的所有排列、增强、等同和改进都包含在本公开内容的真实精神和范围内。因此,意图将以下所附权利要求包含符合这些教导的真实精神和范围内的所有此种修改、排列和同等内容。
Claims (14)
1.一种运输系统,包括:
真空隧道,所述真空隧道被配置为与第一处理工具和第二处理工具交界,所述真空隧道包括:
扩大区域;
基板运输载具,包括:
载具主体;和
末端执行器,所述末端执行器耦接至所述载具主体,所述末端执行器被配置为在运输期间在所述真空隧道内支撑基板,所述末端执行器被配置为延伸进入所述第一处理工具或所述第二处理工具以取出或放置基板,同时所述载具主体保持于所述真空隧道内;和
旋转台,所述旋转台设置于所述扩大区域中,所述旋转台被配置为在约0度及约180度之间旋转所述基板运输载具。
2.如权利要求1所述的运输系统,其中所述真空隧道进一步包括计量工具,其中所述计量工具被配置为对放置于所述末端执行器上的所述基板实行计量,同时所述基板运输载具位于所述扩大区域内。
3.如权利要求1所述的运输系统,进一步包括磁悬浮系统,所述磁悬浮系统被配置为悬浮所述基板运输载具且在所述第一处理工具与所述第二处理工具之间移动所述基板运输载具。
4.如权利要求1所述的运输系统,进一步包括:
第一升降器单元,所述第一升降器单元置于所述第一处理工具附近,以便允许所述基板运输载具在所述第一处理工具与所述真空隧道之间的运输;和
第二升降器单元,所述第二升降器单元置于所述第二处理工具附近,以便允许所述基板运输载具在所述第二处理工具与所述真空隧道之间的运输,
其中所述真空隧道置于所述第一处理工具和所述第二处理工具上方。
5.一种基板处理和运输(SPT)系统,包括:
第一处理工具和第二处理工具,每一者包括:
传送腔室,所述传送腔室被配置为耦接至一个或多个处理腔室;
装载锁定腔室,所述装载锁定腔室具有第一进出开口,所述第一进出开口被配置为从设备前端模块接收基板;
第二进出开口,所述第二进出开口被配置为传送基板至所述第一处理工具的所述传送腔室或从所述第一处理工具的所述传送腔室传送基板;和
第三进出开口;和
真空隧道,所述真空隧道在所述第一处理工具的所述第三进出开口和所述第二处理工具的所述第三进出开口之间耦接,所述真空隧道包括基板运输载具,所述基板运输载具包括:
载具主体;和
末端执行器,所述末端执行器耦接至所述载具主体,所述末端执行器被配置为在运输期间在所述真空隧道内支撑所述基板,且被配置为使用所述第一处理工具和所述第二处理工具的每一者的所述第三进出开口来延伸进入所述第一处理工具和所述第二处理工具的所述装载锁定腔室。
6.如权利要求5所述的SPT系统,所述真空隧道进一步包括第二旋转台。
7.如权利要求5所述的SPT系统,进一步包括磁悬浮系统,所述磁悬浮系统被配置为悬浮所述基板运输载具且在所述第一处理工具与所述第二处理工具之间移动所述基板运输载具。
8.如权利要求5所述的SPT系统,其中所述真空隧道进一步包括:
扩大区域,所述基板运输载具设置于所述扩大区域中;和
旋转台,所述旋转台设置于所述扩大区域中,所述旋转台被配置为在约0度及约180度之间旋转所述基板运输载具。
9.如权利要求8所述的SPT系统,进一步包括计量工具,相对于所述真空隧道放置所述计量工具,以便允许对放置于所述末端执行器上的所述基板计量,同时所述基板运输载具由所述旋转台来旋转。
10.一种运输系统,包括:
真空隧道,所述真空隧道被配置为在第一处理工具与第二处理工具之间延伸,其中放置所述真空隧道于所述第一处理工具和所述第二处理工具上方,所述真空隧道包括基板运输载具;
第一升降器单元,所述第一升降器单元置于所述第一处理工具附近,以便允许所述基板运输载具在所述第一处理工具与所述真空隧道之间的运输;
第二升降器单元,所述第二升降器单元置于所述第二处理工具附近,以便允许所述基板运输载具在所述第一处理工具与所述真空隧道之间的运输;和
紧急制动系统,所述紧急制动系统被配置为防止所述第一升降器单元和所述第二升降器单元内的基板运输载具系统在电力损耗期间掉落。
11.如权利要求11所述的运输系统,其中所述基板运输载具包括:
载具主体;和
末端执行器,所述末端执行器耦接至所述载具主体,所述末端执行器被配置为在运输期间在所述真空隧道内支撑基板。
12.如权利要求11所述的运输系统,其中所述真空隧道进一步包括:
扩大区域,所述基板运输载具设置于所述扩大区域中;和
旋转台,所述旋转台设置于所述扩大区域中,所述旋转台被配置为在约0度及约180度之间旋转所述基板运输载具。
13.如权利要求13所述的运输系统,其中所述真空隧道进一步包括计量工具,其中所述计量工具被配置为对放置于所述末端执行器上的基板实行计量,同时所述基板运输载具位于所述扩大区域内。
14.如权利要求11所述的运输系统,其中所述第一升降器单元和所述第二升降器单元的至少一者包含磁性升降机构。
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