JP7819759B2 - 量子デバイス及び量子デバイスの製造方法 - Google Patents

量子デバイス及び量子デバイスの製造方法

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Publication number
JP7819759B2
JP7819759B2 JP2024511130A JP2024511130A JP7819759B2 JP 7819759 B2 JP7819759 B2 JP 7819759B2 JP 2024511130 A JP2024511130 A JP 2024511130A JP 2024511130 A JP2024511130 A JP 2024511130A JP 7819759 B2 JP7819759 B2 JP 7819759B2
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Japan
Prior art keywords
substrate
quantum bit
quantum
substrates
pad
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JP2024511130A
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English (en)
Japanese (ja)
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JPWO2023188391A5 (https=
JPWO2023188391A1 (https=
Inventor
岳明 島内
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Fujitsu Ltd
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Fujitsu Ltd
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Publication of JPWO2023188391A5 publication Critical patent/JPWO2023188391A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Semiconductor Memories (AREA)
JP2024511130A 2022-03-31 2022-03-31 量子デバイス及び量子デバイスの製造方法 Active JP7819759B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/016879 WO2023188391A1 (ja) 2022-03-31 2022-03-31 量子デバイス及び量子デバイスの製造方法

Publications (3)

Publication Number Publication Date
JPWO2023188391A1 JPWO2023188391A1 (https=) 2023-10-05
JPWO2023188391A5 JPWO2023188391A5 (https=) 2024-12-09
JP7819759B2 true JP7819759B2 (ja) 2026-02-25

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JP2024511130A Active JP7819759B2 (ja) 2022-03-31 2022-03-31 量子デバイス及び量子デバイスの製造方法

Country Status (3)

Country Link
EP (1) EP4503904A4 (https=)
JP (1) JP7819759B2 (https=)
WO (1) WO2023188391A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025069381A1 (ja) * 2023-09-29 2025-04-03 富士通株式会社 量子デバイス
WO2025134388A1 (en) * 2023-12-22 2025-06-26 Riken Fabrication method for electric circuit device, and qubit device
JP2025112080A (ja) * 2024-01-18 2025-07-31 富士通株式会社 量子ビットデバイスの製造方法
WO2025211421A1 (ja) * 2024-04-03 2025-10-09 京セラ株式会社 構造体、量子プロセッサ、量子コンピュータ、及び構造体の製造方法
WO2025216276A1 (ja) * 2024-04-11 2025-10-16 京セラ株式会社 構造体、量子プロセッサ、量子コンピュータ、及び構造体の製造方法
JP2026051845A (ja) 2024-09-10 2026-03-23 富士通株式会社 量子ビットデバイス及び量子ビットデバイスの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180013052A1 (en) 2015-07-23 2018-01-11 Massachusetts Institute Of Technology Qubit and Coupler Circuit Structures and Coupling Techniques
JP2020511794A (ja) 2017-03-13 2020-04-16 グーグル エルエルシー 積層型量子コンピューティングデバイスにおける回路要素の集積
US20200343434A1 (en) 2019-04-29 2020-10-29 International Business Machines Corporation Through-silicon-via fabrication in planar quantum devices
JP2021504956A (ja) 2017-11-30 2021-02-15 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 共振器構造、共振器構造形成方法および共振器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10380496B2 (en) 2018-03-19 2019-08-13 Intel Corporation Quantum computing assemblies
JP7427914B2 (ja) 2019-10-30 2024-02-06 日本電気株式会社 超伝導回路装置、スペーサ、及び超伝導回路装置の製造方法
JP7133854B2 (ja) 2019-10-31 2022-09-09 国立研究開発法人科学技術振興機構 超伝導複合量子計算回路

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180013052A1 (en) 2015-07-23 2018-01-11 Massachusetts Institute Of Technology Qubit and Coupler Circuit Structures and Coupling Techniques
JP2020511794A (ja) 2017-03-13 2020-04-16 グーグル エルエルシー 積層型量子コンピューティングデバイスにおける回路要素の集積
JP2021504956A (ja) 2017-11-30 2021-02-15 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 共振器構造、共振器構造形成方法および共振器
US20200343434A1 (en) 2019-04-29 2020-10-29 International Business Machines Corporation Through-silicon-via fabrication in planar quantum devices

Also Published As

Publication number Publication date
WO2023188391A1 (ja) 2023-10-05
EP4503904A1 (en) 2025-02-05
EP4503904A4 (en) 2025-05-28
JPWO2023188391A1 (https=) 2023-10-05

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