JPWO2023188391A1 - - Google Patents
Info
- Publication number
- JPWO2023188391A1 JPWO2023188391A1 JP2024511130A JP2024511130A JPWO2023188391A1 JP WO2023188391 A1 JPWO2023188391 A1 JP WO2023188391A1 JP 2024511130 A JP2024511130 A JP 2024511130A JP 2024511130 A JP2024511130 A JP 2024511130A JP WO2023188391 A1 JPWO2023188391 A1 JP WO2023188391A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
- G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mathematical Analysis (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Computation (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computational Mathematics (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/016879 WO2023188391A1 (ja) | 2022-03-31 | 2022-03-31 | 量子デバイス及び量子デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023188391A1 true JPWO2023188391A1 (https=) | 2023-10-05 |
| JPWO2023188391A5 JPWO2023188391A5 (https=) | 2024-12-09 |
| JP7819759B2 JP7819759B2 (ja) | 2026-02-25 |
Family
ID=88200428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511130A Active JP7819759B2 (ja) | 2022-03-31 | 2022-03-31 | 量子デバイス及び量子デバイスの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4503904A4 (https=) |
| JP (1) | JP7819759B2 (https=) |
| WO (1) | WO2023188391A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025069381A1 (ja) * | 2023-09-29 | 2025-04-03 | 富士通株式会社 | 量子デバイス |
| WO2025134388A1 (en) * | 2023-12-22 | 2025-06-26 | Riken | Fabrication method for electric circuit device, and qubit device |
| JP2025112080A (ja) * | 2024-01-18 | 2025-07-31 | 富士通株式会社 | 量子ビットデバイスの製造方法 |
| WO2025211421A1 (ja) * | 2024-04-03 | 2025-10-09 | 京セラ株式会社 | 構造体、量子プロセッサ、量子コンピュータ、及び構造体の製造方法 |
| WO2025216276A1 (ja) * | 2024-04-11 | 2025-10-16 | 京セラ株式会社 | 構造体、量子プロセッサ、量子コンピュータ、及び構造体の製造方法 |
| JP2026051845A (ja) | 2024-09-10 | 2026-03-23 | 富士通株式会社 | 量子ビットデバイス及び量子ビットデバイスの製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180013052A1 (en) * | 2015-07-23 | 2018-01-11 | Massachusetts Institute Of Technology | Qubit and Coupler Circuit Structures and Coupling Techniques |
| JP2020511794A (ja) * | 2017-03-13 | 2020-04-16 | グーグル エルエルシー | 積層型量子コンピューティングデバイスにおける回路要素の集積 |
| US20200343434A1 (en) * | 2019-04-29 | 2020-10-29 | International Business Machines Corporation | Through-silicon-via fabrication in planar quantum devices |
| JP2021504956A (ja) * | 2017-11-30 | 2021-02-15 | インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ | 共振器構造、共振器構造形成方法および共振器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10380496B2 (en) | 2018-03-19 | 2019-08-13 | Intel Corporation | Quantum computing assemblies |
| JP7427914B2 (ja) | 2019-10-30 | 2024-02-06 | 日本電気株式会社 | 超伝導回路装置、スペーサ、及び超伝導回路装置の製造方法 |
| JP7133854B2 (ja) | 2019-10-31 | 2022-09-09 | 国立研究開発法人科学技術振興機構 | 超伝導複合量子計算回路 |
-
2022
- 2022-03-31 JP JP2024511130A patent/JP7819759B2/ja active Active
- 2022-03-31 WO PCT/JP2022/016879 patent/WO2023188391A1/ja not_active Ceased
- 2022-03-31 EP EP22935529.2A patent/EP4503904A4/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180013052A1 (en) * | 2015-07-23 | 2018-01-11 | Massachusetts Institute Of Technology | Qubit and Coupler Circuit Structures and Coupling Techniques |
| JP2020511794A (ja) * | 2017-03-13 | 2020-04-16 | グーグル エルエルシー | 積層型量子コンピューティングデバイスにおける回路要素の集積 |
| JP2021504956A (ja) * | 2017-11-30 | 2021-02-15 | インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ | 共振器構造、共振器構造形成方法および共振器 |
| US20200343434A1 (en) * | 2019-04-29 | 2020-10-29 | International Business Machines Corporation | Through-silicon-via fabrication in planar quantum devices |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023188391A1 (ja) | 2023-10-05 |
| JP7819759B2 (ja) | 2026-02-25 |
| EP4503904A1 (en) | 2025-02-05 |
| EP4503904A4 (en) | 2025-05-28 |
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