JP7810625B2 - 加熱処理装置 - Google Patents

加熱処理装置

Info

Publication number
JP7810625B2
JP7810625B2 JP2022156267A JP2022156267A JP7810625B2 JP 7810625 B2 JP7810625 B2 JP 7810625B2 JP 2022156267 A JP2022156267 A JP 2022156267A JP 2022156267 A JP2022156267 A JP 2022156267A JP 7810625 B2 JP7810625 B2 JP 7810625B2
Authority
JP
Japan
Prior art keywords
heater
plate
cassette
heaters
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022156267A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024049807A (ja
JP2024049807A5 (https=
Inventor
淳司 石原
明典 磯
浩一 増田
丈二 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2022156267A priority Critical patent/JP7810625B2/ja
Priority to CN202311016243.XA priority patent/CN117781689A/zh
Priority to KR1020230118322A priority patent/KR102850976B1/ko
Publication of JP2024049807A publication Critical patent/JP2024049807A/ja
Publication of JP2024049807A5 publication Critical patent/JP2024049807A5/ja
Priority to JP2025091869A priority patent/JP2025122208A/ja
Application granted granted Critical
Publication of JP7810625B2 publication Critical patent/JP7810625B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/62—Heating elements specially adapted for furnaces
    • H05B3/66—Supports or mountings for heaters on or in the wall or roof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022156267A 2022-09-29 2022-09-29 加熱処理装置 Active JP7810625B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022156267A JP7810625B2 (ja) 2022-09-29 2022-09-29 加熱処理装置
CN202311016243.XA CN117781689A (zh) 2022-09-29 2023-08-14 加热处理装置
KR1020230118322A KR102850976B1 (ko) 2022-09-29 2023-09-06 가열 처리 장치
JP2025091869A JP2025122208A (ja) 2022-09-29 2025-06-02 加熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022156267A JP7810625B2 (ja) 2022-09-29 2022-09-29 加熱処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025091869A Division JP2025122208A (ja) 2022-09-29 2025-06-02 加熱処理装置

Publications (3)

Publication Number Publication Date
JP2024049807A JP2024049807A (ja) 2024-04-10
JP2024049807A5 JP2024049807A5 (https=) 2024-08-06
JP7810625B2 true JP7810625B2 (ja) 2026-02-03

Family

ID=90384129

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022156267A Active JP7810625B2 (ja) 2022-09-29 2022-09-29 加熱処理装置
JP2025091869A Pending JP2025122208A (ja) 2022-09-29 2025-06-02 加熱処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025091869A Pending JP2025122208A (ja) 2022-09-29 2025-06-02 加熱処理装置

Country Status (3)

Country Link
JP (2) JP7810625B2 (https=)
KR (1) KR102850976B1 (https=)
CN (1) CN117781689A (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010054157A (ja) 2008-08-29 2010-03-11 Koyo Thermo System Kk ヒータユニットおよび熱処理装置
JP2019184229A (ja) 2018-04-16 2019-10-24 芝浦メカトロニクス株式会社 有機膜形成装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142082A (ja) * 1988-11-24 1990-05-31 Matsushita Electric Ind Co Ltd シーズヒーターの接地装置
JP3328763B2 (ja) * 1995-10-30 2002-09-30 エヌティティエレクトロニクス株式会社 縦型ウエハボートのウエハ支持構造
JP3312873B2 (ja) * 1998-07-01 2002-08-12 日本アビオニクス株式会社 減圧オーブンのヒータ装置
EP1976337A1 (en) * 2005-12-22 2008-10-01 Harison Toshiba Lighting Corp. Heater lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010054157A (ja) 2008-08-29 2010-03-11 Koyo Thermo System Kk ヒータユニットおよび熱処理装置
JP2019184229A (ja) 2018-04-16 2019-10-24 芝浦メカトロニクス株式会社 有機膜形成装置

Also Published As

Publication number Publication date
JP2024049807A (ja) 2024-04-10
KR102850976B1 (ko) 2025-08-26
CN117781689A (zh) 2024-03-29
JP2025122208A (ja) 2025-08-20
KR20240045100A (ko) 2024-04-05

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