CN117781689A - 加热处理装置 - Google Patents
加热处理装置 Download PDFInfo
- Publication number
- CN117781689A CN117781689A CN202311016243.XA CN202311016243A CN117781689A CN 117781689 A CN117781689 A CN 117781689A CN 202311016243 A CN202311016243 A CN 202311016243A CN 117781689 A CN117781689 A CN 117781689A
- Authority
- CN
- China
- Prior art keywords
- heater
- plate
- cassette
- chamber
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0436—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/66—Supports or mountings for heaters on or in the wall or roof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022156267A JP7810625B2 (ja) | 2022-09-29 | 2022-09-29 | 加熱処理装置 |
| JP2022-156267 | 2022-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117781689A true CN117781689A (zh) | 2024-03-29 |
Family
ID=90384129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311016243.XA Pending CN117781689A (zh) | 2022-09-29 | 2023-08-14 | 加热处理装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7810625B2 (https=) |
| KR (1) | KR102850976B1 (https=) |
| CN (1) | CN117781689A (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142082A (ja) * | 1988-11-24 | 1990-05-31 | Matsushita Electric Ind Co Ltd | シーズヒーターの接地装置 |
| JP3328763B2 (ja) * | 1995-10-30 | 2002-09-30 | エヌティティエレクトロニクス株式会社 | 縦型ウエハボートのウエハ支持構造 |
| JP3312873B2 (ja) * | 1998-07-01 | 2002-08-12 | 日本アビオニクス株式会社 | 減圧オーブンのヒータ装置 |
| EP1976337A1 (en) * | 2005-12-22 | 2008-10-01 | Harison Toshiba Lighting Corp. | Heater lamp |
| JP5467743B2 (ja) | 2008-08-29 | 2014-04-09 | 光洋サーモシステム株式会社 | ヒータユニットおよび熱処理装置 |
| JP6940541B2 (ja) | 2018-04-16 | 2021-09-29 | 芝浦メカトロニクス株式会社 | 有機膜形成装置 |
-
2022
- 2022-09-29 JP JP2022156267A patent/JP7810625B2/ja active Active
-
2023
- 2023-08-14 CN CN202311016243.XA patent/CN117781689A/zh active Pending
- 2023-09-06 KR KR1020230118322A patent/KR102850976B1/ko active Active
-
2025
- 2025-06-02 JP JP2025091869A patent/JP2025122208A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024049807A (ja) | 2024-04-10 |
| KR102850976B1 (ko) | 2025-08-26 |
| JP7810625B2 (ja) | 2026-02-03 |
| JP2025122208A (ja) | 2025-08-20 |
| KR20240045100A (ko) | 2024-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |