KR102850976B1 - 가열 처리 장치 - Google Patents
가열 처리 장치Info
- Publication number
- KR102850976B1 KR102850976B1 KR1020230118322A KR20230118322A KR102850976B1 KR 102850976 B1 KR102850976 B1 KR 102850976B1 KR 1020230118322 A KR1020230118322 A KR 1020230118322A KR 20230118322 A KR20230118322 A KR 20230118322A KR 102850976 B1 KR102850976 B1 KR 102850976B1
- Authority
- KR
- South Korea
- Prior art keywords
- heater
- plate
- cassette
- chamber
- central axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0436—Apparatus for thermal treatment mainly by radiation
-
- H01L21/67115—
-
- H01L21/68771—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/66—Supports or mountings for heaters on or in the wall or roof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
Landscapes
- Muffle Furnaces And Rotary Kilns (AREA)
- Furnace Details (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Furnace Charging Or Discharging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022156267A JP7810625B2 (ja) | 2022-09-29 | 2022-09-29 | 加熱処理装置 |
| JPJP-P-2022-156267 | 2022-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20240045100A KR20240045100A (ko) | 2024-04-05 |
| KR102850976B1 true KR102850976B1 (ko) | 2025-08-26 |
Family
ID=90384129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020230118322A Active KR102850976B1 (ko) | 2022-09-29 | 2023-09-06 | 가열 처리 장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7810625B2 (https=) |
| KR (1) | KR102850976B1 (https=) |
| CN (1) | CN117781689A (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022014A (ja) * | 1998-07-01 | 2000-01-21 | Nippon Avionics Co Ltd | 減圧オーブンのヒータ装置 |
| JP2019184229A (ja) | 2018-04-16 | 2019-10-24 | 芝浦メカトロニクス株式会社 | 有機膜形成装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142082A (ja) * | 1988-11-24 | 1990-05-31 | Matsushita Electric Ind Co Ltd | シーズヒーターの接地装置 |
| JP3328763B2 (ja) * | 1995-10-30 | 2002-09-30 | エヌティティエレクトロニクス株式会社 | 縦型ウエハボートのウエハ支持構造 |
| EP1976337A1 (en) * | 2005-12-22 | 2008-10-01 | Harison Toshiba Lighting Corp. | Heater lamp |
| JP5467743B2 (ja) | 2008-08-29 | 2014-04-09 | 光洋サーモシステム株式会社 | ヒータユニットおよび熱処理装置 |
-
2022
- 2022-09-29 JP JP2022156267A patent/JP7810625B2/ja active Active
-
2023
- 2023-08-14 CN CN202311016243.XA patent/CN117781689A/zh active Pending
- 2023-09-06 KR KR1020230118322A patent/KR102850976B1/ko active Active
-
2025
- 2025-06-02 JP JP2025091869A patent/JP2025122208A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022014A (ja) * | 1998-07-01 | 2000-01-21 | Nippon Avionics Co Ltd | 減圧オーブンのヒータ装置 |
| JP2019184229A (ja) | 2018-04-16 | 2019-10-24 | 芝浦メカトロニクス株式会社 | 有機膜形成装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024049807A (ja) | 2024-04-10 |
| JP7810625B2 (ja) | 2026-02-03 |
| CN117781689A (zh) | 2024-03-29 |
| JP2025122208A (ja) | 2025-08-20 |
| KR20240045100A (ko) | 2024-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| D22 | Grant of ip right intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| F11 | Ip right granted following substantive examination |
Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U11-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 1 |
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| PG1601 | Publication of registration |
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| Q13 | Ip right document published |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |