KR102850976B1 - 가열 처리 장치 - Google Patents

가열 처리 장치

Info

Publication number
KR102850976B1
KR102850976B1 KR1020230118322A KR20230118322A KR102850976B1 KR 102850976 B1 KR102850976 B1 KR 102850976B1 KR 1020230118322 A KR1020230118322 A KR 1020230118322A KR 20230118322 A KR20230118322 A KR 20230118322A KR 102850976 B1 KR102850976 B1 KR 102850976B1
Authority
KR
South Korea
Prior art keywords
heater
plate
cassette
chamber
central axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230118322A
Other languages
English (en)
Korean (ko)
Other versions
KR20240045100A (ko
Inventor
준지 이시하라
아키노리 이소
히로카즈 마스다
조지 후쿠다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20240045100A publication Critical patent/KR20240045100A/ko
Application granted granted Critical
Publication of KR102850976B1 publication Critical patent/KR102850976B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
    • H10P72/0436Apparatus for thermal treatment mainly by radiation
    • H01L21/67115
    • H01L21/68771
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/62Heating elements specially adapted for furnaces
    • H05B3/66Supports or mountings for heaters on or in the wall or roof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020230118322A 2022-09-29 2023-09-06 가열 처리 장치 Active KR102850976B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022156267A JP7810625B2 (ja) 2022-09-29 2022-09-29 加熱処理装置
JPJP-P-2022-156267 2022-09-29

Publications (2)

Publication Number Publication Date
KR20240045100A KR20240045100A (ko) 2024-04-05
KR102850976B1 true KR102850976B1 (ko) 2025-08-26

Family

ID=90384129

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230118322A Active KR102850976B1 (ko) 2022-09-29 2023-09-06 가열 처리 장치

Country Status (3)

Country Link
JP (2) JP7810625B2 (https=)
KR (1) KR102850976B1 (https=)
CN (1) CN117781689A (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022014A (ja) * 1998-07-01 2000-01-21 Nippon Avionics Co Ltd 減圧オーブンのヒータ装置
JP2019184229A (ja) 2018-04-16 2019-10-24 芝浦メカトロニクス株式会社 有機膜形成装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142082A (ja) * 1988-11-24 1990-05-31 Matsushita Electric Ind Co Ltd シーズヒーターの接地装置
JP3328763B2 (ja) * 1995-10-30 2002-09-30 エヌティティエレクトロニクス株式会社 縦型ウエハボートのウエハ支持構造
EP1976337A1 (en) * 2005-12-22 2008-10-01 Harison Toshiba Lighting Corp. Heater lamp
JP5467743B2 (ja) 2008-08-29 2014-04-09 光洋サーモシステム株式会社 ヒータユニットおよび熱処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022014A (ja) * 1998-07-01 2000-01-21 Nippon Avionics Co Ltd 減圧オーブンのヒータ装置
JP2019184229A (ja) 2018-04-16 2019-10-24 芝浦メカトロニクス株式会社 有機膜形成装置

Also Published As

Publication number Publication date
JP2024049807A (ja) 2024-04-10
JP7810625B2 (ja) 2026-02-03
CN117781689A (zh) 2024-03-29
JP2025122208A (ja) 2025-08-20
KR20240045100A (ko) 2024-04-05

Similar Documents

Publication Publication Date Title
JP6940541B2 (ja) 有機膜形成装置
US11906246B2 (en) Organic film forming apparatus
JP7565252B2 (ja) 加熱処理装置
KR102850976B1 (ko) 가열 처리 장치
CN110391132B (zh) 有机膜形成装置
KR20240124881A (ko) 가열 처리 장치, 반입 반출 지그 및 가열 처리 장치의 메인터넌스 방법
KR102913756B1 (ko) 가열 처리 장치
KR102913760B1 (ko) 가열 처리 장치
US12363801B2 (en) Heat treatment device
TWI823437B (zh) 加熱處理裝置
KR102791594B1 (ko) 유기막 형성 장치, 및 유기막 형성 장치의 클리닝 방법
KR102611238B1 (ko) 가열 처리 장치
JP7592560B2 (ja) 加熱処理装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U11-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000