JP7781577B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法

Info

Publication number
JP7781577B2
JP7781577B2 JP2021154588A JP2021154588A JP7781577B2 JP 7781577 B2 JP7781577 B2 JP 7781577B2 JP 2021154588 A JP2021154588 A JP 2021154588A JP 2021154588 A JP2021154588 A JP 2021154588A JP 7781577 B2 JP7781577 B2 JP 7781577B2
Authority
JP
Japan
Prior art keywords
liquid
nozzle
substrate
gas
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021154588A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023045958A5 (https=
JP2023045958A (ja
Inventor
美成子 犬飼
正敏 寺山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Priority to JP2021154588A priority Critical patent/JP7781577B2/ja
Priority to TW114110793A priority patent/TWI912175B/zh
Priority to TW111103056A priority patent/TWI850623B/zh
Priority to TW113125968A priority patent/TWI893895B/zh
Priority to CN202210159690.XA priority patent/CN115889281A/zh
Priority to US17/695,512 priority patent/US11833550B2/en
Publication of JP2023045958A publication Critical patent/JP2023045958A/ja
Priority to US18/496,222 priority patent/US12172194B2/en
Publication of JP2023045958A5 publication Critical patent/JP2023045958A5/ja
Application granted granted Critical
Publication of JP7781577B2 publication Critical patent/JP7781577B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP2021154588A 2021-09-22 2021-09-22 基板処理装置及び基板処理方法 Active JP7781577B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2021154588A JP7781577B2 (ja) 2021-09-22 2021-09-22 基板処理装置及び基板処理方法
TW111103056A TWI850623B (zh) 2021-09-22 2022-01-25 基板處理裝置及基板處理方法
TW113125968A TWI893895B (zh) 2021-09-22 2022-01-25 基板處理裝置
TW114110793A TWI912175B (zh) 2021-09-22 2022-01-25 基板處理裝置
CN202210159690.XA CN115889281A (zh) 2021-09-22 2022-02-22 基板处理装置以及基板处理方法
US17/695,512 US11833550B2 (en) 2021-09-22 2022-03-15 Substrate processing apparatus and substrate processing method
US18/496,222 US12172194B2 (en) 2021-09-22 2023-10-27 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021154588A JP7781577B2 (ja) 2021-09-22 2021-09-22 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2023045958A JP2023045958A (ja) 2023-04-03
JP2023045958A5 JP2023045958A5 (https=) 2024-10-02
JP7781577B2 true JP7781577B2 (ja) 2025-12-08

Family

ID=85571568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021154588A Active JP7781577B2 (ja) 2021-09-22 2021-09-22 基板処理装置及び基板処理方法

Country Status (4)

Country Link
US (2) US11833550B2 (https=)
JP (1) JP7781577B2 (https=)
CN (1) CN115889281A (https=)
TW (3) TWI893895B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7470785B2 (ja) * 2020-05-15 2024-04-18 株式会社荏原製作所 洗浄装置および洗浄方法
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法
US20250085053A1 (en) * 2023-08-24 2025-03-13 Tokyo Electron Limited Flow stability control in drying liquid between plates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009252855A (ja) 2008-04-03 2009-10-29 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置及び記憶媒体
JP2015023182A (ja) 2013-07-19 2015-02-02 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
JP2015133347A (ja) 2014-01-09 2015-07-23 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、及びコンピュータ読み取り可能な記録媒体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322853B2 (ja) 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
JP2004335542A (ja) * 2003-04-30 2004-11-25 Toshiba Corp 基板洗浄方法及び基板乾燥方法
JP4324527B2 (ja) 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP5538102B2 (ja) 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
CN104425321B (zh) * 2013-08-30 2017-09-29 细美事有限公司 基板处理装置以及方法、包括该装置的基板处理系统
JP5994804B2 (ja) * 2014-03-17 2016-09-21 東京エレクトロン株式会社 基板洗浄方法
JP6386769B2 (ja) 2014-04-16 2018-09-05 株式会社荏原製作所 基板乾燥装置、制御プログラム、及び基板乾燥方法
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6817748B2 (ja) * 2016-08-24 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6938248B2 (ja) * 2017-07-04 2021-09-22 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2020141052A (ja) * 2019-02-28 2020-09-03 株式会社荏原製作所 基板処理装置、半導体製造装置、および基板処理方法
JP7194645B2 (ja) * 2019-05-31 2022-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2021020136A1 (ja) * 2019-07-26 2021-02-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
JP7341825B2 (ja) * 2019-09-27 2023-09-11 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009252855A (ja) 2008-04-03 2009-10-29 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置及び記憶媒体
JP2015023182A (ja) 2013-07-19 2015-02-02 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
JP2015133347A (ja) 2014-01-09 2015-07-23 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、及びコンピュータ読み取り可能な記録媒体

Also Published As

Publication number Publication date
TW202314899A (zh) 2023-04-01
CN115889281A (zh) 2023-04-04
TW202529232A (zh) 2025-07-16
US20240058847A1 (en) 2024-02-22
US12172194B2 (en) 2024-12-24
TWI912175B (zh) 2026-01-11
TW202443757A (zh) 2024-11-01
JP2023045958A (ja) 2023-04-03
TWI850623B (zh) 2024-08-01
US20230090997A1 (en) 2023-03-23
US11833550B2 (en) 2023-12-05
TWI893895B (zh) 2025-08-11

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