JP7765605B2 - 仮固定用組成物 - Google Patents

仮固定用組成物

Info

Publication number
JP7765605B2
JP7765605B2 JP2024509802A JP2024509802A JP7765605B2 JP 7765605 B2 JP7765605 B2 JP 7765605B2 JP 2024509802 A JP2024509802 A JP 2024509802A JP 2024509802 A JP2024509802 A JP 2024509802A JP 7765605 B2 JP7765605 B2 JP 7765605B2
Authority
JP
Japan
Prior art keywords
meth
acrylate
mass
temporary fixing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024509802A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023181635A1 (https=
JPWO2023181635A5 (https=
Inventor
拓充 馬場
貴子 谷川（星野）
翔太 山本
留智 内田（濱口）
準 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023181635A1 publication Critical patent/JPWO2023181635A1/ja
Publication of JPWO2023181635A5 publication Critical patent/JPWO2023181635A5/ja
Application granted granted Critical
Publication of JP7765605B2 publication Critical patent/JP7765605B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/302—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and two or more oxygen atoms in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C08F290/126—Polymers of unsaturated carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/132—Phenols containing keto groups, e.g. benzophenones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polymerization Catalysts (AREA)
JP2024509802A 2022-03-24 2023-01-27 仮固定用組成物 Active JP7765605B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022048913 2022-03-24
JP2022048913 2022-03-24
PCT/JP2023/002751 WO2023181635A1 (ja) 2022-03-24 2023-01-27 仮固定用組成物

Publications (3)

Publication Number Publication Date
JPWO2023181635A1 JPWO2023181635A1 (https=) 2023-09-28
JPWO2023181635A5 JPWO2023181635A5 (https=) 2024-09-18
JP7765605B2 true JP7765605B2 (ja) 2025-11-06

Family

ID=88100990

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2024509802A Active JP7765605B2 (ja) 2022-03-24 2023-01-27 仮固定用組成物
JP2024509810A Active JP7629143B2 (ja) 2022-03-24 2023-01-31 仮固定用組成物、仮固定用接着剤、及び薄型ウエハの製造方法
JP2024121253A Pending JP2024144632A (ja) 2022-03-24 2024-07-26 仮固定用組成物、仮固定用接着剤、及び薄型ウエハの製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024509810A Active JP7629143B2 (ja) 2022-03-24 2023-01-31 仮固定用組成物、仮固定用接着剤、及び薄型ウエハの製造方法
JP2024121253A Pending JP2024144632A (ja) 2022-03-24 2024-07-26 仮固定用組成物、仮固定用接着剤、及び薄型ウエハの製造方法

Country Status (5)

Country Link
JP (3) JP7765605B2 (https=)
KR (1) KR20240129029A (https=)
CN (1) CN118804961A (https=)
TW (2) TWI872445B (https=)
WO (2) WO2023181635A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024162057A1 (ja) * 2023-01-31 2024-08-08 デンカ株式会社 組成物
JPWO2024162049A1 (https=) * 2023-01-31 2024-08-08
CN120641516A (zh) * 2023-01-31 2025-09-12 电化株式会社 临时固定用组合物、临时固定用粘接剂以及薄型晶片的制造方法
JP2025150191A (ja) * 2024-03-27 2025-10-09 デンカ株式会社 仮固定用組成物およびウエハの製造方法
WO2025263391A1 (ja) * 2024-06-20 2025-12-26 デンカ株式会社 仮固定用組成物およびウエハの製造方法
KR102851651B1 (ko) * 2024-12-05 2025-08-28 솔루스첨단소재 주식회사 광경화성 아크릴 수지 조성물 및 이의 경화물

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119262A (ja) 1998-10-14 2000-04-25 Otsuka Chem Co Ltd ビスベンゾトリアゾリルフェノール化合物、紫外線吸収剤、紫外線吸収性ポリマー、これらを含有した樹脂組成物及び被覆材料
JP2002510862A (ja) 1998-03-30 2002-04-09 ミネソタ マイニング アンド マニュファクチャリング カンパニー 半導体ウェハ加工テープ
JP2006522839A (ja) 2003-02-20 2006-10-05 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 光硬化性組成物
JP2014101495A (ja) 2012-10-25 2014-06-05 Central Glass Co Ltd 接着性組成物およびその接着方法、および接着後の剥離方法
JP2018001604A (ja) 2016-07-01 2018-01-11 東京応化工業株式会社 積層体、その製造方法、電子部品の製造方法、及び積層体において分離層と基板との接着性を向上させる方法
WO2022230874A1 (ja) 2021-04-26 2022-11-03 デンカ株式会社 組成物
JP2023008789A (ja) 2021-07-02 2023-01-19 日鉄ケミカル＆マテリアル株式会社 接着剤層形成用組成物、積層体、積層体の製造方法および積層体の処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177094A (ja) * 1992-12-10 1994-06-24 Mitsui Toatsu Chem Inc ウエハ裏面研削用テープおよびその使用方法
US6887917B2 (en) * 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
KR101666479B1 (ko) * 2013-08-27 2016-10-14 서울대학교산학협력단 벤조트리아졸계 (메트)아크릴레이트 공중합체 및 이를 포함하는 접착제 조성물
WO2021235406A1 (ja) 2020-05-21 2021-11-25 デンカ株式会社 組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002510862A (ja) 1998-03-30 2002-04-09 ミネソタ マイニング アンド マニュファクチャリング カンパニー 半導体ウェハ加工テープ
JP2000119262A (ja) 1998-10-14 2000-04-25 Otsuka Chem Co Ltd ビスベンゾトリアゾリルフェノール化合物、紫外線吸収剤、紫外線吸収性ポリマー、これらを含有した樹脂組成物及び被覆材料
JP2006522839A (ja) 2003-02-20 2006-10-05 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 光硬化性組成物
JP2014101495A (ja) 2012-10-25 2014-06-05 Central Glass Co Ltd 接着性組成物およびその接着方法、および接着後の剥離方法
JP2018001604A (ja) 2016-07-01 2018-01-11 東京応化工業株式会社 積層体、その製造方法、電子部品の製造方法、及び積層体において分離層と基板との接着性を向上させる方法
WO2022230874A1 (ja) 2021-04-26 2022-11-03 デンカ株式会社 組成物
JP2023008789A (ja) 2021-07-02 2023-01-19 日鉄ケミカル＆マテリアル株式会社 接着剤層形成用組成物、積層体、積層体の製造方法および積層体の処理方法

Also Published As

Publication number Publication date
WO2023181635A1 (ja) 2023-09-28
KR20240129029A (ko) 2024-08-27
WO2023181648A1 (ja) 2023-09-28
JP7629143B2 (ja) 2025-02-12
CN118804961A (zh) 2024-10-18
JP2024144632A (ja) 2024-10-11
JPWO2023181635A1 (https=) 2023-09-28
TWI872445B (zh) 2025-02-11
TW202338042A (zh) 2023-10-01
JPWO2023181648A1 (https=) 2023-09-28
TW202337884A (zh) 2023-10-01

Similar Documents

Publication Publication Date Title
JP7765605B2 (ja) 仮固定用組成物
JP7522188B2 (ja) 組成物
JP7717769B2 (ja) 組成物
JP7638439B2 (ja) 仮固定用組成物
WO2024162059A1 (ja) 気泡の残留を抑制する仮固定用の組成物
WO2024162049A1 (ja) 仮固定用の組成物
TW202446912A (zh) 組合物
JP7628657B2 (ja) 仮固定用組成物、仮固定用接着剤、及び薄型ウエハの製造方法
JP7587731B1 (ja) 複数の薄型ウエハの製造方法
WO2024162053A1 (ja) 仮固定用組成物、仮固定用接着剤、及び薄型ウエハの製造方法
WO2025205455A1 (ja) 仮固定用組成物およびウエハの製造方法
JP2025150195A (ja) ウエハの製造方法および仮固定用組成物の硬化膜の除去方法
JP2025078847A (ja) 仮固定用組成物
WO2025192625A1 (ja) 組成物、仮固定用組成物、及びこれを用いたウエハの製造方法
WO2024190671A1 (ja) 板状基材の加工方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240703

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240703

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250714

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250819

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250924

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251007

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251024

R150 Certificate of patent or registration of utility model

Ref document number: 7765605

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150