JP7761380B2 - 樹脂組成物 - Google Patents

樹脂組成物

Info

Publication number
JP7761380B2
JP7761380B2 JP2020168490A JP2020168490A JP7761380B2 JP 7761380 B2 JP7761380 B2 JP 7761380B2 JP 2020168490 A JP2020168490 A JP 2020168490A JP 2020168490 A JP2020168490 A JP 2020168490A JP 7761380 B2 JP7761380 B2 JP 7761380B2
Authority
JP
Japan
Prior art keywords
resin composition
group
mass
resin
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020168490A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022060800A (ja
Inventor
一彦 鶴井
大地 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2020168490A priority Critical patent/JP7761380B2/ja
Priority to TW110131414A priority patent/TWI893194B/zh
Priority to CN202111152928.8A priority patent/CN114381120A/zh
Priority to KR1020210130904A priority patent/KR20220045561A/ko
Publication of JP2022060800A publication Critical patent/JP2022060800A/ja
Priority to JP2024032151A priority patent/JP2024052953A/ja
Application granted granted Critical
Publication of JP7761380B2 publication Critical patent/JP7761380B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020168490A 2020-10-05 2020-10-05 樹脂組成物 Active JP7761380B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020168490A JP7761380B2 (ja) 2020-10-05 2020-10-05 樹脂組成物
TW110131414A TWI893194B (zh) 2020-10-05 2021-08-25 樹脂組成物
CN202111152928.8A CN114381120A (zh) 2020-10-05 2021-09-29 树脂组合物
KR1020210130904A KR20220045561A (ko) 2020-10-05 2021-10-01 수지 조성물
JP2024032151A JP2024052953A (ja) 2020-10-05 2024-03-04 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020168490A JP7761380B2 (ja) 2020-10-05 2020-10-05 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024032151A Division JP2024052953A (ja) 2020-10-05 2024-03-04 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2022060800A JP2022060800A (ja) 2022-04-15
JP7761380B2 true JP7761380B2 (ja) 2025-10-28

Family

ID=81125117

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020168490A Active JP7761380B2 (ja) 2020-10-05 2020-10-05 樹脂組成物
JP2024032151A Pending JP2024052953A (ja) 2020-10-05 2024-03-04 樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024032151A Pending JP2024052953A (ja) 2020-10-05 2024-03-04 樹脂組成物

Country Status (4)

Country Link
JP (2) JP7761380B2 (enExample)
KR (1) KR20220045561A (enExample)
CN (1) CN114381120A (enExample)
TW (1) TWI893194B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7583832B2 (ja) * 2020-12-17 2024-11-14 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途
TW202442045A (zh) 2023-03-24 2024-10-16 日商味之素股份有限公司 印刷配線板及其製造方法
JP7761024B2 (ja) * 2023-06-20 2025-10-28 味の素株式会社 樹脂組成物
JP2025019459A (ja) 2023-07-28 2025-02-07 味の素株式会社 樹脂組成物
JP2025156052A (ja) 2024-03-27 2025-10-14 味の素株式会社 樹脂組成物
JP2025156053A (ja) 2024-03-27 2025-10-14 味の素株式会社 樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013197441A (ja) 2012-03-22 2013-09-30 Toray Ind Inc 硬化物層付き回路基板の製造方法
JP2017145289A (ja) 2016-02-16 2017-08-24 東レ株式会社 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
JP2018184595A (ja) 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009040934A (ja) * 2007-08-10 2009-02-26 Nippon Steel Chem Co Ltd 硬化性樹脂組成物
JP5444986B2 (ja) * 2009-09-16 2014-03-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置
CN103509329B (zh) * 2012-06-28 2016-01-20 中山台光电子材料有限公司 低介电树脂组成物及应用其的铜箔基板及印刷电路板
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
CN105745274B (zh) * 2013-11-27 2018-06-29 东丽株式会社 半导体用树脂组合物及半导体用树脂膜以及使用了它们的半导体器件
TWI519602B (zh) * 2014-06-06 2016-02-01 Elite Material Co Ltd Low dielectric resin composition and the application of its resin film, semi-cured film and circuit board
JP6651760B2 (ja) 2015-09-18 2020-02-19 味の素株式会社 プリント配線板の製造方法
CN108727942A (zh) * 2017-04-24 2018-11-02 味之素株式会社 树脂组合物
JP7119290B2 (ja) * 2017-05-30 2022-08-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
CN112469750A (zh) * 2018-09-19 2021-03-09 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013197441A (ja) 2012-03-22 2013-09-30 Toray Ind Inc 硬化物層付き回路基板の製造方法
JP2017145289A (ja) 2016-02-16 2017-08-24 東レ株式会社 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
JP2018184595A (ja) 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
TW202216895A (zh) 2022-05-01
TWI893194B (zh) 2025-08-11
JP2022060800A (ja) 2022-04-15
CN114381120A (zh) 2022-04-22
KR20220045561A (ko) 2022-04-12
JP2024052953A (ja) 2024-04-12

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