JP7759479B2 - 積層セラミック電子部品および組立体 - Google Patents

積層セラミック電子部品および組立体

Info

Publication number
JP7759479B2
JP7759479B2 JP2024511040A JP2024511040A JP7759479B2 JP 7759479 B2 JP7759479 B2 JP 7759479B2 JP 2024511040 A JP2024511040 A JP 2024511040A JP 2024511040 A JP2024511040 A JP 2024511040A JP 7759479 B2 JP7759479 B2 JP 7759479B2
Authority
JP
Japan
Prior art keywords
electrode layer
electronic component
multilayer ceramic
ceramic electronic
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024511040A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023188282A1 (https=
JPWO2023188282A5 (https=
Inventor
瑛文 森下
朝彦 日比野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2023188282A1 publication Critical patent/JPWO2023188282A1/ja
Publication of JPWO2023188282A5 publication Critical patent/JPWO2023188282A5/ja
Application granted granted Critical
Publication of JP7759479B2 publication Critical patent/JP7759479B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/206Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Capacitors (AREA)
JP2024511040A 2022-03-31 2022-03-31 積層セラミック電子部品および組立体 Active JP7759479B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/016553 WO2023188282A1 (ja) 2022-03-31 2022-03-31 積層セラミック電子部品および組立体

Publications (3)

Publication Number Publication Date
JPWO2023188282A1 JPWO2023188282A1 (https=) 2023-10-05
JPWO2023188282A5 JPWO2023188282A5 (https=) 2024-11-14
JP7759479B2 true JP7759479B2 (ja) 2025-10-23

Family

ID=88199856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511040A Active JP7759479B2 (ja) 2022-03-31 2022-03-31 積層セラミック電子部品および組立体

Country Status (3)

Country Link
US (1) US20250017114A1 (https=)
JP (1) JP7759479B2 (https=)
WO (1) WO2023188282A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165372A (ja) 2005-12-09 2007-06-28 Fujifilm Corp 積層構造体及びその製造方法
WO2019132368A1 (ko) 2017-12-29 2019-07-04 삼성전자 주식회사 스피커용 압전 소자 및 그의 제조 방법
US20200020844A1 (en) 2018-07-10 2020-01-16 Ngk Insulators, Ltd. Laminated ceramic electronic component and electronic component assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2505024Y2 (ja) * 1989-11-15 1996-07-24 日本電気株式会社 積層セラミック電歪素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165372A (ja) 2005-12-09 2007-06-28 Fujifilm Corp 積層構造体及びその製造方法
WO2019132368A1 (ko) 2017-12-29 2019-07-04 삼성전자 주식회사 스피커용 압전 소자 및 그의 제조 방법
US20210376220A1 (en) 2017-12-29 2021-12-02 Samsung Electronics Co., Ltd. Piezoelectric element for speaker and manufacturing method therefor
US20200020844A1 (en) 2018-07-10 2020-01-16 Ngk Insulators, Ltd. Laminated ceramic electronic component and electronic component assembly
JP2020009949A (ja) 2018-07-10 2020-01-16 日本碍子株式会社 積層セラミック電子部品および電子部品組立体

Also Published As

Publication number Publication date
JPWO2023188282A1 (https=) 2023-10-05
WO2023188282A1 (ja) 2023-10-05
US20250017114A1 (en) 2025-01-09

Similar Documents

Publication Publication Date Title
JP4450084B2 (ja) 積層コンデンサ及び積層コンデンサの実装構造
JP4475338B2 (ja) 積層コンデンサ
JP5170066B2 (ja) 積層コンデンサ
JP7759479B2 (ja) 積層セラミック電子部品および組立体
JP2011049490A (ja) 積層コンデンサ
CN116058110A (zh) 压电元件
CN111770797B (zh) 振动器件及压电元件
JP4837275B2 (ja) 積層型コンデンサの実装構造
JPWO2023188282A5 (https=)
JP2023144819A (ja) 電子部品
JP2000058325A (ja) セラミック電子部品
US20250299878A1 (en) Coil component and method of manufacturing the same
CN115116696B (zh) 层叠型电感器
CN115116697B (zh) 层叠线圈部件
JP2002314160A (ja) 積層型圧電トランス
JP3057968B2 (ja) 積層型圧電体素子
JP7628038B2 (ja) 積層コイル部品
JP7251089B2 (ja) 積層コンデンサ
WO2023209793A1 (ja) 半導体装置
JP4529427B2 (ja) 積層型圧電素子
JP5170065B2 (ja) 積層コンデンサ
JPWO2023149279A5 (https=)
JPH0534123Y2 (https=)
JPH0644101U (ja) チップ型正特性サーミスタ素子
JP3006357B2 (ja) 積層型圧電体素子の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240909

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240909

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250818

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250916

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251010

R150 Certificate of patent or registration of utility model

Ref document number: 7759479

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150