JPWO2023188282A1 - - Google Patents
Info
- Publication number
- JPWO2023188282A1 JPWO2023188282A1 JP2024511040A JP2024511040A JPWO2023188282A1 JP WO2023188282 A1 JPWO2023188282 A1 JP WO2023188282A1 JP 2024511040 A JP2024511040 A JP 2024511040A JP 2024511040 A JP2024511040 A JP 2024511040A JP WO2023188282 A1 JPWO2023188282 A1 JP WO2023188282A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/016553 WO2023188282A1 (ja) | 2022-03-31 | 2022-03-31 | 積層セラミック電子部品および組立体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023188282A1 true JPWO2023188282A1 (https=) | 2023-10-05 |
| JPWO2023188282A5 JPWO2023188282A5 (https=) | 2024-11-14 |
| JP7759479B2 JP7759479B2 (ja) | 2025-10-23 |
Family
ID=88199856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511040A Active JP7759479B2 (ja) | 2022-03-31 | 2022-03-31 | 積層セラミック電子部品および組立体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250017114A1 (https=) |
| JP (1) | JP7759479B2 (https=) |
| WO (1) | WO2023188282A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371667U (https=) * | 1989-11-15 | 1991-07-19 | ||
| JP2007165372A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 積層構造体及びその製造方法 |
| WO2019132368A1 (ko) * | 2017-12-29 | 2019-07-04 | 삼성전자 주식회사 | 스피커용 압전 소자 및 그의 제조 방법 |
| US20200020844A1 (en) * | 2018-07-10 | 2020-01-16 | Ngk Insulators, Ltd. | Laminated ceramic electronic component and electronic component assembly |
-
2022
- 2022-03-31 JP JP2024511040A patent/JP7759479B2/ja active Active
- 2022-03-31 WO PCT/JP2022/016553 patent/WO2023188282A1/ja not_active Ceased
-
2024
- 2024-09-20 US US18/890,823 patent/US20250017114A1/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371667U (https=) * | 1989-11-15 | 1991-07-19 | ||
| JP2007165372A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 積層構造体及びその製造方法 |
| WO2019132368A1 (ko) * | 2017-12-29 | 2019-07-04 | 삼성전자 주식회사 | 스피커용 압전 소자 및 그의 제조 방법 |
| EP3699968A1 (en) * | 2017-12-29 | 2020-08-26 | Samsung Electronics Co., Ltd. | Piezoelectric element for speaker and manufacturing method therefor |
| US20210376220A1 (en) * | 2017-12-29 | 2021-12-02 | Samsung Electronics Co., Ltd. | Piezoelectric element for speaker and manufacturing method therefor |
| US20200020844A1 (en) * | 2018-07-10 | 2020-01-16 | Ngk Insulators, Ltd. | Laminated ceramic electronic component and electronic component assembly |
| JP2020009949A (ja) * | 2018-07-10 | 2020-01-16 | 日本碍子株式会社 | 積層セラミック電子部品および電子部品組立体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7759479B2 (ja) | 2025-10-23 |
| WO2023188282A1 (ja) | 2023-10-05 |
| US20250017114A1 (en) | 2025-01-09 |
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